Memory access techniques in memory devices with multiple partitions
Methods, systems, and devices for operating a memory array are described. A memory controller may be configured to provide enhanced bandwidth on a command/address (C/A) bus, which may have a relatively low pin count, through use of a next partition command that may repeat an array command from a current partition at a different partition indicated by the next partition command. Such a next partition command may use fewer clock cycles than a command that includes a complete instruction and memory location information.
1. A memory device, comprising:
a first memory partition including a first plurality of memory locations;
a second memory partition including a second plurality of memory locations; and
an operation instruction decoder configured to decode a received instruction as a next partition command to perform a memory access at a same memory location of the second memory partition as a previous memory location of a previous memory access of the first memory partition, wherein:
the operation instruction decoder decodes an initial received instruction that includes a first memory address for the previous memory location of the first memory partition, a first memory partition identification, and a function to be performed;
the memory device comprises a 3D cross-point (3D XP) memory array;
the initial received instruction comprises:
a first plurality of bits identifying the first memory address at a first storage plane within the first memory partition of the 3D XP memory array,
a second plurality of bits identifying a second memory address at a second storage plane within the first memory partition of the 3D XP memory array, and
a third plurality of bits indicating the function; and
the next partition command comprises a fourth plurality of bits indicating that the first memory address, second memory address, and function are to be applied at the second memory partition of the 3D XP memory array.
2. The memory device of claim 1 , wherein a first number of clock cycles to receive the initial received instruction is greater than a second number of clock cycles to receive the next partition command.
3. The memory device of claim 2 , wherein the first number of clock cycles is eight clock cycles, and the second number of clock cycles is two clock cycles.
4. The memory device of claim 1 , wherein the memory device comprises a memory array that is selected from a group consisting of dynamic random access memory (DRAM), non-volatile random access memory (NVRAM), read only memory (ROM), and 3D cross-point (3D XP) memory.
5. The memory device of claim 1 , wherein the next partition command comprises a partition address of the second memory partition.
6. The memory device of claim 1 , wherein the operation instruction decoder is further configured to decode an initial received instruction that includes at least one of a first memory address for the previous memory location of the first memory partition, a first memory partition identification, or a function to be performed.