LED package and method of manufacturing the same
A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.
1. A method of manufacturing a light emitting diode package base comprising:
providing a metal core substrate having a top surface, a bottom surface, and side surfaces;
forming two first trenches in the metal core substrate, the first trenches extending from the top surface to the bottom surface;
at least partially filling the first trenches with a first dielectric material to form dielectric isolations, the dielectric isolations dividing the metal core substrate into three metal core portions, wherein two of the metal core portions serve as the light emitting diode package electrodes, and wherein each outer portion of the light emitting diode package electrodes is one of the side surfaces of the metal core substrate;
applying a second dielectric material to cover at least a portion of the first dielectric material;
forming a first conductive layer over the second dielectric material to form circuit contacts, the first conductive layer including a first conductive material;
forming second trenches extending from top surface of the conductive layer to the top surface of the metal core substrate; and
partially filling the second trenches with a second conductive material to form conductive trenches.
2. The method of claim 1 , further comprising forming the second trenches by one of mechanical carving, mechanical punch, chemical etching, or laser carving.
3. The method of claim 1 , further comprising forming the conductive trenches by one of metal plating, metal sputtering deposition, or metal liquid deposition.
4. The method of claim 1 , forming second trenches further comprising forming a thermal projection trench by one of mechanical carving, mechanical punch, chemical etching, or laser carving.
5. The method of claim 4 , further comprising forming the thermal projection by filling the thermal projection trench with a second conductive material by one of metal plating, metal sputtering deposition, or metal liquid deposition techniques.
6. The method of claim 1 , further comprising applying one of mechanical carving, mechanical punch, chemical etching, or laser carving to form the first trenches.
7. The method of claim 1 , further comprising applying the second dielectric material to cover at least a portion of the top surface of the metal core substrate.
8. The method of claim 5 , further comprising removing the first conductive layer around the thermal projection to isolate it from the circuit contacts.
9. The method of claim 8 , wherein removing the first conductive layer around the thermal projection comprises applying one of mechanical carving, mechanical punch, chemical etching or laser carving techniques.