IP Library Granted Patent US 9,735,354
Granted Patent B2
US 9,735,354 · App. 15/153,293 · Granted Aug 15, 2017

Forming resistive random access memories together with fuse arrays

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Quick Facts
Patent No.
US 9,735,354
App. No.
15/153,293
Granted
Aug 15, 2017
Kind
B2
Abstract

A resistive random access memory array may be formed on the same substrate with a fuse array. The random access memory and the fuse array may use the same active material. For example, both the fuse array and the memory array may use a chalcogenide material as the active switching material. The main array may use a pattern of perpendicular sets of trench isolations and the fuse array may only use one set of parallel trench isolations. As a result, the fuse array may have a conductive line extending continuously between adjacent trench isolations. In some embodiments, this continuous line may reduce the resistance of the conductive path through the fuses.

Claims (31)

1. An apparatus, comprising:

an array of resistive memory elements formed on a substrate, wherein the array includes first and second sets of parallel trenches, and wherein the second set of parallel trenches is orthogonal to the first set of parallel trenches; and

a fuse array formed on the substrate, wherein the fuse array includes a third set of parallel trenches and a continuous wordline configured to drive one or more cells of the fuse array.

2. The apparatus of claim 1 , wherein the first set of parallel trenches is shallower than the second set of parallel trenches.

3. The apparatus of claim 1 , wherein the one or more cells of the fuse array are programmable by a reverse bias current.

4. The apparatus of claim 3 , wherein the reverse bias current causes destructive failure of the one or more cells in the fuse array.

5. The apparatus of claim 1 , wherein the third set of trenches define a plurality of address lines of the fuse array; and

each cell of the one or more cells of the fuse array corresponds to an address line of the plurality of address lines.

6. The apparatus of claim 1 , wherein each cell of the one or more cells of the fuse array comprises a singulated heater.

7. The apparatus of claim 1 , wherein the array of resistive memory elements and the fuse array are formed on a common die.

8. An apparatus comprising:

a chalcogenide memory array formed on a substrate and having a first set of trenches and a second set of trenches orthogonal to the first set of trenches;

a fuse array formed on the substrate and having continuous wordlines configured to drive one or more cells of the fuse array.

9. The apparatus of claim 8 , wherein the first set of trenches are deeper than the second set of trenches.

10. The apparatus of claim 8 , wherein the one or more cells of the fuse array each comprise a fuse contact.

11. The apparatus of claim 8 , wherein the continuous wordlines are configured to reduce parasitic resistance in the fuse array.

12. The apparatus of claim 8 , wherein the fuse array is programmable by applying a reverse biased current to the one or more cells of the fuse array.

13. The apparatus of claim 8 , wherein the fuse array further comprises a third set of trenches defining the continuous wordlines.

14. The apparatus of claim 13 , wherein the third set of trenches are extensions of the first set of trenches.

15. A method comprising:

forming a first set of trenches having a first depth;

forming a second set of trenches having a second depth, wherein the second set of trenches is perpendicular to the first set of trenches to define an array of resistive memory elements; and

forming a third set of trenches having the first depth to define a fuse array having continuous wordlines configured to drive one or more cells of the fuse array.

16. The method of claim 15 , wherein each cell in the fuse array comprises a collector, the continuous wordline, a fuse contact, and a cap over the fuse contact.

17. The method of claim 16 , further comprising:

forming a heater over at least a portion of the cap for each cell in the fuse array.

18. The method of claim 17 , wherein the heater is L-shaped.

19. The method of claim 18 , further comprising:

forming a chalcogenide layer over the heater.

20. The method of claim 19 , further comprising:

etching the chalcogenide layer to leave portions of the chalcogenide layer over only a first wordline at an edge of the fuse array.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050676/0782 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046635/0634 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Aug 26, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 039841/0207 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Aug 25, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 039824/0681 →