Hybrid subtractive etch/metal fill process for fabricating interconnects
In one example, a method for fabricating an integrated circuit includes patterning a layer of a first conductive metal, via a subtractive etch process, to form a plurality of lines for connecting semiconductor devices on the integrated circuit. A large feature area is formed outside of the plurality of conductive lines via a metal fill process using a second conductive metal.
1. Method for fabricating an integrated circuit, the method comprising:
patterning a layer of a first conductive metal, via a subtractive etch process, to form a plurality of conductive lines for connecting semiconductor devices on the integrated circuit; and
forming a large feature area outside of the plurality of conductive lines via a metal fill process using a second conductive metal; and
forming a plurality of vias in continuous lines with the plurality of conductive lines, wherein forming the plurality of vias comprises, prior to patterning the layer of conductive metal:
depositing a layer of a dielectric material on a wafer;
patterning the layer of the dielectric material to form a plurality of trenches, wherein a first subset of the plurality of trenches is formed in a high-density line-space area on the wafer, and a second subset of the plurality of trenches is formed in the large feature area;
depositing a first liner layer over the dielectric material, subsequent to patterning the layer of the dielectric material, wherein the first liner layer lines the plurality of trenches; and
depositing the layer of the first conductive metal over the first liner layer, wherein the layer of the first conductive metal fills the plurality of trenches.
2. The method of claim 1 , wherein the subtractive etch process forms the plurality of lines above the first subset of the plurality of trenches.
3. The method of claim 2 , further comprising, subsequent to patterning the layer of the first conductive metal but prior to forming the large feature area:
depositing a second liner layer over the plurality of lines;
depositing an interlayer dielectric layer over the second liner layer;
patterning the interlayer dielectric layer down to form a plurality of recesses, wherein each recess of the plurality of recesses is positioned above one trench of the second subset of the plurality of trenches; and
depositing a third liner layer over the interlayer dielectric layer and in the plurality of recesses.
4. The method of claim 3 , wherein the metal fill process fills the plurality of recesses.
5. A method for fabricating an integrated circuit, the method comprising:
patterning a layer of a first conductive metal, via a subtractive etch process, to form a plurality of conductive lines for connecting semiconductor devices on the integrated circuit; and
forming a large feature area outside of the plurality of conductive lines via a metal fill process using a second conductive metal, wherein the forming is performed subsequently to the patterning, such that effects of the subtractive etch process on the large feature area are minimized.
6. The method of claim 5 , wherein at least one of the first conductive metal and the second conductive metal comprises copper.
7. The method of claim 5 , wherein at least one of the first conductive metal and the second conductive metal comprises gold.
8. The method of claim 5 , wherein at least one of the first conductive metal and the second conductive metal comprises silver.
9. The method of claim 5 , wherein the first conductive metal is the same as the second conductive metal.
10. The method of claim 5 , wherein the plurality of conductive lines have dimensions smaller than forty nanometers.
11. The method of claim 5 , wherein the metal fill process is a vapor deposition process.
12. The method of claim 5 , wherein at least one of the first conductive metal and the second conductive metal comprises a metal alloy.
13. The method of claim 5 , wherein the subtractive etch process is performed prior to the metal fill process.
14. The method of claim 13 , wherein the patterning the layer of the first conductive metal comprises:
depositing a first liner layer over a silicon wafer;
depositing the layer of the first conductive metal over the first liner layer; and
removing a portion of the layer of the first conductive metal down to the first liner layer; and
lining the plurality of lines with a second liner layer.
15. The method of claim 14 , wherein the forming the large feature area comprises:
depositing an interlayer dielectric layer over the second liner layer;
patterning the interlayer dielectric layer to create a recess;
lining the recess with a third liner layer; and
depositing the second conductive metal in the recess to create the large feature area.
16. The method of claim 5 , wherein the metal fill process is an electroplating process.
17. The method of claim 5 , wherein the large feature area is configured to house an electrical pad.
18. The method of claim 17 , wherein the large feature area overlaps with a portion of the plurality of conductive lines.
19. The method of claim 5 , further comprising:
forming a plurality of vias in continuous lines with the plurality of conductive lines.
20. The method of claim 19 , wherein forming the plurality of vias comprises, prior to patterning the layer of conductive metal:
depositing a layer of a dielectric material on a wafer;
patterning the layer of the dielectric material to form a plurality of trenches, wherein a first subset of the plurality of trenches is formed in a high-density line-space area on the wafer, and a second subset of the plurality of trenches is formed in the large feature area;
depositing a first liner layer over the dielectric material, subsequent to patterning the layer of the dielectric material, wherein the first liner layer lines the plurality of trenches; and
depositing the layer of the first conductive metal over the first liner layer, wherein the layer of the first conductive metal fills the plurality of trenches.