Device overvoltage detector

1. A semiconductor component comprising:

a device; and

an overvoltage detection structure that includes a current path comprising a Zener diode connected in series with a fuse,

wherein the Zener diode is configured to conduct a current in response to an overvoltage condition at the device,

wherein the fuse is configured to break the current path of the overvoltage detection structure in response to the Zener diode conducting the current,

wherein the device and the Zener diode are formed on a same semiconductor die and each comprise a terminal, and

wherein the fuse is external to the semiconductor die and comprises a wire that is connected to the terminal of the Zener diode and electrically couples the terminal of the Zener diode to the terminal of the device.

2. The semiconductor component of claim 1 , wherein the fuse comprises a resistance sufficient to cause the fuse to burn from the current being conducted by the Zener diode.

3. The semiconductor component of claim 2 , wherein to achieve the resistance that is sufficient to cause the fuse to burn due to the current being conducted by the Zener diode, the fuse comprises at least one of a particular material, a particular shape, or a particular area.

4. The semiconductor component of claim 3 , wherein the fuse comprises a material that reflects X-ray light.

5. The semiconductor component of claim 3 , wherein the fuse burning changes at least one of the particular material, the particular shape, or the particular area.

6. The semiconductor component of claim 4 , wherein the fuse burning changes the reflection behavior of the material that reflects X-ray light.

7. The semiconductor component of claim 1 , wherein:

a first terminal of the overvoltage detection structure is coupled to a drain of the device and a second terminal of the overvoltage detection structure is coupled to a source of the device; or

the first terminal of the overvoltage detection structure is coupled to an emitter of the device and the second terminal of the overvoltage detection structure is coupled to a collector of the device; or

the first terminal of the overvoltage detection structure is coupled to an anode of the device and the second terminal of the overvoltage detection structure is coupled to a cathode of the device.

8. The semiconductor component of claim 7 , wherein the first terminal of the overvoltage detection structure is coupled to the Zener diode and the second terminal of the overvoltage detection structure is coupled to the fuse.

9. The semiconductor component of claim 7 , wherein the first terminal of the overvoltage detection structure is coupled to the fuse and the second terminal of the overvoltage detection structure is coupled to the Zener diode.

10. The semiconductor component of claim 1 , wherein the device comprises a power metal-oxide-semiconductor field-effect transistor or an insulated-gate bipolar transistor.

11. The semiconductor component of claim 1 , wherein the fuse comprises one or more metals alloys.

12. The semiconductor component of claim 1 , wherein the fuse comprises a material selected from a group consisting of: copper, tungsten, silver, gold, zinc, and tin.

13. The semiconductor component of claim 1 ,

wherein a breakdown voltage of the Zener diode is greater than a breakdown voltage of the device, and

wherein the fuse is configured to break and store an indication of a voltage overstress event when the Zener diode conducts current in avalanche mode that exceeds the current rating of the device.

14. A semiconductor die comprising:

a device; and

at least a portion of an overvoltage detection structure that includes a current path comprising a Zener diode connected in series with a fuse,

wherein the Zener diode is configured to conduct a current in response to an overvoltage condition at the device,

wherein the fuse is configured to break the current path of the overvoltage detection structure in response to the Zener diode conducting the current,

wherein the device and the Zener diode are formed on the semiconductor die and each comprise a terminal, and

wherein the fuse is external to the semiconductor die and comprises a wire that is connected to the terminal of the Zener diode and electrically couples the terminal of the Zener diode to the terminal of the device.

15. A method comprising:

responsive to an overvoltage condition at a device, conducting, by a Zener diode of an overvoltage detection structure, a current through a current path formed by a series connection between a fuse and the Zener diode of the overvoltage detection structure; and

responsive to conducting the current through the current path, breaking, by the fuse of the overvoltage detection structure, the current path,

wherein the Zener diode is formed on a semiconductor die that includes the device, and

wherein the fuse is external to the semiconductor die that includes the device and the fuse comprises a wire that electrically couples a terminal of the Zener diode to a terminal of the device.

16. The method of claim 15 further comprising refraining from conducting, by the Zener diode, the current through the current path in response to a lack of an overvoltage condition at the device.

17. The method of claim 15 , wherein the fuse comprises a material that has resistance sufficient to cause the fuse to burn from the current being conducted by the Zener diode, the material being reflective of X-ray light.

18. The method of claim 15 , wherein the fuse comprises at least one of a particular material, a particular shape, or a particular area.

19. The method of claim 15 , wherein the device comprises a power metal-oxide-semiconductor field-effect transistor or an insulated-gate bipolar transistor.

20. The method of claim 15 ,

wherein a breakdown voltage of the Zener diode is greater than a breakdown voltage of the device, and

wherein the fuse is configured to break and store an indication of a voltage overstress event when the Zener diode conducts current in avalanche mode that exceeds the current rating of the device.