IP Library › Granted Patent US 9,897,916
Granted Patent B2
US 9,897,916 · App. 15/195,395 · Granted Feb 20, 2018

Compound, polymer compound, resist composition, and patterning process

Inventors: Masaki Ohashi (Jyoetsu, JP); Jun Hatakeyama (Jyoetsu, JP); Masahiro Fukushima (Jyoetsu, JP); Takayuki Fujiwara (Jyoetsu, JP)
Assignee: SHIN-ETSU CHEMICAL CO., LTD.
G03F7/039C07C309/12C07D327/08C08F220/38G03F7/038G03F7/168G03F7/2004G03F7/2041G03F7/322G03F7/38C07C2601/14C07C2602/42C07C2603/74C08F220/20C08F2220/1891C08F2220/283C08F2220/302C08F2220/303C08F2220/382
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Quick Facts
Patent No.
US 9,897,916
App. No.
15/195,395
Granted
Feb 20, 2018
Kind
B2
Abstract

The present invention provides a compound shown by the formula (1), wherein R 1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; A represents a single bond or a linear divalent hydrocarbon group having 1 to 30 carbon atoms or a branched or cyclic divalent hydrocarbon group having 3 to 30 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom; “n” represents 0 or 1, provided that “n” is 0 when A is a single bond; and M + represents a cation. This compound is suitable as a raw material of a polymer compound usable for a base resin of a resist composition that has high resolution and high sensitivity and is excellent in balance of lithography properties such as LWR and CDU.

Claims (20)

1. A polymer compound that changes by a high energy beam or heat into a polymer compound having a sulfonic acid structure shown by the formula (1a),

wherein R 1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; A represents a linear divalent hydrocarbon group having 1 to 30 carbon atoms or a branched or cyclic divalent hydrocarbon group having 3 to 30 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom; and “n” represents 1;

and further comprising a repeating unit shown by the formula (2) and/or a repeating unit shown by the formula (3),

wherein R 1a represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; Z a represents a single bond or (a main chain) —C(═0)—0—Z′—, where Z′ represents a phenylene group, a naphthylene group, or a linear alkylene group having 1 to 10 carbon atoms or a branched or cyclic alkylene group having 3 to 10 carbon atoms, in which the alkylene group may contain a hydroxyl group, an ether bond, an ester bond, or a lactone ring; XA represents an acid-labile group; R 2a represents a linear monovalent hydrocarbon group having 1 to 10 carbon atoms or a branched or cyclic monovalent hydrocarbon group having 3 to 10 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom; p represents an integer of 1 to 3; q represents a number satisfying 0<q<5+2r−p, r represents 0 or 1 and n1 represents 0 or 1.

2. A resist composition comprising (A) the polymer compound according to claim 1 and (B) an organic solvent.

3. A patterning process comprising the steps of: applying the resist composition according to claim 2 on a substrate and baking the resist composition to form a resist film; exposing the formed resist film to a KrF excimer laser beam, an ArF excimer laser beam, an electron beam, or an EUV via a photomask; baking the exposed resist film; and then developing the resist film with a developer.

4. A polymer compound comprising a repeating unit shown by the formula (1c),

wherein R 1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; A represents a linear divalent hydrocarbon group having 1 to 30 carbon atoms or a branched or cyclic divalent hydrocarbon group having 3 to 30 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom; “n” represents 1; and M b + represents a sulfonium cation shown by the formula (a) or an iodonium cation shown by the formula (b),

wherein R 100 , R 200 , R 300 , R 400 and R 500 independently represent a heteroatom or a linear monovalent hydrocarbon group having 1 to 20 carbon atoms or a branched or cyclic monovalent hydrocarbon group having 3 to 20 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom; and two or more of R 100 , R 200 , and R 300 may be bonded to each other to form a ring together with the sulfur atom in the formula; and further comprising a repeating unit shown by the formula (2) and/or a repeating unit shown by the formula (3),

wherein R 1a represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; Z a represents a single bond or (a main chain) —C(═O)—O—Z′—, where Z′ represents a phenylene group, a naphthylene group, or a linear alkylene group having 1 to 10 carbon atoms or a branched or cyclic alkylene group having 3 to 10 carbon atoms, in which the alkylene group may contain a hydroxyl group, an ether bond, an ester bond, or a lactone ring; XA represents an acid-labile group; R 2a represents a linear monovalent hydrocarbon group having 1 to 10 carbon atoms or a branched or cyclic monovalent hydrocarbon group having 3 to 10 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom; p represents an integer of 1 to 3; q represents a number satisfying 0<q<5+2r−p, r represents 0 or 1 and n1 represents 0 or 1.

5. A resist composition comprising (A) the polymer compound according to claim 4 and (B) an organic solvent.

6. The resist composition according to claim 5 , further comprising (C) a photo acid generator shown by the formula (4),

R—SO 3 − M b +   (4)

wherein M b + represents a sulfonium cation shown by the formula (a) or an iodonium cation shown by the formula (b); R represents a hydrogen atom or a linear monovalent hydrocarbon group having 1 to 27 carbon atoms or a branched or cyclic monovalent hydrocarbon group having 3 to 20 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom,

wherein R 100 , R 200 , R 300 , R 400 and R 500 independently represent a heteroatom or a linear monovalent hydrocarbon group having 1 to 20 carbon atoms or a branched or cyclic monovalent hydrocarbon group having 3 to 20 carbon atoms, in which the hydrocarbon group may contain a heteroatom, and a part or all of hydrogen atoms in the hydrocarbon group may be substituted with a group containing a heteroatom; and two or more of R 100 , R 200 , and R 300 may be bonded to each other to form a ring together with the sulfur atom in the formula.

7. The resist composition according to claim 5 , further comprising (D) a nitrogen-containing compound.

8. The resist composition according to claim 5 , further comprising (E) a surfactant that is insoluble or difficultly soluble in water and soluble in an alkaline developer.

9. A patterning process comprising the steps of: applying the resist composition according to claim 5 on a substrate and baking the resist composition to form a resist film; exposing the formed resist film to a KrF excimer laser beam, an ArF excimer laser beam, an electron beam, or an EUV via a photomask; baking the exposed resist film; and then developing the resist film with a developer.

10. The patterning process according to claim 9 , wherein the exposing includes placing a liquid having a refractive index of 1.0 or more between the resist film and a projection lens to perform immersion exposure.

11. The patterning process according to claim 10 , wherein the immersion exposure is performed by applying a top coat on the resist film and then placing the liquid having a refractive index of 1.0 or more between the top coat and the projection lens.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2016
From: OHASHI, MASAKI; HATAKEYAMA, JUN; FUKUSHIMA, MASAHIRO; FUJIWARA, TAKAYUKI
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 039031/0884 →
Priority Claims (1)
JP 2015-155343 · Aug 5, 2015 · national
Continuity (1)
Related Publication 20170038683A1 · Feb 9, 2017