Semiconductor devices having fin-type patterns and metal contacts and methods of manufacturing the same

1. A semiconductor device comprising:

a substrate which includes a first area and a second area;

a first fin-type pattern extending in a first direction on the first area;

a second fin-type pattern extending in a second direction on the second area;

a first gate structure which contacts the first fin-type pattern, the first gate structure extending in a third direction that intersects the first direction;

a second gate structure which contacts the second fin-type pattern, the second gate structure extending in a fourth direction that intersects the second direction;

a first epitaxial layer on the first fin-type pattern directly adjacent the first gate structure;

a second epitaxial layer on the second fin-type pattern directly adjacent the second gate structure;

a first metal contact which is on the first epitaxial layer and includes a first metal material; and

a second metal contact which is on the second epitaxial layer and includes the first metal material,

wherein the first metal contact completely surrounds an outer circumferential surface of the first epitaxial layer,

the second metal contact does not completely surround an outer circumferential surface of the second epitaxial layer, and

wherein the first metal contact directly contacts the first gate structure and the second metal contact does not directly contact the second gate structure.

2. The semiconductor device of claim 1 , wherein the first area comprises an NMOS transistor, and the second area comprises a PMOS transistor.

3. The semiconductor device of claim 1 , wherein the lowermost surface of the first metal contact is coplanar with the lowermost surface of the first epitaxial layer.

4. The semiconductor device of claim 1 , further comprising:

a first silicide layer which completely covers the outer circumferential surface of the first epitaxial layer; and

a second silicide layer which is located only at a top of the second epitaxial layer,

wherein the first and second silicide layers have same thicknesses.

5. The semiconductor device of claim 4 , wherein the first silicide layer comprises a composition same as the second silicide layer.

6. The semiconductor device of claim 1 , wherein an upper surface of the second epitaxial layer includes a recess and the second metal contact extends into the recess.

7. The semiconductor device of claim 1 , wherein the first and second metal contacts are each monolithic contacts.

8. The semiconductor device of claim 1 , wherein the first epitaxial layer includes a first type of semiconductor material and the second epitaxial layer includes a second type of semiconductor material that is different from the first type of semiconductor material.

9. A semiconductor device comprising:

a substrate which includes a first area and a second area;

a first fm-type pattern extending in a first direction on the first area;

a second fin-type pattern extending in a second direction on the second area;

a first gate structure which is in contact with the first fin-type pattern and extends to intersect the first direction;

a second gate structure which is in contact with the second fin-type pattern and extends to intersect the second direction;

a first epitaxial layer on the first fin-type pattern on at least one side of the first gate structure;

a second epitaxial layer on the second fin-type pattern on at least one side of the second gate structure;

a first metal contact which is on the first epitaxial layer and includes a metal; and

a second metal contact which is on the second epitaxial layer and includes a metal,

wherein the first metal contact includes a first portion which contacts side walls of the first gate structure, and a second portion which is spaced apart from the side walls of the first gate structure on top of the first portion,

wherein an upper surface of the second epitaxial layer includes a recess and the second metal contact extends into the recess, wherein the first metal contact completely surrounds an outer circumferential surface of the first epitaxial layer, the second metal contact does not completely surround an outer circumferential surface of the second epitaxial layer and

wherein the first metal contact directly contacts the first gate structure and the second metal contact does not directly contact the second gate structure.

10. The semiconductor device of claim 9 , wherein the first gate structure comprises a gate insulating film, a first gate electrode on the gate insulating film, and a spacer on at least one side of the first gate electrode,

wherein the first portion contacts the spacer, and

the second portion does not contact the spacer, and

wherein the first portion is in direct contact with the spacer or the first epitaxial layer.

11. The semiconductor device of claim 9 , further comprising: an interlayer insulating film which covers the first gate structure and the first epitaxial layer, and wherein the interlayer insulating film does not contact the first epitaxial layer.

12. The semiconductor device of claim 9 , wherein the first and second metal contacts are each monolithic contacts.

13. The semiconductor device of claim 12 , wherein the first epitaxial layer includes a first type of semiconductor material and the second epitaxial layer includes a second type of semiconductor material that is different from the first type of semiconductor material.

14. A semiconductor device comprising:

a substrate which includes a first area and a second area;

a first fin-type pattern extending in a first direction on the first area;

a second fin-type pattern extending in a second direction on the second area;

a first gate structure which contacts the first fin-type pattern, the first gate structure extending in a third direction that intersects the first direction;

a second gate structure which contacts the second fin-type pattern, the second gate structure extending in a fourth direction that intersects the second direction;

a first epitaxial layer on the first fin-type pattern directly adjacent the first gate structure;

a second epitaxial layer on the second fin-type pattern directly adjacent the second gate structure;

a first metal contact which is on the first epitaxial layer and includes a first metal material; and

a second metal contact which is on the second epitaxial layer and includes the first metal material,

wherein the first metal contact completely surrounds an outer circumferential surface of the first epitaxial layer,

wherein the second metal contact does not completely surround an outer circumferential surface of the second epitaxial layer,

wherein a first height (H 1 ) of the first epitaxial layer above an upper surface of the substrate is the same as a third height (H 3 ) of the second epitaxial layer above the upper surface of the substrate, and the lowermost surface of the second metal contact is at a fourth height (H 4 ) above the upper surface of the substrate, wherein the fourth height (H 4 ) is less than the first height (H 1 ) and the third height (H 3 ), and wherein the lowermost surface of the first metal contact that directly contacts the uppermost surface of the first epitaxial layer is above the lowermost surface of the second metal contact, and

wherein the first metal contact directly contacts the first gate structure and the second metal contact does not directly contact the second gate structure.

15. The semiconductor device of claim 14 , wherein an upper surface of the second epitaxial layer includes a recess and the second metal contact extends into the recess.

16. The semiconductor device of claim 14 , wherein the first and second metal contacts are each monolithic contacts.

17. The semiconductor device of claim 14 , wherein the first epitaxial layer includes a first type of semiconductor material and the second epitaxial layer includes a second type of semiconductor material that is different from the first type of semiconductor material.