Pressure sensing implant
Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
1. An implant comprising:
a wireless implant housing that defines a cavity;
a sensor connected to said wireless implant housing comprising:
a diaphragm having at least one diaphragm electrode;
a base attached directly to a surface of the diaphragm, the base includes at least one base electrode, wherein said base and said diaphragm define a capacitive gap between the at least one diaphragm electrode and the at least one base electrode, wherein the base is made from a non conductive material; and
wherein said base is directly attached to said diaphragm along an attachment configuration, wherein said attachment configuration includes a discontinuity through which at least one electrical trace connects at least one electrical contact outside of said capacitive gap to the at least one diaphragm electrode and/or the at least one base electrode, and wherein said discontinuity is a vent to allow the passage of fluid or gas between the cavity and the capacitive gap.
2. The implant of claim 1 , wherein the base includes an area, wherein the area of said base is larger than an area of said diaphragm such that the base attaches to the wireless implant housing to define the cavity.
3. The implant of claim 1 , wherein the base is a floating base positioned within the cavity of said wireless implant housing.
4. The implant of claim 3 , wherein said base further includes at least one through hole to provide access to electrically connect said at least one diaphragm electrode to a component outside said capacitive gap.
5. The implant of claim 1 , wherein said base includes at least one through substrate via (TSV) to electrically connect a component outside the capacitive gap to the at least one base electrode.
6. The implant of claim 1 , wherein said diaphragm includes a thick region and a thin region wherein the thin region is aligned with said capacitive gap.
7. The implant of claim 1 further comprising a coil in electric communication with said sensor, said coil positioned within said cavity of the wireless implant housing.
8. The implant of claim 7 further comprising a printed circuit board having at least one electronic component, the printed circuit board attached to the base and electrically attached to said coil.
9. The implant of claim 1 further comprising a distal anchor and a proximal anchor opposite the distal anchor wherein the distal anchor and proximal anchor are formed as loops that extend from the wireless implant housing, said anchors positionable in a fold down configuration and deployable from the fold down configuration to an open configuration.
10. The implant of claim 9 , wherein said proximal and distal anchors are made of at least one of nitinol, platinum, stainless steel, and a polymer.
11. The implant of claim 1 , wherein the sensor is at least one of a pressure sensor, a temperature sensor, a chemical sensor, a proximity sensor, an optical sensor, and strain gauge.
12. The implant of claim 1 , wherein said wireless implant housing is attached to said sensor by at least one of laser welding, flit bonding, anodic bonding, fusion bonding, and eutectic bonding.
13. The implant of claim 1 , wherein the sensor is electrically attached to at least one electronic component inside said cavity wherein the electrical attachments are accomplished by at least one of wirebonding, soldering, ultrasonic bonding, wedge bonding, laser welding, and conductive adhesives.
14. The implant of claim 1 further comprising an energy storage unit within the cavity.
15. The implant of claim 14 , wherein the energy storage unit is at least one of an electrochemical cell and a supercapacitor.
16. The implant of claim 1 , further comprising an internal component within said cavity, the internal component is at least one of a drug, steroid, battery, stimulus electrode, pacing circuitry, flow sensor, and chemical sensor.
17. The implant of claim 1 , wherein said implant includes an antenna and is configured to wirelessly communicate information with an external unit.
18. The implant of claim 1 , wherein said implant includes a circuit having a resonant frequency that changes in response to a sensed parameter.
19. The implant of claim 1 , wherein said implant includes a circuit functional to perform at least one of modulation, demodulation, memory, ac/dc conversion, and signal conditioning.
20. The implant of claim 1 , wherein said wireless implant housing and diaphragm are made of a non conductive material.
21. The implant of claim 1 , wherein said wireless implant housing is filled with a liquid configured to transfer pressure from said diaphragm to a chip-scale pressure sensor located inside said cavity.
22. The implant of claim 1 , wherein said diaphragm is connected to said wireless implant housing to form at least part of a hermetic seal about said cavity.
23. The implant of claim 1 , wherein said base and said diaphragm define the vent in said capacitive gap.