Array of conductive vias, methods of forming a memory array, and methods of forming conductive vias
View Patent ↗A method of forming conductive vias comprises forming at least three parallel line constructions elevationally over a substrate. The line constructions individually comprise a dielectric top and dielectric sidewalls. A conductive line is formed elevationally over and angles relative to the line constructions. The conductive line comprises a longitudinally continuous portion and a plurality of conductive material extensions that individually extend elevationally inward between immediately adjacent of the line constructions. Etching is conducted elevationally through the longitudinally continuous portion and partially elevationally into the extensions at spaced locations along the conductive line to break-up the longitudinally continuous portion to form individual conductive vias extending elevationally between immediately adjacent of the line constructions. Methods of forming a memory array are also disclosed. Arrays of conductive vias independent of method of manufacture are also disclosed.
1. An array of conductive vias, comprising:
spaced line constructions individually comprising a dielectric top and dielectric sidewalls; and
conductive vias extending elevationally between immediately adjacent of the line constructions, the conductive vias individually comprising an elevationally inner conductive material and an elevationally outer conductive material of different composition from composition of the elevationally inner conductive material, the elevationally inner conductive material being laterally recessed from the elevationally outer conductive material on at least one side of an individual conductive via of the conductive vias in at least one straight line vertical cross section.
2. The array of claim 1 wherein the elevationally inner conductive material is laterally recessed from the elevationally outer conductive material on only one side of the individual conductive via in the at least one straight line vertical cross section, the elevationally inner conductive material being elevationally recessed from a curved side surface of the elevationally outer conductive material on a side of the individual conductive via opposite the only one side in the at least one straight line vertical cross section.
3. The array of claim 1 wherein the spaced line constructions comprise column line constructions of memory circuitry and further comprising row line constructions of memory circuitry that intersect at an angle relative to the column line construction, the column line constructions being elevationally outward of the row line constructions, the column line constructions individually comprising a conductive core.
4. The array of claim 3 wherein the elevationally inner conductive material is laterally recessed from the elevationally outer conductive material on only one side of the individual conductive via in the at least one straight line vertical cross section, the elevationally inner conductive material being elevationally recessed from a curved side surface of the elevationally outer conductive material on a side of the individual conductive via opposite the only one side in the at least one straight line vertical cross section.
5. An array of conductive vias, comprising:
spaced line constructions individually comprising a dielectric top and dielectric sidewalls; and
conductive vias extending elevationally between immediately adjacent of the line constructions, the conductive vias individually comprising an elevationally inner conductive material and an elevationally outer conductive material of different composition from composition of the elevationally inner conductive material, the elevationally inner conductive material being elevationally recessed from a curved side surface of the elevationally outer conductive material on at least one side of an individual conductive via of the conductive vias in at least one straight line vertical cross section.
6. The array of claim 1 wherein the conductive vias individually have planar and parallel elevationally outermost and elevationally innermost surfaces that are laterally displaced yet laterally overlapping relative to one another.
7. The array of claim 5 wherein the conductive vias individually have planar and parallel elevationally outermost and elevationally innermost surfaces that are laterally displaced yet laterally overlapping relative to one another.
8. The array of claim 1 wherein the conductive vias individually have planar elevationally outermost surfaces of a parallelogram shape in 2D horizontal cross section.
9. The array of claim 5 wherein the conductive vias individually have planar elevationally outermost surfaces of a parallelogram shape in 2D horizontal cross section.
10. A memory array, comprising:
a substrate comprising active area, row line constructions, and column line constructions; the row line constructions and the column line constructions intersect at an angle relative to one another, the column line constructions being elevationally outward of the row line constructions, the column line constructions individually comprising a conductive core and dielectric over a top and over sidewalls of the conductive core;
conductive vias extending elevationally between immediately adjacent of the column line constructions and electrically coupling to substrate active area, the conductive vias individually comprising an elevationally inner conductive material and an elevationally outer conductive material of different composition from composition of the elevationally inner conductive material, the elevationally inner conductive material being laterally recessed from the elevationally outer conductive material on at least one side of an individual conductive via of the conductive vias in at least one straight line vertical cross section; and
charge storage devices elevationally outward and individually electrically coupled to individual of the conductive vias.
11. The memory array of claim 10 wherein the charge storage devices are arrayed in a 2D hexagonal close packed lattice.
12. The array of claim 10 wherein the conductive vias individually have planar and parallel elevationally outermost and elevationally innermost surfaces that are laterally displaced yet laterally overlapping relative to one another.
13. The array of claim 10 wherein the conductive vias individually have planar elevationally outermost surfaces of a parallelogram shape in 2D horizontal cross section.
14. A memory array, comprising:
a substrate comprising active area, row line constructions, and column line constructions; the row line constructions and the column line constructions intersect at an angle relative to one another, the column line constructions being elevationally outward of the row line constructions, the column line constructions individually comprising a conductive core and dielectric over a top and over sidewalls of the conductive core;
conductive vias extending elevationally between immediately adjacent of the column line constructions and electrically coupling to substrate active area, the conductive vias individually comprising an elevationally inner conductive material and an elevationally outer conductive material of different composition from composition of the elevationally inner conductive material, the elevationally inner conductive material being elevationally recessed from a curved side surface of the elevationally outer conductive material on at least one side of an individual conductive via of the conductive vias in at least one straight line vertical cross section; and
charge storage devices elevationally outward and individually electrically coupled to individual of the conductive vias.
15. The memory array of claim 14 wherein the charge storage devices are arrayed in a 2D hexagonal close packed lattice.
16. The array of claim 14 wherein the conductive vias individually have planar and parallel elevationally outermost and elevationally innermost surfaces that are laterally displaced yet laterally overlapping relative to one another.
17. The array of claim 14 wherein the conductive vias individually have planar elevationally outermost surfaces of a parallelogram shape in 2D horizontal cross section.