IP Library Granted Patent US 10,192,736
Granted Patent B2
US 10,192,736 · App. 15/220,234 · Granted Jan 29, 2019

Method for transferring graphene by attaching removable frame to protective layer applied on a sample containing graphene monolayer

Inventors: M. Amaia Zurutuza Elorza (San Sebastián, ES); M. Alba Centeno Perez (San Sebastián, ES)
Assignee: GRAPHENEA S.A.
H01L21/02527B32B37/025B32B38/0036B32B38/10B81C1/00158C01B32/194H01L21/02664B81C2201/0133B81C2201/0176B81C2201/0191B81C2201/053
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Quick Facts
Patent No.
US 10,192,736
App. No.
15/220,234
Granted
Jan 29, 2019
Kind
B2
Abstract

A method of transferring graphene onto a target substrate having cavities and/or holes or onto a substrate having at least one water soluble layer is disclosed. It comprises the steps of: applying a protective layer ( 4 ) onto a sample comprising a stack ( 20 ) formed by a graphene monolayer ( 2 ) grown on a metal foil or on a metal thin film on a silicon substrate ( 1 ); attaching to said protective layer ( 4 ) a frame ( 5 ) comprising at least one outer border and at least one inner border, said frame ( 5 ) comprising a substrate and a thermal release adhesive polymer layer, the frame ( 5 ) providing integrity and allowing the handling of said sample; removing or detaching said metal foil or metal thin film on a silicon substrate ( 1 ); once the metal foil or metal thin film on a silicon substrate ( 1 ) has been removed or detached, drying the sample; depositing the sample onto a substrate ( 7 ); removing said frame ( 5 ) by cutting through said protective layer ( 4 ) at said at least one inner border of the frame ( 5 ) or by thermal release.

Claims (19)

1. A method of transferring graphene onto a target substrate, said target substrate being either a substrate having cavities and/or holes or a substrate having at least one water soluble layer, characterized in that it comprises the steps of:

applying a protective layer ( 4 ) onto a sample comprising a stack ( 20 ) formed by a graphene monolayer ( 2 ) grown on a metal foil or on a metal thin film on a silicon substrate ( 1 );

attaching to said protective layer ( 4 ) a frame ( 5 ) comprising at least one outer border and at least one inner border, said frame ( 5 ) comprising a substrate and a thermal release adhesive polymer layer, the thermal release adhesive polymer layer being made of a material different from the material of the substrate, the frame ( 5 ) having a Young's modulus equal or higher than 10 MPa providing integrity and allowing the handling of said sample, the frame ( 5 ) being thermally released at a temperature up to 150° C.;

removing or detaching said metal foil or metal thin film from the silicon substrate ( 1 );

once the metal foil or metal thin film on the silicon substrate ( 1 ) has been removed or detached, drying the sample;

depositing the sample onto the target substrate ( 7 ); and

removing said frame ( 5 ) by cutting through said protective layer ( 4 ) at said at least one inner border of the frame ( 5 ), or by thermal release at a temperature up to 150° C.

2. The method of claim 1 , wherein said target substrate ( 7 ) is a substrate having cavities or holes or it is a substrate comprising a water-soluble layer.

3. The method of claim 1 , wherein said protective layer ( 4 ) is selected from the following group: poly (methyl methacrylate) (PMMA), cellulose nitrate (NC), cellulose acetate butyrate (CAB), poly(lactic acid) (PLA), poly(phthalaldehyde) (PPA), poly(bisphenol A carbonate) (PC), as well as any combustion or derivative of any of the former compounds.

4. The method of claim 3 , wherein said protective layer ( 4 ) is made of poly (methyl methacrylate) (PMMA).

5. The method of claim 1 , wherein said frame ( 5 ) has a Young's modulus higher than 10 MPa.

6. The method of claim 5 , wherein said frame ( 5 ) is made of adhesive tape.

7. The method of claim 1 , wherein when said frame ( 5 ) is removed by cutting through said protective layer ( 4 ) at said at least one inner border of the frame ( 5 ), the dimensions of the outer border of said frame ( 5 ) being equal to or larger than the outer dimensions of the sample.

8. The method of claim 1 , wherein after removing said metal foil or metal thin film from said silicon substrate ( 1 ) by an etchant solution ( 6 ), the sample is cleaned with distilled water.

9. The method of claim 1 , wherein the sample ( 22 ) is dried using N 2 .

10. The method of claim 1 , wherein the target substrate ( 7 ) is heated prior to receiving the sample ( 22 ).

11. The method of claim 1 , wherein after removing or detaching said frame ( 5 ), the sample is baked to improve adhesion.

12. The method of claim 1 , further comprising removing said protective layer ( 4 ) by means of a thermal treatment or by means of acetone vapor.

13. The method of claim 1 , wherein said graphene monolayer ( 2 ) is grown on said metal foil or on said metal thin film on a silicon substrate ( 1 ) following a process of Chemical Vapor Deposition (CVD).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2021
From: GRAPHENEA S.A.
To: GRAPHENEA SEMICONDUCTOR S.L.U.
Reel/Frame 055514/0855 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2016
From: ZURUTUZA ELORZA, M. AMAIA; CENTENO PEREZ, M. ALBA
To: GRAPHENEA S.A.
Reel/Frame 039263/0790 →
Priority Claims (1)
EP 15382430 · Aug 24, 2015 · regional
Continuity (1)
Related Publication 20170057812A1 · Mar 2, 2017
Cited By (1)
US 12,588,432