IP Library Granted Patent US 9,806,259
Granted Patent B2
US 9,806,259 · App. 15/226,411 · Granted Oct 31, 2017

Patterning devices using fluorinated compounds

Inventors: Howard E. Katz (Owings Mills, MD); Bal Mukund Dhar (Baltimore, MD)
Assignee: THE JOHNS HOPKINS UNIVERSITY
H01L51/0018G03F7/0035G03F7/70058H01L51/0014H01L51/0023H01L51/0097H01L51/0541H01L51/52H01L51/0545H01L51/102Y10T428/24479
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Quick Facts
Patent No.
US 9,806,259
App. No.
15/226,411
Granted
Oct 31, 2017
Kind
B2
Abstract

A method for producing a spatially patterned structure includes forming a layer of a material on at least a portion of a substructure of the spatially patterned structure, forming a barrier layer of a fluorinated material on the layer of material to provide an intermediate structure, and exposing the intermediate structure to at least one of a second material or radiation to cause at least one of a chemical change or a structural change to at least a portion of the intermediate structure. The barrier layer substantially protects the layer of the material from chemical and structural changes during the exposing. Substructures are produced according to this method.

Claims (14)

1. A method for producing a spatially patterned structure, comprising:

forming a fluorinated material layer over a substructure;

forming a layer of a photoresist on said fluorinated material layer;

exposing said photoresist to spatially patterned radiation;

developing said photoresist to substantially remove one of exposed or unexposed regions of said photoresist to provide a pattern of uncovered regions of said fluorinated material layer between regions covered by said photoresist; and

removing said uncovered regions of fluorinated material layer using a fluorinated solvent to provide a patterned fluorinated material layer.

2. The method of claim 1 further comprising depositing a layer of material over the photoresist and through the regions where the photoresist and the fluorinated material layer had been removed.

3. The method of claim 2 wherein the layer of material deposited is a metal.

4. The method of claim 2 further comprising lifting off at least some of the photoresist after said depositing.

5. The method of claim 1 further comprising lifting off at least some of the photoresist after the developing.

6. The method of claim 5 wherein lifting off comprises lifting off all of the photoresist.

7. The method of claim 1 , wherein the substructure comprises a layer of at least one of an organic material, a polymeric material, an organometallic material or a biological material.

8. The method of claim 1 , wherein the substructure comprises a layer of a material that provides an electronic function to the spatially patterned structure.

9. The method of claim 1 wherein the substructure is a substrate.

Assignments (2)
CONFIRMATORY LICENSE Recorded Jun 24, 2022
From: JOHNS HOPKINS UNIVERSITY
To: UNITED STATES DEPARTMENT OF ENERGY
Reel/Frame 060441/0372 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2017
From: KATZ, HOWARD E.; DHAR, BAL MUKUND
To: THE JOHNS HOPKINS UNIVERSITY
Reel/Frame 042346/0526 →
Continuity (4)
Continuation 14742894 · Jun 18, 2015
Division 12864407
Provisional Application 61123678 · Apr 10, 2008
Related Publication 20160343946A1 · Nov 24, 2016