IP Library Granted Patent US 9,660,112
Granted Patent B2
US 9,660,112 · App. 15/227,353 · Granted May 23, 2017

Semiconductor light trap devices

Inventor: Thoralf Kautzsch (Dresden, DE)
Assignee: Infineon Technologies Dresden GmbH
H01L31/02327H01L31/02363H01L31/0352Y02E10/50
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Quick Facts
Patent No.
US 9,660,112
App. No.
15/227,353
Granted
May 23, 2017
Kind
B2
Abstract

Embodiments relate to buried structures for silicon devices which can alter light paths and thereby form light traps. Embodiments of the lights traps can couple more light to a photosensitive surface of the device, rather than reflecting the light or absorbing it more deeply within the device, which can increase efficiency, improve device timing and provide other advantages appreciated by those skilled in the art.

Claims (11)

1. A device comprising:

a silicon structure having an exposed surface to be exposed to light rays;

a photoelectrically active portion located beneath the surface within the silicon structure;

an internal structure located beneath the photoelectrically active portion, the internal structure having at least one interface surface not parallel to the exposed surface at which total internal reflection of light rays occurs such that at least some light rays are redirected toward the photoelectrically active portion, toward the exposed surface or both; and

a perimeter structure located proximate a perimeter of the silicone structure and extending at least partially above the internal structure and below the exposed surface, the perimeter having an internally directed interface at which total internal reflection of at least some of the light rays occurs.

2. The device of claim 1 , wherein the perimeter structure is formed as a perimeter trench.

3. The device of claim 2 , wherein the perimeter trench has a width greater than approximately one wavelength of the light to be totally internally reflected and less than approximately four wavelengths of the light to be totally internally reflected.

4. The device of claim 1 , wherein the perimeter trench further comprises a conducting liner.

5. The device of claim 1 , wherein the perimeter trench further comprises an encapsulation at a top thereof.

6. The device of claim 1 , wherein the internal structure comprises a cavity defined by reflective facets oriented non parallel to the exposed surface.

7. The device of claim 1 , wherein the conducting liner comprises a polysilicon liner.

Assignments (2)
CHANGE OF NAME Recorded Jun 12, 2024
From: INFINEON TECHNOLOGIES DRESDEN GMBH
To: INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG
Reel/Frame 067699/0648 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2016
From: KAUTZSCH, THORALF
To: INFINEON TECHNOLOGIES DRESDEN GMBH
Reel/Frame 039332/0548 →
Continuity (2)
Continuation 14624679 · Feb 18, 2015
Related Publication 20160343886A1 · Nov 24, 2016