Method of manufacturing rigid-flexible printed circuit board
A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
1. A multilayer rigid flexible printed circuit board having a rigid portion and a flexible portion, the multilayer rigid flexible printed circuit board comprising:
a flexible core layer comprising a first flexible film including a first circuit pattern on one or both surfaces and having an area corresponding to an area of the multilayer rigid flexible printed circuit board, and a second flexible film disposed on the first flexible film and including a second circuit pattern disposed on the rigid portion of the second flexible film;
a pattern stack disposed on a portion of the rigid portion of the second flexible film to be adjacent to the flexible portion, and having a metal pattern disposed on the rigid portion of the second flexible film and a protective pattern disposed on the metal pattern;
an insulating layer disposed on the rigid portion of the second flexible film, covering the metal pattern and the protective layer thereon; and
a third circuit pattern disposed on the insulating layer.
2. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern is exposed on a side surface of the rigid portion facing the flexible portion.
3. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the multilayer rigid flexible printed circuit board has a thickness of the rigid portion being greater than that of the flexible portion thereof.
4. The multilayer rigid flexible printed circuit board according to claim 1 , further comprising a bonding sheet between the first flexible film and the second flexible film.
5. The multilayer rigid flexible printed circuit board according to claim 1 , further comprising a bonding sheet between the second flexible film and the protective layer.
6. The multilayer rigid flexible printed circuit board according to claim 5 , wherein the bonding sheet includes at least one of an epoxy thermosetting resin and a prepreg material.
7. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the protective layer comprises an adhesive material including polyimide.
8. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the second flexible film is disposed on an entire area of the first flexible film.
9. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern comprises a metal layer on the second flexible film and a plating layer on the metal layer.
10. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern makes contact with the insulating layer.
11. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern is physically isolated from the second circuit pattern.
12. A multilayer rigid flexible printed circuit board having a rigid portion and a flexible portion, the multilayer rigid flexible printed circuit board comprising:
a first flexible film including a first circuit pattern on one or both surfaces and having an area corresponding to an area of the multilayer rigid flexible printed circuit board;
a pattern stack disposed on a portion of the rigid portion of the first flexible film to be adjacent to the flexible portion, and having a metal pattern disposed on the rigid portion of the first flexible film and a protective pattern disposed on the metal pattern;
an insulating layer disposed on the rigid portion of the first flexible film, covering the metal pattern having the protective layer thereon and having an additional circuit pattern.
13. The multilayer rigid flexible printed circuit board according to claim 12 , wherein the metal pattern is physically isolated from the second circuit pattern.