Method and apparatus for processing wafer-shaped articles
A method for drying wafer-shaped articles comprises rotating a wafer-shaped article of a predetermined diameter on a rotary chuck, and dispensing a drying liquid onto one side of the wafer-shaped article. The drying liquid comprises greater than 50 mass % of an organic solvent. During at least part of the dispensing step, the wafer-shaped article is heated with a heating assembly. During at least part of the dispensing step a fluorine-containing compound is present in the drying liquid or in a gas that surrounds the drying liquid as the drying liquid contacts the wafer-shaped article.
1. A method for drying wafer-shaped articles, comprising:
rotating a wafer-shaped article of a predetermined diameter on a rotary chuck;
dispensing a drying liquid onto one side of said wafer-shaped article, said drying liquid comprising greater than 50 mass % of an organic solvent; and
during at least part of said dispensing step, heating said wafer-shaped article with a heating assembly,
wherein, during at least part of said dispensing step a fluorine-containing compound is present in a gas that surrounds said drying liquid as said drying liquid contacts said wafer-shaped article.
2. The method according to claim 1 , wherein said organic solvent is an alcohol.
3. The method according to claim 1 , wherein said organic solvent is isopropyl alcohol.
4. The method according to claim 1 , wherein, during at least part of said dispensing step, the fluorine-containing compound is contained in the drying liquid.
5. The method according to claim 4 , wherein said fluorine-containing compound is hydrofluoric acid.
6. The method according to claim 4 , wherein said fluorine-containing compound is present in said drying liquid at a concentration of at least 0.0001 mass % and less than 10 mass %.
7. The method according to claim 4 , wherein said fluorine-containing compound is present in said drying liquid at a concentration of at least 0.05 mass % and less than 10 mass %.
8. The method according to claim 1 , wherein said fluorine-containing gas is hydrogen fluoride.
9. The method according to claim 1 , wherein said fluorine-containing gas has an oxygen concentration of less than 1 mass %.
10. The method according to claim 1 , wherein said wafer-shaped article comprises semiconductor device structures formed on said one side of said wafer-shaped article.
11. The method according to claim 1 , wherein said heating step comprises heating said wafer-shaped article to a temperature in a range of 30-300° C.
12. The method according to claim 1 , wherein said heating step comprises heating said wafer-shaped article to a temperature in a range of 40-300° C.
13. The method according to claim 1 , wherein said drying liquid comprises less than 30 mass % water.
14. The method according to claim 1 , wherein said drying liquid comprises less than 15 mass % water.
15. The method according to claim 1 , wherein said heating assembly comprises an array of radiant heating elements, said array covering said wafer-shaped article.
16. The method according to claim 15 , wherein said array of radiant heating elements is distributed among at least five individually controllable groups each occupying a respectively different zone extending from a more central region of said rotary chuck to a more peripheral region of said rotary chuck.
17. The method according to claim 16 , wherein said dispensing step is performed using a liquid dispenser comprising one or more dispensing orifices configured to move a discharge point from a more central region of said wafer-shaped article to a more peripheral region of said wafer-shaped article, and wherein a power supplied to each of said at least five individually controllable groups of radiant heating elements is based on a position of said discharge point of said liquid dispenser.
18. The method according to claim 4 , wherein, prior to or during said dispensing step, said drying liquid is mixed with the fluorine-containing compound in a manifold.
19. The method according to claim 1 , wherein the heating assembly is substantially coextensive with said wafer-shaped article.