Lapping pads and systems and methods of making and using the same

1. A lapping pad comprising:

An abrading layer, wherein the abrading layer has a working surface, a second surface opposite the working surface having a projected area Ap, and at least one cavity having a cavity opening located at the second surface, the at least one cavity being defined by at least one rib, each rib having a distal end at the second surface; and

a phase transition material having a thermally reversible phase transition, wherein the phase transition material is disposed in the at least one cavity; and

wherein the total area of the cavity opening of the at least one cavity is between about 0.05Ap and about 0.995Ap; and

wherein the at least one cavity is a plurality of cavities, the plurality of cavities having an areal density of between about 1 cavity/100 cm 2 of area Ap to about 5000 cavities/1 cm 2 of area Ap.

2. The lapping pad according to claim 1 , wherein the abrading layer comprises from about 80 percent to about 100 percent by weight polymer.

3. The lapping pad according to claim 1 , wherein the total area of the cavity opening of the at least one cavity is between about 0.10Ap and about 0.95Ap.

4. The lapping pad according to claim 1 , wherein the thermally reversible phase transition is at least one of a melting point transition, a crystal to crystal transition, a liquid crystal to liquid crystal transition, a liquid crystal to liquid transition and a boiling point transition.

5. The lapping pad according to claim 1 , wherein the phase transition material has a melting point between about 5° C. and about 80° C.

6. The lapping pad according to claim 1 , wherein the enthalpy of the phase transition of the phase transition material is between about 100 J/g and about 400 J/g.

7. The lapping pad according to claim 1 , wherein the phase transition material has a molecular weight of between about 100 g/mol and about 3000 g/mol.

8. The lapping pad according to claim 1 , wherein the phase transition materials is at least one of a paraffin, paraffin wax, alcohol, ketone, ester, ether, fatty acid, vegetable oil, polyalkyl oxide and polyalkyl glycol.

9. The lapping pad according to claim 1 , further comprising a sealing layer in contact with at least a portion of the second surface of the abrading layer.

10. The lapping pad according to claim 9 , wherein the sealing layer comprises a first adhesive layer, having a first surface and a second surface, wherein the first surface of the first adhesive layer is adhered to the second surface of the abrading layer.

11. The lapping pad according to claim 10 , wherein the sealing layer further comprises a polymer film having a first surface and a second surface, wherein the first surface of the polymer film is in contact with the second surface of the first adhesive layer.

12. The lapping pad according to claim 10 , wherein the first adhesive layer is at least one of a pressure sensitive adhesive, a heat activated adhesive and a thermosetting adhesive.

13. The lapping pad according to claim 9 , wherein the sealing layer is at least one of a single sided tape, a double sided tape and an adhesive transfer tape.

14. The lapping pad according to claim 1 , wherein the lapping pad contains less than 5 percent by weight inorganic abrasive particles having a mohs hardness of 5.0 or greater.

15. A lapping system comprising a lapping pad according to claim 1 and a working fluid.

16. The lapping system according to claim 15 , wherein the working fluid is a slurry.

17. A method of lapping a substrate comprising:

providing a lapping pad according to claim 1 ;

providing a substrate;

contacting the working surface of the lapping pad with the substrate surface; and

moving the lapping pad and the substrate relative to one another while maintaining contact between the working surface of the lapping pad and the substrate surface; and

wherein lapping is conducted in the presence of a working fluid.

18. The method of lapping a substrate according to claim 17 , wherein the working fluid is a slurry.

19. The method of lapping a substrate according to claim 17 , wherein the substrate is at least one of a sapphire substrate and a semiconductor wafer substrate.

20. A lapping pad comprising:

An abrading layer, wherein the abrading layer has a working surface, a second surface opposite the working surface having a projected area Ap, and at least one cavity having a cavity opening located at the second surface, the at least one cavity being defined by at least one rib, each rib having a distal end at the second surface; and

a phase transition material having a thermally reversible phase transition, wherein the phase transition material is disposed in the at least one cavity; and

a sealing layer in contact with at least a portion of the second surface of the abrading layer wherein the sealing layer comprises a first adhesive layer, having a first surface and a second surface, wherein the first surface of the first adhesive layer is adhered to the second surface of the abrading layer; and

wherein the total area of the cavity opening of the at least one cavity is between about 0.05Ap and about 0.995Ap.

21. The lapping pad according to claim 20 , wherein the sealing layer further comprises a polymer film having a first surface and a second surface, wherein the first surface of the polymer film is in contact with the second surface of the first adhesive layer.

22. The lapping pad according to claim 20 , wherein the first adhesive layer is at least one of a pressure sensitive adhesive, a heat activated adhesive and a thermosetting adhesive.

23. The lapping pad according to claim 20 , wherein the sealing layer is at least one of a single sided tape, a double sided tape and an adhesive transfer tape.