IP Library Granted Patent US 10,177,229
Granted Patent B2
US 10,177,229 · App. 15/240,789 · Granted Jan 8, 2019

Semiconductor material having a compositionally-graded transition layer

Inventors: T. Warren Weeks, Jr. (Raleigh, NC); Edwin L. Piner (Cary, NC); Thomas Gehrke (Boise, ID); Kevin J. Linthicum (Angier, NC)
Assignee: MACOM Technology Solutions Holdings, Inc.
H01L29/155C30B23/02C30B23/025C30B25/02C30B25/18C30B25/183C30B29/06C30B29/403C30B29/406C30B29/68H01L21/0243H01L21/0245H01L21/0251H01L21/0254H01L21/0262H01L21/02381H01L21/02422H01L21/02433H01L21/02458H01L21/02507H01L21/02598H01L29/04H01L29/045H01L29/0649H01L29/201H01L29/2003H01L29/205H01L29/225H01L29/66462H01L29/7787H01L29/78H01L33/007H01L33/0066H01L33/0075H01L33/04H01L33/06H01L33/12H01L33/32Y10T428/24942Y10T428/26Y10T428/265
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Quick Facts
Patent No.
US 10,177,229
App. No.
15/240,789
Granted
Jan 8, 2019
Kind
B2
Abstract

A semiconductor material includes a compositionally-graded transition layer, an intermediate later and a gallium nitride material layer. The compositionally-graded transition layer has a back surface and a top surface, and includes a gallium nitride alloy. The gallium concentration in the compositionally-graded transition layer increases from the back surface to the front surface. The intermediate layer is formed under the compositionally-graded transition layer. The gallium nitride material layer is formed over the compositionally-graded transition layer, and has a crack level of less than 0.005 μm/μm 2 .

Claims (22)

1. A semiconductor material, comprising:

a compositionally-graded transition layer having a back surface and a top surface, the compositionally-graded transition layer comprising a gallium nitride alloy, wherein a gallium concentration in the compositionally-graded transition layer increases from the back surface to the front surface;

an intermediate layer formed under the compositionally-graded transition layer; and

a gallium nitride material layer formed over the compositionally-graded transition layer, the gallium nitride material layer having a crack level of less than 0.005 μm/μm 2 .

2. The semiconductor material of claim 1 , wherein the composition of the compositionally-graded transition layer is graded continuously across the thickness of the transition layer.

3. The semiconductor material of claim 1 , wherein the composition of the compositionally-graded transition layer is graded discontinuously across the thickness of the transition layer.

4. The semiconductor material of claim 1 , wherein the compositionally-graded transition layer comprises an alloy of gallium nitride selected from the group consisting of Al x In y Ga (1-x-y) N, In y Ga (1-y) N, and Al x Ga (1-x) N.

5. The semiconductor material of claim 4 , wherein the concentration of gallium in the compositionally-graded transition layer is graded.

6. The semiconductor material of claim 4 , wherein x and/or y is varied from a first value at the back surface of the compositionally-graded transition layer to a second value at the top surface of the compositionally-graded transition layer, and wherein the back surface is closer to the intermediate layer than the top surface.

7. The semiconductor material of claim 6 , wherein the compositionally-graded transition layer comprises GaN at the top surface of the transition layer in contact with the gallium nitride material layer and is free of gallium at the back surface of the transition layer in contact with the intermediate layer.

8. The semiconductor material of claim 4 , wherein the compositionally-graded transition layer comprises Al x Ga (1-x) N.

9. The semiconductor material of claim 4 , wherein the value of x decreases in a direction away from the intermediate layer.

10. The semiconductor material of claim 4 , wherein the value of y remains constant across the thickness of the compositionally-graded transition layer.

11. The semiconductor material of claim 1 , wherein the compositionally-graded transition layer comprises a superlattice.

12. The semiconductor material of claim 1 , wherein the gallium nitride material layer comprises GaN.

13. The semiconductor material of claim 1 , wherein the semiconductor material forms a semiconductor device.

14. The semiconductor material of claim 13 , wherein the semiconductor material forms an LED (light emitting diode).

15. The semiconductor material of claim 13 , wherein the semiconductor material forms a FET (field effect transistor).

16. The semiconductor material of claim 1 , wherein the gallium nitride material layer has a crack level of less than 0.001 μm/μm 2 .

17. The semiconductor material of claim 1 , wherein the gallium nitride material layer is substantially free of cracks.

18. The semiconductor material of claim 1 , wherein the gallium nitride material layer is monocrystalline.

19. The semiconductor material of claim 1 , wherein the compositionally-graded transition layer comprises an alloy of gallium nitride including Al x In y Ga (1-x-y) N, and wherein at least a portion of the compositionally-graded transition layer is discontinuously graded.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL: 047629 FRAME: 0077. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Dec 14, 2018
From: WEEKS, T. WARREN, JR.; PINER, EDWIN L.; GEHRKE, THOMAS; LINTHICUM, KEVIN J.
To: NITRONEX CORPORATION
Reel/Frame 047904/0947 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 047629 FRAME: 0122. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Dec 14, 2018
From: NITRONEX CORPORATION
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 047908/0474 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2018
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 047629/0153 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2018
From: WEEKS, T. WARREN, JR.; PINER, EDWIN L.; GEHRKE, THOMAS; LINTHICUM, KEVIN J.
To: NITRONIX CORPORATION
Reel/Frame 047629/0077 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2018
From: NITRONIX CORPORATION
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 047629/0122 →
CHANGE OF NAME Recorded Jul 23, 2018
From: INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 046612/0968 →
CONFIDENTIAL EXCLUSIVE LICENSE AND IP PURCHASE AGREEMENTS THAT RESTRICT PATENT ASSIGNMENT BY CURRENT OWNER (ONLY NON-CONFIDENTIAL, PUBLIC MATERIALS SUMMARIZING AGREEMENTS AND LITIGATION DISPUTES RELATING TO THE SAME ATTACHED) Recorded Nov 3, 2017
From: INTERNATIONAL RECTIFIER CORPORATION
To: NITRONEX LLC; MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 044532/0627 →
Continuity (9)
Continuation 14743218 · Jun 18, 2015
Continuation 14452203 · Aug 5, 2014
Continuation 14083923 · Nov 19, 2013
Continuation 13728956 · Dec 27, 2012
Continuation 13359892 · Jan 27, 2012
Continuation 12343616 · Dec 24, 2008
Division 10675798 · Sep 30, 2003
Continuation 09736972 · Dec 14, 2000
Related Publication 20170047407A1 · Feb 16, 2017
Cited By (3)
US 12,272,761 US 12,364,059 US 12,376,424