IP Library Granted Patent US 9,697,881
Granted Patent B2
US 9,697,881 · App. 15/241,550 · Granted Jul 4, 2017

Methods of operating ferroelectric memory cells, and related ferroelectric memory cells and capacitors

Inventors: Steven C. Nicholes (Meridian, ID); Ashonita A. Chavan (Boise, ID); Matthew N. Rocklein (Boise, ID)
Assignee: Micron Technology, Inc.
G11C11/2273G11C11/22G11C11/221G11C11/5657G11C14/00H01L27/11502H01L27/11507
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Quick Facts
Patent No.
US 9,697,881
App. No.
15/241,550
Granted
Jul 4, 2017
Kind
B2
Abstract

Methods of operating a ferroelectric memory cell. The method comprises applying one of a positive bias voltage and a negative bias voltage to a ferroelectric memory cell comprising a capacitor including a top electrode, a bottom electrode, a ferroelectric material between the top electrode and the bottom electrode, and an interfacial material between the ferroelectric material and one of the top electrode and the bottom electrode. The method further comprises applying another of the positive bias voltage and the negative bias voltage to the ferroelectric memory cell to switch a polarization of the ferroelectric memory cell, wherein an absolute value of the negative bias voltage is different from an absolute value of the positive bias voltage. Ferroelectric memory cells are also described.

Claims (30)

1. A method of operating a ferroelectric memory cell, the method comprising:

applying one of a positive bias voltage or a negative bias voltage to a ferroelectric memory cell comprising a ferroelectric capacitor; and

applying another of the positive bias voltage or the negative bias voltage to the ferroelectric memory cell to switch a polarization of the ferroelectric memory cell, the negative bias voltage having a different magnitude than the positive bias voltage.

2. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage comprises applying one of the positive bias voltage or the negative bias voltage having an absolute value between about twenty-five percent and about ninety-nine percent of an absolute value of the other of the positive bias voltage or the negative bias voltage.

3. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage comprises applying one of the positive bias voltage or the negative bias voltage having an absolute value between about sixty percent and about seventy-five percent of an absolute value of the other of the positive bias voltage or the negative bias voltage.

4. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage to a ferroelectric memory cell comprises applying the one of the positive voltage or the negative voltage to the ferroelectric capacitor, the ferroelectric capacitor comprising an interfacial material between one of a first electrode or a second electrode and directly on and contacting one of the first electrode or the second electrode.

5. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage to a ferroelectric memory cell comprises applying one of the positive bias voltage or the negative bias voltage to the ferroelectric capacitor, the ferroelectric capacitor comprising an interfacial material comprising titanium oxide or aluminum nitride.

6. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage to a ferroelectric memory cell comprises applying one of the positive bias voltage or the negative bias voltage to the ferroelectric capacitor, the ferroelectric capacitor comprising a top electrode having a different thickness than a bottom electrode thereof.

7. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage to a ferroelectric memory cell comprises applying one of the positive bias voltage or the negative bias voltage to the ferroelectric capacitor, the ferroelectric capacitor comprising at least one electrode comprising titanium aluminum nitride.

8. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage to a ferroelectric memory cell comprises applying one of the positive bias voltage or the negative bias voltage to the ferroelectric capacitor, the ferroelectric capacitor comprising at least one of hafnium oxide or zirconium oxide between a top electrode and a bottom electrode.

9. The method of claim 1 , wherein applying one of a positive bias voltage or a negative bias voltage to a ferroelectric memory cell comprises applying one of the positive bias voltage or the negative bias voltage to the ferroelectric capacitor, the ferroelectric capacitor having a positive remnant polarization that is different from a negative remnant polarization.

10. The method of claim 1 , further comprising altering at least one of the positive bias voltage or the negative bias voltage after a predetermined number of cycles.

11. A ferroelectric memory cell, comprising:

a capacitor, the capacitor comprising:

a first electrode comprising titanium aluminum nitride;

a second electrode comprising titanium nitride, titanium aluminum nitride, or tantalum nitride; and

a ferroelectric material comprising hafnium oxide, zirconium oxide, or a combination thereof between the first electrode and the second electrode.

12. The ferroelectric memory cell of claim 11 , further comprising an interfacial material between the first electrode and the second electrode.

13. The ferroelectric memory cell of claim 12 , wherein the interfacial material comprises titanium oxide or aluminum nitride.

14. The ferroelectric memory cell of claim 11 , wherein the ferroelectric material further comprises a dopant comprising silicon, aluminum, zirconium, magnesium, strontium, gadolinium, yttrium, or combinations thereof.

15. The ferroelectric memory cell of claim 11 , wherein the second electrode comprises titanium nitride.

16. A capacitor comprising:

a first electrode comprising titanium nitride;

a ferroelectric material comprising hafnium oxide, zirconium oxide, or a combination thereof;

a second electrode over the ferroelectric material; and

an interfacial material comprising aluminum nitride or titanium oxide between the first electrode and the second electrode.

17. The capacitor of claim 16 , wherein the second electrode comprises titanium nitride.

18. The capacitor of claim 16 , wherein the second electrode comprises titanium aluminum nitride.

19. The capacitor of claim 16 , wherein the ferroelectric material comprises hafnium oxide and directly overlies and contacts the interfacial material.

20. The capacitor of claim 16 , wherein the interfacial material directly overlies and contacts the first electrode.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050680/0268 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 2 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041671/0902 →
Continuity (2)
Continuation 14842124 · Sep 1, 2015
Related Publication 20170062037A1 · Mar 2, 2017