Semiconductor memory system
According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.
1. A semiconductor device comprising:
a substrate; and
a plurality of nonvolatile semiconductor memories mounted on the substrate, wherein the substrate includes:
a first main surface and a second main surface, the second main surface facing a direction opposite to a direction in which the first main surface is facing;
a first wiring layer provided on the first main surface, the nonvolatile semiconductor memories being mounted on the first wiring layer;
a second wiring layer provided on the second main surface;
a plurality of wiring layers disposed as an inner layer; and
a plurality of insulating layers provided between the first wiring layer, the plurality of wiring layers, and the second wiring layer, wherein
an average value of a wiring density of the wiring layers and the second wiring layer that are disposed on the second main surface side with respect to a center line of a layer structure of the substrate is equal to or greater than an average value of a wiring density of the wiring layers and the first wiring layer that are disposed on the first main surface side with respect to the center line of the layer structure of the substrate, and a difference between these average values is 7.5% or less, and
a wiring density of at least one of the plurality of wiring layers is 80% or greater.
2. The semiconductor device according to claim 1 , wherein
a third wiring layer is among the wiring layers formed as the inner layer; and
a fourth wiring layer and the first wiring layer are signal layers for signal transmission and reception, the fourth wiring layer being among the wiring layers disposed as the inner layer, the fourth wiring layer facing the third wiring layer, with an insulating layer provided therebetween.
3. The semiconductor device according to claim 1 , wherein
at least one of the plurality of wiring layers formed as the inner layer is a signal layer for signal transmission and reception,
the signal layer faces a sixth wiring layer and a seventh wiring layer, with insulating layers provided therebetween, the sixth wiring layer and the seventh wiring layer being among the plurality of wiring layers, and
wiring densities of the sixth wiring layer and the seventh wiring layer are 80% or greater.
4. The semiconductor device according to claim 1 , wherein
the first wiring layer, the second wiring layer, and the plurality of wiring layers disposed as the inner layer are configured of eight wiring layers, wherein
four layers out of the eight wiring layers are signal layers for signal transmission and reception, and
the remaining four layers are wiring layers that include a ground or a power line.
5. The semiconductor device according to claim 1 , further comprising:
a drive control circuit mounted on the first main surface of the substrate, wherein
the plurality of nonvolatile semiconductor memories are controlled by the drive control circuit.
6. The semiconductor device according to claim 5 , further comprising:
a volatile memory mounted on the first main surface of the substrate;
the substrate including a connector, the connector being capable of being connected to a computer, wherein
the substrate has a substantially rectangle shape in a plan view,
the nonvolatile semiconductor memories are four NAND-type flash memories, the nonvolatile semiconductor memories being mounted on the first main surface of the substrate, and the nonvolatile semiconductor memories being mounted on a side opposite to the volatile memory as viewed from a position of the drive control circuit in a plan view, and
the volatile memory, the drive control circuit, and the four NAND-type flash memories are arranged along a long side direction of the substrate.
7. The semiconductor device according to claim 6 , wherein
the connector is provided on a short side of the substrate, the connector being provided on a side opposite to the drive control circuit as viewed from a position of the volatile memory in a plan view, and
the connector, the volatile memory, the drive control circuit, and the four NAND-type flash memories are arranged along a long side direction of the substrate.
8. The semiconductor device according to claim 1 , wherein
a first average value that is an average value of a wiring density of the plurality of wiring layers and the first wiring layer, which are disposed on the first main surface side with respect to the center line of the layer structure of the substrate, and a second average value that is an average value of a wiring density of the plurality of wiring layers and the second wiring layer, which are disposed on the second main surface side with respect to the center line of the layer structure of the substrate, are both 60% or greater, and
a second value, which is an absolute value of a difference between a wiring density of a wiring layer disposed on the first main surface side with respect to the center line of the layer structure of the substrate and closest to the center line among the plurality of wiring layers disposed as the inner layer and a wiring density of a wiring layer disposed on the second main surface side with respect to the center line of the layer structure of the substrate and closest to the center line among the plurality of wiring layers disposed as the inner layer, is greater than a first value, which is an absolute value of a difference between the first average value and the second average value.
9. The semiconductor device according to claim 8 , wherein a wiring density of a fourth wiring layer facing a third wiring layer with an insulating layer therebetween is smaller than the first average value, the third wiring layer facing the first wiring layer with an insulating layer therebetween, the third wiring layer and the fourth wiring layer being wiring layers of the plurality of wiring layers disposed as the inner layer.
10. The semiconductor device according to claim 8 , wherein a wiring density of a sixth wiring layer facing a fifth wiring layer with an insulating layer therebetween is smaller than the second average value, the fifth wiring layer facing the second wiring layer with an insulating layer therebetween, the fifth wiring layer and the sixth wiring layer being wiring layers of the plurality of wiring layers disposed as the inner layer.
11. A semiconductor device comprising:
a substrate; and
a plurality of nonvolatile semiconductor memories mounted on the substrate, wherein the substrate includes:
a first main surface and a second main surface, the second main surface facing a direction opposite to a direction in which the first main surface is facing;
a first wiring layer provided on the first main surface, the nonvolatile semiconductor memories being mounted on the first wiring layer;
a second wiring layer provided on the second main surface;
a plurality of wiring layers disposed as an inner layer; and
a plurality of insulating layers provided between the first wiring layer, the plurality of wiring layers, and the second wiring layer, wherein
an average value of a wiring density of the plurality of wiring layers and the second wiring layer, which are disposed on a second main surface side with respect to a center line of a layer structure of the substrate, is equal to or greater than an average value of a wiring density of the plurality of wiring layers and the first wiring layer, which are disposed on a first main surface side with respect to the center line of the layer structure of the substrate,
a difference between the average value of the wiring density of the plurality of wiring layers and the second wiring layer, which are disposed on the second main surface side with respect to the center line of the layer structure of the substrate, and the average value of the wiring density of the plurality of wiring layers and the first wiring layer, which are disposed on the first main surface side with respect to the center line of the layer structure of the substrate, is 7.5% or less, and
a wiring density of a fifth wiring layer is 80% or greater, the fifth wiring layer being among the wiring layers disposed as the inner layer, the fifth wiring layer facing the second wiring layer, with an insulating layer provided therebetween.
12. The semiconductor device according to claim 11 , wherein
a third wiring layer is among the wiring layers formed as the inner layer; and
a fourth wiring layer and the first wiring layer are signal layers for signal transmission and reception, the fourth wiring layer being among the wiring layers disposed as the inner layer, the fourth wiring layer facing the third wiring layer, with an insulating layer provided therebetween.
13. The semiconductor device according to claim 11 , wherein
at least one of the plurality of wiring layers formed as the inner layer is a signal layer for signal transmission and reception,
the signal layer faces a sixth wiring layer and a seventh wiring layer, with insulating layers provided therebetween, the sixth wiring layer and the seventh wiring layer being among the plurality of wiring layers, and
wiring densities of the sixth wiring layer and the seventh wiring layer are 80% or greater.
14. The semiconductor device according to claim 11 , wherein
the first wiring layer, the second wiring layer, and the plurality of wiring layers disposed as the inner layer are configured of eight wiring layers, wherein
four layers out of the eight wiring layers are signal layers for signal transmission and reception, and
the remaining four layers are wiring layers that include a ground or a power line.
15. The semiconductor device according to claim 11 , further comprising:
a drive control circuit mounted on the first main surface of the substrate, wherein
the plurality of nonvolatile semiconductor memories are controlled by the drive control circuit.
16. The semiconductor device according to claim 15 , further comprising:
a volatile memory mounted on the first main surface of the substrate;
the substrate including a connector, the connector being capable of being connected to a computer, wherein
the substrate has a substantially rectangle shape in a plan view,
the nonvolatile semiconductor memories are four NAND-type flash memories, the nonvolatile semiconductor memories being mounted on the first main surface of the substrate, and the nonvolatile semiconductor memories being mounted on a side opposite to the volatile memory as viewed from a position of the drive control circuit in a plan view, and
the volatile memory, the drive control circuit, and the four NAND-type flash memories are arranged along a long side direction of the substrate.
17. The semiconductor device according to claim 16 , wherein
the connector is provided on a short side of the substrate, the connector being provided on a side opposite to the drive control circuit as viewed from a position of the volatile memory in a plan view, and
the connector, the volatile memory, the drive control circuit, and the four NAND-type flash memories are arranged along a long side direction of the substrate.
18. The semiconductor device according to claim 11 , wherein
a first average value that is an average value of a wiring density of the plurality of wiring layers and the first wiring layer, which are disposed on the first main surface side with respect to the center line of the layer structure of the substrate, and a second average value that is an average value of a wiring density of the plurality of wiring layers and the second wiring layer, which are disposed on the second main surface side with respect to the center line of the layer structure of the substrate, are both 60% or greater, and
a second value, which is an absolute value of a difference between a wiring density of a wiring layer disposed on the first main surface side with respect to the center line of the layer structure of the substrate and closest to the center line among the plurality of wiring layers disposed as the inner layer and a wiring density of a wiring layer disposed on the second main surface side with respect to the center line of the layer structure of the substrate and closest to the center line among the plurality of wiring layers disposed as the inner layer, is greater than a first value, which is an absolute value of a difference between the first average value and the second average value.
19. The semiconductor device according to claim 18 , wherein a wiring density of a fourth wiring layer facing a third wiring layer with an insulating layer therebetween is smaller than the first average value, the third wiring layer facing the first wiring layer with an insulating layer therebetween, the third wiring layer and the fourth wiring layer being wiring layers of the plurality of wiring layers disposed as the inner layer.
20. The semiconductor device according to claim 18 , wherein a wiring density of a sixth wiring layer facing a fifth wiring layer with an insulating layer therebetween is smaller than the second average value, the fifth wiring layer facing the second wiring layer with an insulating layer therebetween, the fifth wiring layer and the sixth wiring layer being wiring layers of the plurality of wiring layers disposed as the inner layer.
21. The semiconductor device according to claim 1 , wherein
three wiring layers are among the plurality of wiring layers disposed as an inner layer and are plane layers; and
among the three wiring layers, one wiring layer is disposed on the first main surface side with respect to a center line of a layer structure of the substrate and two wiring layers other than the one wiring layer are disposed on the second main side with respect to a center line of a layer structure of the substrate.
22. The semiconductor device according to claim 21 , wherein
at least one of the wiring layers among the wiring layers disposed as the inner layer is a signal layer for signal transmission and reception; and
the signal layer faces the two wiring layers, with the insulating layers provided therebetween.