IP Library Granted Patent US 10,054,637
Granted Patent B2
US 10,054,637 · App. 15/254,993 · Granted Aug 21, 2018

Testing multi-core integrated circuit with parallel scan test data inputs and outputs

Inventors: Zhiyong Hao (Shanghai, CN); Yuliang Zhou (Hangzhou, CN); Yongfeng Zhu (Shanghai, CN)
Assignee: NXP USA, INC.
G01R31/3177G01R31/31703G01R31/31713G01R31/31723G01R31/318561G01R31/318563G01R31/318572
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Quick Facts
Patent No.
US 10,054,637
App. No.
15/254,993
Granted
Aug 21, 2018
Kind
B2
Abstract

Testing an integrated circuit (IC) that has a set of nominally similar cores and pairs of test data input (TDI) and test data output (TDO) pads common to the different cores. Similar scan chains in parallel in the different cores provide response signals as functions of corresponding TDI signals. Respective combined TDO signals are provided to the TDO pads. In the absence of a defect, the combined TDO signals are asserted and de-asserted like the response signals from corresponding chains in the different cores and like corresponding expected response signals. The combined TDO signals are different from the corresponding expected response signals in the presence of a defect in at least one of the cores. If the result is a fail, the ATE may identify a defective core using a diagnosis module in the IC providing response signals from a selected core.

Claims (25)

1. A multi-core integrated circuit, comprising:

a set of nominally similar cores;

pairs of test data input (TDI) and test data output (TDO) pads, and corresponding expected response input pads, that are common to the different cores of the set;

wherein the cores are each configurable in a test mode with a plurality of scan chains, wherein similar scan chains in the different cores are connected in common to respective TDI pads and provide response signals from the different cores as functions of corresponding TDI signals applied to the respective common TDI pads;

respective conjunction modules for the different scan chains providing to the TDO pads respective combined TDO signals that in the absence of a defect are asserted and de-asserted like the response signals from corresponding chains in the different cores and like expected response signals applied to the expected response input pads for the corresponding scan chains; and

wherein the combined TDO signals are asserted and de-asserted differently from the expected response signals for the corresponding scan chains in the presence of a defect in at least one of the cores.

2. The integrated circuit of claim 1 , further comprising:

a diagnosis module for use in identifying a defective core, and that provides response signals from a selected core to the TDO pads when a diagnosis mode is actuated.

3. The integrated circuit of claim 2 , wherein the diagnosis module provides to the TDO pads the response signals from the selected core in the diagnosis mode, and provides to the TDO pads the combined TDO signals from the conjunction modules when the diagnosis mode is de-actuated.

4. The integrated circuit of claim 3 , wherein the diagnosis module comprises respective core select multiplexers selecting the response signals from a selected core for each corresponding chain as a function of a core select signal, and respective diagnosis select multiplexers selecting for each corresponding chain the outputs from the core select multiplexers in the test mode or the outputs from the diagnosis select multiplexers in the diagnosis mode as a function of a diagnosis signal.

5. The integrated circuit of claim 1 , wherein the conjunction modules for the different scan chains comprise respective first and second conjunction modules, wherein the first conjunction modules for the different scan chains provide to the TDO pads respective first combined TDO signals that in the absence of defect are asserted like the response signals from the corresponding chains in the different cores and like expected response signals applied to the expected response input pads for the corresponding scan chains, and wherein the second conjunction modules for the different scan chains provide to the TDO pads respective second combined TDO signals that in the absence of defect are de-asserted like the response signals from corresponding chains in the different cores and like the expected response signals for the corresponding scan chains.

6. The integrated circuit of claim 5 , wherein the first conjunction modules include respective AND gates for each chain receiving the response signals from the cores of the set, and the second conjunction modules include respective OR gates for each chain receiving the response signals from the cores of the set, and wherein for each chain the first or second combined TDO signals are selected for the TDO pads as a function of the expected response signals for the corresponding scan chains being asserted or de-asserted.

7. The integrated circuit of claim 6 , wherein the conjunction modules for the different scan chains comprise respective multiplexers controlled as a function of assertion and de-assertion of the expected response signals for the corresponding scan chains, wherein the multiplexers select the first or second combined TDO signals and provide the selected combined TDO signals to the corresponding TDO pads.

8. A multi-core integrated circuit comprising:

a set of nominally similar cores;

pairs of test data input (TDI) and test data output (TDO) pads, and corresponding expected response input pads, that are common to the different cores of the set;

wherein the cores are each configurable in a test mode with a plurality of scan chains, wherein similar scan chains in the different cores are connected in common to respective TDI pads and provide response signals from the different cores as functions of corresponding TDI signals applied to the respective common TDI pads;

respective first conjunction modules for the different scan chains providing to the TDO pads respective first combined TDO signals that in the absence of defect are asserted like the response signals from corresponding chains in the different cores and like expected response signals applied to the expected response input pads for the corresponding scan chains; and

respective second conjunction modules for the different scan chains providing to the TDO pads respective second combined TDO signals that in the absence of defect are de-asserted like the response signals from the corresponding chains in the different cores and like the expected response signals for the corresponding scan chains; and

wherein the combined TDO signals are asserted and de-asserted differently from the expected response signals for the corresponding scan chains in the presence of a defect in at least one of the cores.

9. The integrated circuit of claim 8 , further comprising:

a diagnosis module for use in identifying a defective core, and that provides response signals from a selected core to the TDO pads when a diagnosis mode is actuated.

10. The integrated circuit of claim 8 , wherein the first conjunction modules include respective AND gates for each chain receiving the response signals from the cores of the set, and the second conjunction modules include respective OR gates for each chain receiving the response signals from the cores of the set, and wherein for each chain the first or second combined TDO signals are selected for the TDO pads as a function of the expected response signals for the corresponding scan chains being asserted or de-asserted.

11. The integrated circuit of claim 10 , further comprising:

multiplexers controlled as a function of assertion and de-assertion of the expected response signals for the corresponding scan chains and that select the first or second combined TDO signals and provide the selected combined TDO signals to the corresponding TDO pads.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2016
From: HAO, ZHIYONG; ZHAO, YULIANG; ZHU, YONGFENG
To: FREESCALE SEMICONDUCTOR,INC.
Reel/Frame 039618/0688 →
Priority Claims (1)
CN 2015 1 1035978 · Nov 11, 2015 · national
Continuity (1)
Related Publication 20170131351A1 · May 11, 2017
Cited By (1)
US 12,196,804