Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.
1. A substrate holder for use in a lithographic apparatus, the substrate holder comprising:
a main body; and
a plurality of burls provided on the main body and having end surfaces to support a substrate, wherein the burls each comprise a lower portion protruding from the main body and an upper body portion above the lower body portion, wherein the lower body portions are a different material than the upper body portions, the upper body portions comprise diamond-like carbon, and the upper portions are separated from each other such that they are unconnected by diamond-like carbon to each other.
2. The substrate holder according to claim 1 , wherein the main body is formed of a different material than the burls.
3. A substrate holder for use in a lithographic apparatus, the substrate holder comprising:
a main body; and
a plurality of projections protruding from the main body, wherein each of the projections comprise a first portion and a second portion, wherein the first portions are of a different material than the second portions, the second portions comprise diamond-like carbon, the second portions are separated from each other by an open gap between them, the first portions are separated from each other by an open gap between them, and the second portions are outward, relative to the main body, from the first portions.
4. A lithographic apparatus, comprising:
a support structure configured to support a patterning device;
a projection system arranged to project a beam patterned by the patterning device onto a substrate; and
a substrate holder arranged to hold the substrate, the substrate holder being according to claim 3 .
5. A method of manufacturing a substrate holder for use in a lithographic apparatus, the method comprising:
providing a main body;
forming a plurality of burls protruding from the main body, the forming comprising:
forming a lower body portion, protruding from the main body, of each of the burls, and
forming, on each lower body portion, an upper body portion above the respective lower body portion,
wherein the lower body portions are a different material than the upper body portions, the upper body portions comprise diamond-like carbon, and the upper portions are separated from each other such that they are unconnected by diamond-like carbon to each other.
6. The substrate holder according to claim 1 , wherein the main body comprises at least one material selected from the group consisting of:
Zerodur ceramic, cordierite, SiSiC, SiC, AIN, SiSiC, ceramic and glass-ceramic.
7. The substrate holder according to claim 1 , wherein the burls project from the main body by a distance selected from the range of from 1 to 250 μm.
8. The substrate holder according to claim 1 , wherein the burls are cylindrical.
9. The substrate holder according to claim 1 , wherein the lower body portion comprises at least one material selected from the group consisting of: SiC, SiO 2 , TiN and CrN.
10. The substrate holder according to claim 1 , further comprising a thin-film stack forming an electric or electronic component, the thin-film stack located at an upper surface of the main body.
11. The substrate holder according to claim 10 , wherein the component is a component selected from the group consisting of: an electrode, a heater, a sensor, a transistor and a logic device.
12. A lithographic apparatus, comprising:
a support structure configured to support a patterning device;
a projection system arranged to project a beam patterned by the patterning device onto a substrate; and
a substrate holder arranged to hold the substrate, the substrate holder being according to claim 1 .
13. The substrate holder according to claim 3 , wherein the projections project from the main body by a distance selected from the range of from 1 to 250 μm.
14. The substrate holder according to claim 3 , wherein the projections are cylindrical.
15. The substrate holder according to claim 3 , wherein the first portions comprise at least one material selected from the group consisting of: SiC, SiO 2 , TiN and CrN.
16. The substrate holder according to claim 3 , further comprising a thin-film stack forming an electric or electronic component, the thin-film stack located at a surface of the main body.
17. The substrate holder according to claim 16 , wherein the component is a component selected from the group consisting of: an electrode, a heater, a sensor, a transistor and a logic device.
18. The method according to claim 5 , wherein the lower body portion comprises at least one material selected from the group consisting of: SiC, SiO 2 , TiN and CrN.
19. The method according to claim 5 , further comprising forming a thin-film stack that forms an electric or electronic component, at an upper surface of the main body.
20. The method according to claim 5 , wherein the burls project from the main body by a distance selected from the range of from 1 to 250 μm.