IP Library Granted Patent US 12,366,808
Granted Patent B2
US 12,366,808 · App. 18/635,589 · Granted Jul 22, 2025

Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder

Inventors: Raymond Wilhelmus Louis Lafarre (Helmond, NL); Sjoerd Nicolaas Lambertus Donders (Vught, NL); Nicolaas Ten Kate (Almkerk, NL); Nina Vladimirovna Dziomkina (Eindhoven, NL); Yogesh Pramod Karade (Eindhoven, NL); Elisabeth Corinne Rodenburg (Heeze, NL)
Assignee: ASML NETHERLANDS B.V.
G03F7/70341B05D3/06B05D5/00B22F7/062B22F10/00B22F10/20B23K26/342B23K26/354B23Q3/18B33Y10/00B33Y80/00G03F7/20G03F7/70416G03F7/707G03F7/70708G03F7/70716G03F7/70733G03F7/708B22F10/25B22F10/28B22F10/66
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,366,808
App. No.
18/635,589
Granted
Jul 22, 2025
Kind
B2
Abstract

A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.

Claims (44)

1. A substrate holder for use in a lithographic apparatus, the substrate holder comprising:

a main body having a first side of the main body and a second side of the main body opposite to the first side;

a plurality of first burls at the first side of the main body and having end surfaces to support a substrate; and

a plurality of second burls at the second side of the main body,

wherein each of the first burls and/or second burls has a cross-sectional width in a range of about 250 μm to about 500 μm, and

wherein the main body is grounded.

2. The substrate holder of claim 1 , wherein each of the first burls comprise a first body portion protruding from the main body and a second body portion located further from the main body than the first body portion, wherein the first body portions comprise a different material than the second body portions.

3. The substrate holder of claim 1 , wherein the first burls comprise a material selected from: diamond, diamond-like carbon, SiC, SiO 2 , TiN, cubic boron nitride, silicon nitride, titanium, titanium carbide, cordierite or aluminum nitride.

4. The substrate holder of claim 3 , wherein the material comprises diamond or diamond-like carbon.

5. The substrate holder of claim 1 , further comprising a layer between the plurality of first burls.

6. The substrate holder of claim 1 , further comprising a heater provided to the main body and configured to control a temperature of the substrate and/or the main body.

7. A lithographic apparatus, comprising:

a support structure configured to support a patterning device;

a projection system arranged to project a beam patterned by the patterning device onto a substrate; and

a substrate holder arranged to hold the substrate, the substrate holder being according to claim 1 .

8. A substrate holder for use in a lithographic apparatus, the substrate holder comprising:

a main body having a first side of the main body and a second side of the main body opposite to the first side;

a plurality of first burls at the first side of the main body and having end surfaces to support a substrate;

a plurality of second burls at the second side of the main body,

wherein spacing between the first burls and/or between the second burls is between about 1.5 mm to about 3 mm, and

wherein the main body is grounded.

9. The substrate holder of claim 8 , further comprising a layer between the plurality of first burls.

10. The substrate holder of claim 8 , wherein at least a distal portion of each of the first burls comprises a material selected from: diamond, diamond-like carbon, SiC, SiO 2 , TiN, cubic boron nitride, silicon nitride, titanium, titanium carbide, cordierite or aluminum nitride.

11. The substrate holder of claim 8 , wherein the main body comprises at least one material selected from: Zerodur ceramic, cordierite, SiSiC, SiC, aluminum nitride (AlN), SiSiC, ceramic or glass-ceramic.

12. The substrate holder of claim 8 , wherein the main body is formed of a different material from the first and/or second burls.

13. The substrate holder of claim 8 , further comprising a heater provided to the main body and configured to control a temperature of the substrate and/or the main body.

14. A lithographic apparatus, comprising:

a support structure configured to support a patterning device;

a projection system arranged to project a beam patterned by the patterning device onto a substrate; and

a substrate holder arranged to hold the substrate, the substrate holder being according to claim 8 .

15. A substrate holder for use in a lithographic apparatus, the substrate holder comprising:

a main body having a first side of the main body and a second side of the main body opposite to the first side;

a plurality of first burls at the first side of the main body and having end surfaces to support a substrate; and

a plurality of second burls at the second side of the main body,

wherein the main body comprises at least one material selected from: cordierite, SiSiC, SiC, Zerodur ceramic, Invar alloy, ULE glass, aluminum nitride (AlN), ceramic, glass-ceramic, fused silica, boron nitride, or silicon nitride, and

wherein the main body is grounded.

16. The substrate holder of claim 15 , further comprising a heater provided to the main body and configured to control a temperature of the substrate and/or the main body.

17. The substrate holder of claim 15 , wherein (1) the main body has a thickness in a range of 1 mm to 50 mm, (2) each of the first burls and/or second burls has a height in a range of about 5 μm to about 250 μm, and/or (3) a total area of all the burls on one side of the main body is less than 3% of the total surface area of the main body.

18. The substrate holder of claim 15 , wherein each of the first burls comprise a first body portion protruding from the main body and a second body portion located further from the main body than the first body portion, wherein the first body portions comprise a different material than the second body portions, and wherein the second body portions comprise a material selected from: diamond, diamond-like carbon, SiC, SiO 2 , TiN, cubic boron nitride, silicon nitride, titanium, titanium carbide, cordierite or aluminum nitride.

19. The substrate holder of claim 15 , wherein the number of first burls distributed across the substrate holder is more than 10,000.

20. A lithographic apparatus, comprising:

a support structure configured to support a patterning device;

a projection system arranged to project a beam patterned by the patterning device onto a substrate; and

a substrate holder arranged to hold the substrate, the substrate holder being according to claim 15 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2024
From: LAFARRE, RAYMOND WILHELMUS LOUIS; TEN KATE, NICOLAAS; DZIOMKINA, NINA VLADIMIROVNA; KARADE, YOGESH PRAMOD; RODENBURG, ELISABETH CORINNE
To: ASML NETHERLANDS B.V.
Reel/Frame 067197/0809 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2024
From: LAFARRE, RAYMOND WILHELMUS LOUIS; DONDERS, SJOERD NICOLAAS LAMBERTUS; TEN KATE, NICOLAAS; DZIOMKINA, NINA VLADIMIROVNA; KARADE, YOGESH PRAMOD; RODENBURG, ELISABETH CORINNE
To: ASML NETHERLANDS B.V.
Reel/Frame 067197/0816 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2024
From: LAFARRE, RAYMOND WILHELMUS LOUIS; DONDERS, SJOERD NICOLAAS LAMBERTUS; TEN KATE, NICOLAAS; DZIOMKINA, NINA VLADIMIROVNA; KARADE, YOGESH PRAMOD; RODENBURG, ELISABETH CORINNE
To: ASML NETHERLANDS B.V.
Reel/Frame 067197/0822 →
Continuity (10)
Continuation 18299534 · Apr 12, 2023
Continuation 17587236 · Jan 28, 2022
Continuation 17138480 · Dec 30, 2020
Continuation 16369368 · Mar 29, 2019
Continuation 15261553 · Sep 9, 2016
Continuation 14374197
Provisional Application 61621660 · Apr 9, 2012
Provisional Application 61621648 · Apr 9, 2012
Provisional Application 61594857 · Feb 3, 2012
Related Publication 20240264533A1 · Aug 8, 2024
References Cited (238)
US 4480284A · Tojo et al. · 1984 [cited by applicant]
US 5182170A · Marcus et al. · 1993 [cited by applicant]
US 5368947A · Denney · 1994 [cited by applicant]
US 5583736A · Anderson et al. · 1996 [cited by applicant]
US 5663865A · Kawada et al. · 1997 [cited by applicant]
US 5838529A · Shufflebotham et al. · 1998 [cited by applicant]
US 5885654A · Hagiwara et al. · 1999 [cited by applicant]
US 6033475A · Hasebe et al. · 2000 [cited by applicant]
US 6046426A · Jeantette et al. · 2000 [cited by applicant]
US 6307620B1 · Takabayashi et al. · 2001 [cited by applicant]
US 6413701B1 · Van Empel et al. · 2002 [cited by applicant]
US 6709747B1 · Gordeev et al. · 2004 [cited by applicant]
US 6864957B2 · Van Elp et al. · 2005 [cited by applicant]
US 7050147B2 · Compen · 2006 [cited by applicant]
US 7078715B2 · Vink et al. · 2006 [cited by applicant]
US 7092231B2 · Hoeks et al. · 2006 [cited by applicant]
US 7110085B2 · Zaal et al. · 2006 [cited by applicant]
US 7119885B2 · Ottens et al. · 2006 [cited by applicant]
US 7327439B2 · Zaal et al. · 2008 [cited by applicant]
US 7524735B1 · Gauri et al. · 2009 [cited by applicant]
US 7649611B2 · Zaal et al. · 2010 [cited by applicant]
US 7816022B2 · Ekstein et al. · 2010 [cited by applicant]
US 7940511B2 · Sijben · 2011 [cited by applicant]
US 8228487B2 · Rijpma et al. · 2012 [cited by applicant]
US 9354528B2 · Bex · 2016 [cited by applicant]
US 9442395B2 · Lafarre · 2016 [cited by applicant]
US 9507274B2 · Lafarre · 2016 [cited by applicant]
US 10245641B2 · Lafarre · 2019 [cited by applicant]
US 10898955B2 · Lafarre · 2021 [cited by applicant]
US 11235388B2 · Lafarre · 2022 [cited by applicant]
US 11376663B2 · Lafarre · 2022 [cited by examiner]
US 11628498B2 · Lafarre · 2023 [cited by examiner]
US 11960213B2 · Lafarre · 2024 [cited by examiner]
US 20010033369A1 · Matsui · 2001 [cited by applicant]
US 20020004105A1 · Kunze et al. · 2002 [cited by applicant]
US 20040012767A1 · Van Elp et al. · 2004 [cited by applicant]
US 20040055709A1 · Boyd, Jr. et al. · 2004 [cited by applicant]
US 20040114124A1 · Hoeks et al. · 2004 [cited by applicant]
US 20040160021A1 · Tatsumi et al. · 2004 [cited by applicant]
US 20040207824A1 · Lof et al. · 2004 [cited by applicant]
US 20040217095A1 · Herzog · 2004 [cited by applicant]
US 20040247361A1 · Zaal et al. · 2004 [cited by applicant]
US 20050024620A1 · Van Empel et al. · 2005 [cited by applicant]
US 20050030512A1 · Zaal et al. · 2005 [cited by applicant]
US 20050030515A1 · Ottens et al. · 2005 [cited by applicant]
US 20050041364A1 · Kellerman et al. · 2005 [cited by applicant]
US 20050045106A1 · Boyd et al. · 2005 [cited by applicant]
US 20050061995A1 · Vink et al. · 2005 [cited by applicant]
US 20050095776A1 · Usuami · 2005 [cited by applicant]
US 20050117141A1 · Ottens et al. · 2005 [cited by applicant]
US 20050128444A1 · Ottens et al. · 2005 [cited by applicant]
US 20050128459A1 · Zwet et al. · 2005 [cited by applicant]
US 20050146694A1 · Tokita · 2005 [cited by applicant]
US 20050183669A1 · Parkhe et al. · 2005 [cited by applicant]
US 20050195382A1 · Ottens et al. · 2005 [cited by applicant]
US 20050248746A1 · Zaal et al. · 2005 [cited by applicant]
US 20060006340A1 · Compen · 2006 [cited by applicant]
US 20060033898A1 · Cadee et al. · 2006 [cited by applicant]
US 20060038968A1 · Kemper et al. · 2006 [cited by applicant]
US 20060075969A1 · Fischer · 2006 [cited by applicant]
US 20060102277A1 · Zaal et al. · 2006 [cited by applicant]
US 20060102849A1 · Mertens et al. · 2006 [cited by applicant]
US 20060130750A1 · Ishikawa et al. · 2006 [cited by applicant]
US 20060130767A1 · Herchen · 2006 [cited by applicant]
US 20060139614A1 · Owa et al. · 2006 [cited by applicant]
US 20070017160A1 · Caldwell et al. · 2007 [cited by applicant]
US 20070070319A1 · Nakamura et al. · 2007 [cited by applicant]
US 20070097346A1 · Zaal et al. · 2007 [cited by applicant]
US 20070139855A1 · Van Mierlo et al. · 2007 [cited by applicant]
US 20070146679A1 · Sutedja et al. · 2007 [cited by applicant]
US 20070217114A1 · Sasaki et al. · 2007 [cited by applicant]
US 20070285647A1 · Kwan et al. · 2007 [cited by applicant]
US 20080011737A1 · Fukuoka et al. · 2008 [cited by applicant]
US 20080024743A1 · Kruit et al. · 2008 [cited by applicant]
US 20080043210A1 · Shubuta · 2008 [cited by applicant]
US 20080060828A1 · Shibazaki · 2008 [cited by applicant]
US 20080138504A1 · Williams · 2008 [cited by applicant]
US 20080158538A1 · Puyt et al. · 2008 [cited by applicant]
US 20080212046A1 · Riepen et al. · 2008 [cited by applicant]
US 20080276865A1 · Nishimizu et al. · 2008 [cited by applicant]
US 20080280536A1 · Sasaki et al. · 2008 [cited by applicant]
US 20090079525A1 · Sijben · 2009 [cited by applicant]
US 20090122458A1 · Lischer · 2009 [cited by applicant]
US 20090142615A1 · Ekstein et al. · 2009 [cited by applicant]
US 20090207392A1 · Rijpma et al. · 2009 [cited by applicant]
US 20090262318A1 · Van Den Dungen et al. · 2009 [cited by applicant]
US 20090279060A1 · Direcks et al. · 2009 [cited by applicant]
US 20090279062A1 · Direcks et al. · 2009 [cited by applicant]
US 20090284894A1 · Cooke · 2009 [cited by applicant]
US 20100039747A1 · Sansori et al. · 2010 [cited by applicant]
US 20100193501A1 · Zucker et al. · 2010 [cited by applicant]
US 20100200901A1 · Kim · 2010 [cited by applicant]
US 20100214549A1 · Cadee et al. · 2010 [cited by applicant]
US 20110036990A1 · Stone et al. · 2011 [cited by applicant]
US 20110222032A1 · Ten Kate et al. · 2011 [cited by applicant]
US 20110222033A1 · Ten Kate et al. · 2011 [cited by applicant]
US 20110292561A1 · Kamimura et al. · 2011 [cited by applicant]
US 20120013865A1 · Laurent et al. · 2012 [cited by applicant]
US 20120044609A1 · Cooke et al. · 2012 [cited by applicant]
US 20120147353A1 · Lafarre et al. · 2012 [cited by applicant]
US 20120177942A1 · Chang et al. · 2012 [cited by applicant]
US 20120212725A1 · Lafarre et al. · 2012 [cited by applicant]
US 20120242271A1 · Van Der Toorn et al. · 2012 [cited by applicant]
US 20120274920A1 · Bex et al. · 2012 [cited by applicant]
US 20130094009A1 · Lafarre et al. · 2013 [cited by applicant]
US 20130164688A1 · Cadee et al. · 2013 [cited by applicant]
US 20130189802A1 · Tromp et al. · 2013 [cited by applicant]
US 20130301028A1 · Albert · 2013 [cited by applicant]
US 20150029485A1 · Lafarre · 2015 [cited by applicant]
US 20150311108A1 · Horiuchi · 2015 [cited by applicant]
US 20160111318A1 · Ichinose · 2016 [cited by applicant]
US 20180130692A1 · Ishino · 2018 [cited by applicant]
US 20210114101A1 · Lafarre · 2021 [cited by applicant]
CN 1315022 · 2001 [cited by applicant]
CN 1320108 · 2001 [cited by applicant]
CN 1456933 · 2003 [cited by applicant]
CN 1487360 · 2004 [cited by applicant]
CN 1580956 · 2005 [cited by applicant]
CN 1922724 · 2007 [cited by applicant]
CN 101030041 · 2007 [cited by applicant]
CN 101599453 · 2009 [cited by applicant]
CN 101803001 · 2010 [cited by applicant]
CN 102067302 · 2011 [cited by applicant]
CN 102193331 · 2011 [cited by applicant]
EP 0134438 · 1992 [cited by applicant]
EP 1106859 · 2001 [cited by applicant]
EP 1510868 · 2005 [cited by applicant]
EP 1650604 · 2006 [cited by applicant]
EP 2317546 · 2011 [cited by applicant]
EP 2365390 · 2011 [cited by applicant]
EP 2490073 · 2012 [cited by applicant]
EP 3882700 · 2021 [cited by applicant]
JP H03187240 · 1991 [cited by applicant]
JP H04103750 · 1992 [cited by applicant]
JP 5047909 · 1993 [cited by applicant]
JP H05205997 · 1993 [cited by applicant]
JP 6204324 · 1994 [cited by applicant]
JP H07019831 · 1995 [cited by applicant]
JP 992703 · 1997 [cited by applicant]
JP H09148379 · 1997 [cited by applicant]
JP H09199574 · 1997 [cited by applicant]
JP 09270327 · 1997 [cited by applicant]
JP 09270445 · 1997 [cited by applicant]
JP H09283605 · 1997 [cited by applicant]
JP 1064987 · 1998 [cited by applicant]
JP 2000174105 · 2000 [cited by applicant]
JP 2000202626 · 2000 [cited by applicant]
JP 2000311933 · 2000 [cited by applicant]
JP 2001028333 · 2001 [cited by applicant]
JP 2001237303 · 2001 [cited by applicant]
JP 3250290 · 2001 [cited by applicant]
JP 2003518193 · 2003 [cited by applicant]
JP 2004022859 · 2004 [cited by applicant]
JP 2004022889 · 2004 [cited by applicant]
JP 2004221323 · 2004 [cited by applicant]
JP 2004531067 · 2004 [cited by applicant]
JP 2005029401 · 2005 [cited by applicant]
JP 2005079586 · 2005 [cited by applicant]
JP 2005328045 · 2005 [cited by applicant]
JP 2006024954 · 2006 [cited by applicant]
JP 2006148101 · 2006 [cited by applicant]
JP 2007503123 · 2007 [cited by applicant]
JP 2007158309 · 2007 [cited by applicant]
JP 2007194618 · 2007 [cited by applicant]
JP 2007201068 · 2007 [cited by applicant]
JP 2007527625 · 2007 [cited by applicant]
JP 2007266611 · 2007 [cited by applicant]
JP 2008028052 · 2008 [cited by applicant]
JP 2008085129 · 2008 [cited by applicant]
JP 2008135736 · 2008 [cited by applicant]
JP 2008160093 · 2008 [cited by applicant]
JP 2008189956 · 2008 [cited by applicant]
JP 2009179507 · 2009 [cited by applicant]
JP 2009200486 · 2009 [cited by applicant]
JP 2009246302 · 2009 [cited by applicant]
JP 4378053 · 2009 [cited by applicant]
JP 2010161319 · 2010 [cited by applicant]
JP 2010165776 · 2010 [cited by applicant]
JP 2010199581 · 2010 [cited by applicant]
JP 2011081040 · 2011 [cited by applicant]
JP 2011521470 · 2011 [cited by applicant]
JP 2011167768 · 2011 [cited by applicant]
JP 2011176275 · 2011 [cited by applicant]
JP 2011192991 · 2011 [cited by applicant]
JP 2011192992 · 2011 [cited by applicant]
JP 2011199303 · 2011 [cited by applicant]
JP 2011530833 · 2011 [cited by applicant]
JP 2012129524 · 2012 [cited by applicant]
JP 2012235095 · 2012 [cited by applicant]
KR 20090008658 · 2009 [cited by applicant]
WO 9949504 · 1999 [cited by applicant]
WO 00000921 · 2000 [cited by applicant]
WO 01045882 · 2001 [cited by applicant]
WO 2008047886 · 2008 [cited by applicant]
WO 2008057483 · 2008 [cited by applicant]
WO 2010095540 · 2010 [cited by applicant]
WO 2011051345 · 2011 [cited by applicant]
WO 2011053145 · 2011 [cited by applicant]
WO 2011093451 · 2011 [cited by applicant]
WO 2012005294 · 2012 [cited by applicant]
WO 2013113568 · 2013 [cited by applicant]
WO 2013156236 · 2013 [cited by applicant]
WO 2016164498 · 2016 [cited by applicant]
International Search Report mailed Oct. 23, 2013 in corresponding International Patent Application No. PCT/EP2013/050818. [cited by applicant]
A. Streek et al., “Laser micro sintering—a quality leap through improvement of powder packing,” Laserapplikationszentrum, Fachbereich MPI, Hochschule Mittweida, 12 pages (2008). [cited by applicant]
S. Kloetzer et al., “Micro-Cladding Using a Pulsed Fibre Laser and Scanner,” Proceedings of LPM2010—the 11 [cited by applicant]
H. Exner et al., “Lasermikrosintern von keramischen Materialien” Laserinstitut Mittelsachsen e.V./Hochschule Mittweida, RTejournal, vol. 3, pp. 1-18, Aug. 3, 2006. [cited by applicant]
Robby Ebert et al., “Rapid Microtooling With laser-based procedure,” Laserinstitut der Hochschule Mittweida, Rapid Micro, pp. 1-223 (2006-2011). [cited by applicant]
International Preliminary Report on Patentability mailed Aug. 14, 2014 in corresponding International Patent Application No. PCT/EP2013/050818. [cited by applicant]
Japanese Office Action mailed Aug. 28, 2015 in corresponding Japanese Patent Application No. 2014-555139. [cited by applicant]
Japanese Office Action mailed Sep. 2, 2015 in corresponding Japanese Patent Application No. 2014-555140. [cited by applicant]
U.S. Office Action dated Mar. 25, 2016 in corresponding U.S. Appl. No. 14/373,291. [cited by applicant]
Japanese Office Action dated May 17, 2016 in corresponding Japanese Patent Application No. 2014-555139. [cited by applicant]
Notice of Reasons for Rejection issued in corresponding Japanese Patent Application No. 2016-121468, dated May 1, 2017. [cited by applicant]
Ex parte Quayle Office Action issued in corresponding U.S. Appl. No. 15/296,968, dated Apr. 6, 2017. [cited by applicant]
Office Action issued in corresponding U.S. Appl. No. 15/654,413 dated Aug. 10, 2017. [cited by applicant]
Office Action issued in corresponding U.S. Appl. No. 15/654,413 dated Oct. 6, 2017. [cited by applicant]
Notice of Reasons for Rejection issued in corresponding Japanese Patent Application No. 2016-121468 dated Oct. 3, 2017. [cited by applicant]
Final Office Action dated Mar. 29, 2018 issued in corresponding U.S. Appl. No. 15/654,413. [cited by applicant]
Office Action dated Aug. 21, 2018 issued in corresponding EP Patent Application No. 13 700 893.4. [cited by applicant]
Office Action dated Nov. 1, 2018 issued in corresponding U.S. Appl. No. 15/654,413. [cited by applicant]
European Office Action issued in corresponding EP Patent Application No. 13700401.6 dated Nov. 7, 2018. [cited by applicant]
Notice of Reasons for Rejection dated Jan. 30, 2019 issued in corresponding Japanese Patent Application No. 2018-068277 with English translation. [cited by applicant]
Extended European Search Report dated Sep. 9, 2019 issued in corresponding European Patent Application No. 19174953.0. [cited by applicant]
Non-final Office Action dated Sep. 19, 2019 issued in corresponding U.S. Appl. No. 15/654,413. [cited by applicant]
Final Office Action dated Jan. 2, 2020 issued in corresponding U.S. Appl. No. 15/654,413. [cited by applicant]
Office Action dated Apr. 1, 2020 issued in corresponding Chinese Patent Application No. 201811239416.3. [cited by applicant]
Office Action dated May 7, 2020 issued in corresponding Chinese Patent Application No. 201811326560.0 with English translation. [cited by applicant]
Search Report dated Jun. 23, 2020 issued in corresponding EP Application No. 20160382.6. [cited by applicant]
Office Action dated Oct. 6, 2020 issued in corresponding Japanese Patent Application No. 2019-194121 with English translation. [cited by applicant]
Office Action dated Nov. 2, 2020 issued in corresponding Chinese Patent Application No. 201811326560.0 with English translation. [cited by applicant]
U.S. Final Office Action issued in corresponding U.S. Appl. No. 15/654,413, dated May 15, 2019. [cited by applicant]
Office Action dated Feb. 2, 2021, issued in corresponding Chinese Patent Application No. 201811325912.0 with English translation (9 pgs.). [cited by applicant]
Office Action dated Jan. 29, 2021, issued in corresponding Chinese Patent Application No. 2018112394163 with English translation (21 pgs.). [cited by applicant]
Office Action dated Jun. 20, 2022, issued in corresponding Chinese Patent Application No. 201811325912.0 with English translation (21 pgs.). [cited by applicant]
Office Action dated Sep. 15, 2022, issued in corresponding European Patent Application No. 20160382.6 (8 pgs.). [cited by applicant]
Notice of Reasons for Refusal dated Apr. 19, 2022, issued in corresponding Japanese Patent Application No. 2021-078268 with English translation (4 pgs.). [cited by applicant]
Office Action dated Dec. 23, 2021, issued in corresponding Chinese Patent Application No. 201811325912.0 with English translation (19 pgs.). [cited by applicant]