IP Library Granted Patent US 7,815,492
Granted Patent B2
US 7,815,492 · App. 11/687,879 · Granted Oct 19, 2010

Surface treatment method

Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 7,815,492
App. No.
11/687,879
Granted
Oct 19, 2010
Kind
B2
Abstract

A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.

Claims (14)

1. A surface treatment method for a substrate mounting surface of a stage that is disposed in a substrate processing apparatus that carries out processing on a substrate and has the substrate mounted thereon, the method comprising:

a film forming step of forming a thermally sprayed coating film on the substrate mounting surface;

a flattening step of improving a flatness of the substrate mounting surface by removing minute undulations on the substrate mounting surface; and

a smoothing step of smoothing the substrate mounting surface whose flatness has been improved using tape coated with abrasive grains after said flattening step,

wherein in said smoothing step, the tape is pushed against the substrate mounting surface, on which the thermally sprayed coating film has been formed, by a roller made of an elastic material.

2. A surface treatment method as claimed in claim 1 , wherein said flattening step has a first flattening step of flattening the substrate mounting surface using a grindstone, and a second flattening step of further flattening the flattened substrate mounting surface using a plate coated with abrasive grains by removing minute undulations on the flattened substrate mounting surface.

3. A surface treatment method as claimed in claim 2 , wherein in said second flattening step, a load toward the substrate mounting surface is applied to the plate.

4. A surface treatment method for a thermally sprayed coating film formed on a member to be disposed in a substrate processing apparatus that carries out processing on a substrate, the method comprising:

a film forming step of forming the thermally sprayed coating film;

a flattening step of improving a flatness of a surface of the thermally sprayed coating film; and

a smoothing step of smoothing the surface of the thermally sprayed coating film whose flatness has been improved using tape coated with abrasive grains by removing minute undulations on the surface of the thermally sprayed coating film after said flattening step,

wherein in said smoothing step, the tape is pushed against the surface of the thermally sprayed coating film by a roller made of an elastic material.

5. A surface treatment method as claimed in claim 4 , wherein said flattening step has a first flattening step of flattening the surface of the thermally sprayed coating film using a grindstone, and a second flattening step of further flattening the flattened surface of the thermally sprayed coating film using a plate coated with abrasive grains by removing minute undulations on the flattened surface of the thermally sprayed coating film.

6. A surface treatment method as claimed in claim 5 , wherein in said second flattening step, a load toward the surface of the thermally sprayed coating film is applied to the plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2007
From: SASAKI, YASUHARU; HIGUMA, MASAKAZU; AOTO, TADASHI; KIKUCHI, EIICHIRO
To: TOKYO ELECTRON LIMITED
Reel/Frame 019286/0662 →
Priority Claims (1)
JP 2006-077266 · Mar 20, 2006 · national
Continuity (2)
Provisional Application 6078810500 · Apr 3, 2006
Related Publication 20080280536A1 · Nov 13, 2008