Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.
1. A substrate holder for use in a lithographic apparatus, the substrate holder comprising:
a main body having a first side of the main body and a side of the main body opposite to the first side;
a plurality of first burls at the first side of the main body and having end surfaces to support a substrate in the lithographic apparatus, wherein each of the first burls comprise a lower portion protruding from the main body and an upper portion above the lower portion, wherein the lower portions are a different material than the upper portions, the upper portions comprise diamond-like carbon;
a plurality of second burls at a second side of the main body; and
a heater provided to the main body and configured to control a temperature of the substrate and/or the main body.
2. The substrate holder according to claim 1 , wherein the main body is formed of a different material than the burls.
3. The substrate holder according to claim 1 , further comprising an electric or electronic component on a surface of the main body, wherein the electric or electronic component is selected from the group consisting of: an electrode, a heater, a sensor, a transistor and a logic device.
4. The substrate holder according to claim 1 , wherein the main body comprises at least one selected from: Zerodur, cordierite, SiSiC, SiC, AIN, ceramic and/or glass-ceramic.
5. The substrate holder according to claim 1 , wherein the lower portions are separated from each other by an open gap between them, and the upper portions are separated from each other by an open gap between them.
6. The substrate holder according to claim 1 , wherein the burls project from the main body by a distance selected from 1 to 250 μm and/or the burls are cylindrical.
7. The substrate holder according to claim 1 , further comprising a sensor to monitor a temperature of the substrate holder and/or the substrate.
8. The substrate holder according to claim 1 , wherein the lower portion comprises at least one selected from: SiC, SiO 2 , TiN and/or CrN.
9. The substrate holder according to claim 1 , further comprising a thin-film stack forming an electric or electronic component, the thin-film stack located at the first side of the main body.
10. The substrate holder according to claim 9 , wherein the component is selected from: an electrode, a heater, a sensor, a transistor and/or a logic device.
11. A lithographic apparatus, comprising:
a projection system arranged to project a beam patterned by a patterning device onto a substrate; and
the substrate holder according to claim 1 , the substrate holder arranged to hold the substrate.
12. A method of manufacturing a substrate holder for use in a lithographic apparatus, the method comprising:
forming a plurality of first burls protruding from a main body at a first side of the main body, the forming comprising:
forming a lower portion, protruding from the main body, of each of the first burls, and
forming, on each lower portion, an upper portion above the respective lower portion,
forming a plurality of second burls at a second side of the main body; and
providing a heater to the main body,
wherein the lower portions are a different material from the upper portions, the upper portions comprise diamond-like carbon, and the upper portions are separated from each other.
13. The method according to claim 12 , wherein the lower portions are formed so as to be separated from each other by an open gap between them, and the upper portions are formed so as to be separated from each other by an open gap between them.
14. The method according to claim 12 , wherein the lower portions comprise at least one selected from: SiC, SiO 2 , TiN and/or CrN.
15. The method according to claim 12 , further comprising forming a thin-film stack that forms an electric or electronic component, at an upper surface of the main body.
16. The method according to claim 12 , wherein the burls project from the main body by a distance selected from 1 to 250 μm.
17. A substrate holder for use in a lithographic apparatus, the substrate holder comprising:
a main body;
a plurality of first burls at a first side of the main body and having end surfaces to support a substrate in the lithographic apparatus, wherein each of the first burls comprise a lower portion protruding from the main body and an upper portion above the lower portion, wherein the lower portions are a different material than the upper portions, the upper portions comprise diamond-like carbon and the lower portions are separated from each other by an open gap between them; and
a plurality of second burls at a second side of the main body.
18. The substrate holder according to claim 17 , further comprising a thin-film stack forming an electric or electronic component, the thin-film stack located at the first side of the main body.
19. The substrate holder according to claim 17 , further comprising a heater configured to control a temperature of the substrate and/or the main body, at least part of the heater located on an external surface of the main body.
20. The substrate holder according to claim 17 , wherein the lower portions comprise at least one material selected from: SiC, SiO 2 , TiN and/or CrN.
21. A lithographic apparatus, comprising:
a projection system arranged to project a beam patterned by a patterning device onto a substrate; and
the substrate holder according to claim 17 , the substrate holder arranged to hold the substrate.