System for handling semiconductor dies
Systems and methods for releasing semiconductor devices during pick and place operations are disclosed. A representative system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a release station having a fluid delivery device coupleable to a source of release fluid, the fluid delivery device having an exit positioned to direct release fluid toward a semiconductor die carried by the support member at the release station.
1. A system for handling semiconductor dies, comprising:
a support member positioned to carry a semiconductor wafer, the semiconductor wafer having a plurality of semiconductor dies and being releasably attached to a dicing tape carried by a dicing frame, the support member having a plurality of apertures;
a plurality of ejector pins, with individual ejector pins operably positioned in and aligned with corresponding individual apertures of the support member;
a picking device having a pick head, the pick head having vacuum ports coupled to a vacuum source, the pick head is coupled to a fluid delivery device; and
a release station configured to be positioned opposite to the fluid delivery device the fluid delivery device being positioned to direct release fluid toward a first semiconductor die carried by the support member at the release station; and
a pick station configured to be positioned opposite the picking device and configured to support a second semiconductor die of the semiconductor wafer, such that the picking device is configured to releasably attach to the second semiconductor die of the semiconductor wafer.
2. The system of claim 1 , further comprising at least one actuator operatively coupled to at least one of the support member or the picking device to provide relative movement between the support member and the pick head.
3. The system of claim 1 , wherein the dicing tape includes a UV-curved material that engages the semiconductor wafer via electrostatic or mechanical force.
4. The system of claim 1 , wherein the fluid delivery device is coupled to a source of release fluid.
5. The system of claim 4 , wherein the release fluid includes water.
6. The system of claim 4 , wherein the release fluid includes alcohol.
7. The system of claim 6 wherein the release fluid includes at least one of ethanol, propanol or isopropanol.
8. The system of claim 1 wherein the fluid delivery device includes multiple fluid exits.
9. The system of claim 8 wherein at least two of the multiple fluid exits are positioned opposite each other.
10. The system of claim 1 , further comprising a controller programmed with instructions that, when executed:
direct the picking device to attach to the first semiconductor die; and
direct the fluid delivery device to direct the release fluid to the second semiconductor die after the picking device attaches to the first semiconductor die.
11. The system of claim 1 , further comprising a controller programmed with instructions that, when executed:
direct the fluid delivery device to direct the release fluid; and
direct the picking device to attach to the first semiconductor die after the fluid delivery device directs the release fluid to the second semiconductor die.