IP Library Granted Patent US 10,388,625
Granted Patent B2
US 10,388,625 · App. 15/290,557 · Granted Aug 20, 2019

Press fitting head and semiconductor manufacturing apparatus using the same

Inventor: Minoru Kai (Yokohama, JP)
Assignee: J-Devices Corporation
H01L24/75H01L21/67132H01L21/67144H01L21/681H01L24/27H01L24/29H01L24/32H01L24/83H01L2224/27436H01L2224/2919H01L2224/32225H01L2224/32245H01L2224/7532H01L2224/75312H01L2224/75316H01L2224/75702H01L2224/75745H01L2224/75753H01L2224/75822H01L2224/75824H01L2224/8313H01L2224/8317H01L2224/8318H01L2224/83132H01L2224/83191
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Quick Facts
Patent No.
US 10,388,625
App. No.
15/290,557
Granted
Aug 20, 2019
Kind
B2
Abstract

A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.

Claims (11)

1. A press fitting head comprising:

an elastic member in a part where the press fitting head contacts a semiconductor device; and

an alignment mark recognition area for detecting an optically readable marker provided on a surface to be contacted of the semiconductor device.

2. The press fitting head according to claim 1 , wherein:

the elastic member has a notch portion; and

the alignment mark recognition area coincides with the notch portion.

3. The press fitting head according to claim 1 , wherein:

the elastic member has an opening portion; and

the alignment mark recognition area coincides with the opening portion.

4. The press fitting head according to claim 3 , wherein the opening portion is coupled with a vacuum generator.

5. The press fitting head according to claim 1 , further comprising a transparent portion configured to fix the elastic member.

Assignments (2)
CHANGE OF NAME Recorded Jul 17, 2020
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053242/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2016
From: KAI, MINORU
To: J-DEVICES CORPORATION
Reel/Frame 039987/0246 →
Priority Claims (1)
JP 2015-203884 · Oct 15, 2015 · national
Continuity (1)
Related Publication 20170110432A1 · Apr 20, 2017