Patent Assignment
Reel/Frame 053242/0422
Change of Name
Recorded: 2020-07-17
Pages: 16
Assignor
J-DEVICES CORPORATION
Executed: 2020-01-01
Assignee
AMKOR TECHNOLOGY JAPAN, INC.
1913-2, TAKEGASHITA FUKURA, USUKI-SHI, OITA, 875-0053, JAPAN
Covered Properties
(14)
Semiconductor Package
Manufacturing Method for Semiconductor Device
Semiconductor Device
Semiconductor Device
Press Fitting Head and Semiconductor Manufacturing Apparatus Using the Same
Semiconductor Package and Its Manufacturing Method
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Application:
15/366,064 →
Publication:
US 2017/0170106
Semiconductor Package and a Method for Manufacturing a Semiconductor Device
Semiconductor Package and Manufacturing Method of Semiconductor Package
Manufacturing Method of Semiconductor Package
Manufacturing Method of Semiconductor Package Including Laser Processing
Semiconductor Package and a Method for Manufacturing a Semiconductor Device
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Semiconductor Device Having Outer Terminal Portions with Conductive Layer on Outer End Surfaces and Method of Manufacturing a Semiconductor Device
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 20, 2015
From: WATANABE, SHINJI; HOSOYAMADA, SUMIKAZU; NAKAMURA, SHINGO; DEMACHI, HIROSHI
To: J-DEVICES CORPORATION
Reel/Frame 036137/0389 →
Assignment of Assignor's Interest
Sep 10, 2015
From: MATSUBARA, HIROAKI; CHIKAI, TOMOSHIGE; ISHIDO, KIMINORI; NAKAMURA, TAKASHI
To: J-DEVICES CORPORATION
Reel/Frame 036536/0151 →
Assignment of Assignor's Interest
Jan 13, 2016
From: MODA, MAKOTO
To: J-DEVICES CORPORATION
Reel/Frame 037481/0938 →
Assignment of Assignor's Interest
Jan 29, 2016
From: TANAKA, YOSHIHIRO
To: J-DEVICES CORPORATION
Reel/Frame 037624/0054 →
Assignment of Assignor's Interest
Oct 11, 2016
From: KAI, MINORU
To: J-DEVICES CORPORATION
Reel/Frame 039987/0246 →
Assignment of Assignor's Interest
Nov 30, 2016
From: HAYASHI, NAOKI
To: J-DEVICES CORPORATION
Reel/Frame 040467/0677 →
Assignment of Assignor's Interest
Dec 1, 2016
From: HAYASHI, NAOKI
To: J-DEVICES CORPORATION
Reel/Frame 040479/0128 →
Assignment of Assignor's Interest
Mar 1, 2017
From: SUZUHARA, MASAFUMI
To: J-DEVICES CORPORATION
Reel/Frame 041423/0391 →
Assignment of Assignor's Interest
Mar 29, 2017
From: TAKEHARA, YASUYUKI; KITANO, KAZUHIKO
To: J-DEVICES CORPORATION
Reel/Frame 041777/0856 →
Assignment of Assignor's Interest
Apr 7, 2017
From: INAOKA, TOSHIYUKI; URATSUJI, ATSUHIRO
To: J-DEVICES CORPORATION
Reel/Frame 041930/0292 →
Assignment of Assignor's Interest
Apr 21, 2017
From: MARUTANI, HISAKAZU; KAI, MINORU; KITANO, KAZUHIKO
To: J-DEVICES CORPORATION
Reel/Frame 042088/0590 →
Assignment of Assignor's Interest
Aug 3, 2018
From: SUZUHARA, MASAFUMI
To: J-DEVICES CORPORATION
Reel/Frame 046548/0188 →
Assignment of Assignor's Interest
Oct 23, 2019
From: HAYASHI, NAOKI
To: J-DEVICES CORPORATION
Reel/Frame 050808/0310 →
Assignment of Assignor's Interest
Jan 17, 2020
From: SUZUHARA, MASAFUMI
To: J-DEVICES CORPORATION
Reel/Frame 051546/0604 →
Assignment of Assignor's Interest
Jan 27, 2021
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 055050/0180 →
Corrective Assignment to Correct the Corrective Assignment to Correct the Property Numbers Section to Remove 14803889, 14850589, 14994963, 15010988, 15290577, 15364851, 15446426, 15472387, 15481848, 15493231, 16053965, 16661952, and 1675920 Previously Recorded on Reel 055050 Frame 0180. Assignor Hereby Confirms the Assignment of Property 15366064. Previously Recorded on Reel 55050 Frame 180. Assignor(S) Hereby Confirms the Corrective Assignment.
May 6, 2024
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SIGNAPORE HOLDING PTE. LTD.
Reel/Frame 067382/0225 →