IP Library Assignment 036137/0389
Patent Assignment
Reel/Frame 036137/0389

Assignment of Assignor's Interest

Recorded: 2015-07-20 Pages: 14
Assignors
WATANABE, SHINJI
Executed: 2015-06-24
HOSOYAMADA, SUMIKAZU
Executed: 2015-07-01
NAKAMURA, SHINGO
Executed: 2015-06-24
DEMACHI, HIROSHI
Executed: 2015-06-25
MIYAKOSHI, TAKESHI
Executed: 2015-06-24
CHIKAI, TOMOSHIGE
Executed: 2015-06-24
ISHIDO, KIMINORI
Executed: 2015-06-24
MATSUBARA, HIROAKI
Executed: 2015-06-24
NAKAMURA, TAKASHI
Executed: 2015-06-24
HONDA, HIROKAZU
Executed: 2015-06-25
KUMAGAYA, YOSHIKAZU
Executed: 2015-06-25
SAKUMOTO, SHOTARO
Executed: 2015-06-24
IWASAKI, TOSHIHIRO
Executed: 2015-06-24
TAMAKAWA, MICHIAKI
Executed: 2015-06-24
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property (1)
Semiconductor Package
Patent: 9,635,762 →
Application: 14/803,889 →
Publication: US 2016/0027715
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 17, 2020
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053242/0422 →