Patent Assignment
Reel/Frame 042088/0590
Assignment of Assignor's Interest
Recorded: 2017-04-21
Pages: 4
Assignors
MARUTANI, HISAKAZU
Executed: 2017-02-22
KAI, MINORU
Executed: 2017-02-22
KITANO, KAZUHIKO
Executed: 2017-02-22
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Package Including Laser Processing
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.