Patent Assignment
Reel/Frame 040479/0128
Assignment of Assignor's Interest
Recorded: 2016-12-01
Pages: 4
Assignor
HAYASHI, NAOKI
Executed: 2016-09-27
Assignee
J-DEVICES CORPORATION
1913-2, FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property
(1)
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Application:
15/366,064 →
Publication:
US 2017/0170106
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 17, 2020
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053242/0422 →
Assignment of Assignor's Interest
Jan 27, 2021
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 055050/0180 →
Corrective Assignment to Correct the Corrective Assignment to Correct the Property Numbers Section to Remove 14803889, 14850589, 14994963, 15010988, 15290577, 15364851, 15446426, 15472387, 15481848, 15493231, 16053965, 16661952, and 1675920 Previously Recorded on Reel 055050 Frame 0180. Assignor Hereby Confirms the Assignment of Property 15366064. Previously Recorded on Reel 55050 Frame 180. Assignor(S) Hereby Confirms the Corrective Assignment.
May 6, 2024
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SIGNAPORE HOLDING PTE. LTD.
Reel/Frame 067382/0225 →