Patent Assignment
Reel/Frame 067382/0225
Corrective Assignment to Correct the Corrective Assignment to Correct the Property Numbers Section to Remove 14803889, 14850589, 14994963, 15010988, 15290577, 15364851, 15446426, 15472387, 15481848, 15493231, 16053965, 16661952, and 1675920 Previously Recorded on Reel 055050 Frame 0180. Assignor Hereby Confirms the Assignment of Property 15366064. Previously Recorded on Reel 55050 Frame 180. Assignor(S) Hereby Confirms the Corrective Assignment.
Recorded: 2024-05-06
Pages: 8
Assignor
AMKOR TECHNOLOGY JAPAN, INC.
Executed: 2020-04-10
Assignee
AMKOR TECHNOLOGY SIGNAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12-03, 248373, SINGAPORE
Covered Property
(1)
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Application:
15/366,064 →
Publication:
US 2017/0170106
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2016
From: HAYASHI, NAOKI
To: J-DEVICES CORPORATION
Reel/Frame 040479/0128 →
Change of Name
Jul 17, 2020
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053242/0422 →
Assignment of Assignor's Interest
Jan 27, 2021
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 055050/0180 →