Patent Assignment
Reel/Frame 041777/0856
Assignment of Assignor's Interest
Recorded: 2017-03-29
Pages: 4
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method of Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.