Semiconductor package and manufacturing method of semiconductor package
A semiconductor package includes a substrate having at least one recessed portion, a semiconductor device located on a surface of the substrate, the surface having the at least one recessed portion, and a resin insulating layer covering the semiconductor device.
1. A semiconductor package, comprising:
a substrate having at least one recessed portion;
a semiconductor device located on a surface of the substrate, the surface having the at least one recessed portion;
a resin insulating layer covering the semiconductor device; and
an adhesive layer between the substrate and the semiconductor device,
wherein
the adhesive layer has an opening exposing the at least one recessed portion,
an edge of the opening surrounds the at least one recessed portion in a planar view, and
any structure that comprises a conductive material and that is connected to the semiconductor device is not located at the opening.
2. The semiconductor package according to claim 1 , wherein:
the resin insulating layer is in contact with a side wall of the opening.
3. The semiconductor package according to claim 1 , wherein:
the at least one recessed portion includes at least two recessed portions; and
the at least two recessed portions are located at positions corresponding to opposing corners of the semiconductor device as seen in a planar view.
4. The semiconductor package according to claim 2 , wherein the resin insulating layer is in contact with a side wall of the at least one recessed portion.
5. The semiconductor package according to claim 4 , wherein the resin insulating layer fills the at least one recessed portion.
6. The semiconductor package according to claim 5 , wherein:
the at least one recessed portion includes at least two recessed portions; and
the at least two recessed portions are located at positions corresponding to opposing corners of the semiconductor device as seen in a planar view.
7. The semiconductor package according to claim 6 , wherein the at least two recessed portions each have a size of 0.05 mm or greater and 1.0 mm or less.
8. The semiconductor package according to claim 6 , wherein the at least two recessed portions each have a size of 0.1 mm or greater and 0.3 mm or less.
9. The semiconductor package according to claim 8 , wherein a distance between each of the at least two recessed portions and the semiconductor device is 0.05 mm or greater and 0.5 mm or less.
10. The semiconductor package according to claim 1 , wherein the edge of the opening surrounds the at least one recess portion continuously.
11. The semiconductor package according to claim 1 , wherein the edge of the opening surrounds the at least one recess portion continuously 360 degrees.
12. The semiconductor package according to claim 1 , further comprising a line connecting to the semiconductor device,
wherein
the resin insulating layer is located above the semiconductor device, and
the line is located above the semiconductor device and the resin insulating layer.
13. The semiconductor package according to claim 12 , further comprising a solder ball connecting to the line,
wherein the solder ball is located above the line.