IP Library Assignment 040467/0677
Patent Assignment
Reel/Frame 040467/0677

Assignment of Assignor's Interest

Recorded: 2016-11-30 Pages: 4
Assignor
HAYASHI, NAOKI
Executed: 2016-09-27
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property (1)
Semiconductor Package and Its Manufacturing Method
Patent: 9,721,900 →
Application: 15/364,851 →
Publication: US 2017/0170123
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 17, 2020
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053242/0422 →