Patent Assignment
Reel/Frame 050808/0310
Assignment of Assignor's Interest
Recorded: 2019-10-23
Pages: 4
Assignor
HAYASHI, NAOKI
Executed: 2016-09-27
Assignee
J-DEVICES CORPORATION
1913-2, TAKEGASHITA FUKURA, USUKI-SHI, OITA, 875-0053, JAPAN
Covered Property
(1)
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.