Package assembly for thin wafer shipping and method of use
View Patent ↗A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
1. A package assembly comprising:
a container having a bottom surface and a plurality of straps attached thereto;
at least one force distribution plate positioned in relation to the container;
a stack of wafers positioned above the at least one force distribution plate;
at least one foam cushion contacting the at least one force distribution plate; and
a plurality of tabs extending from an outermost perimeter of the bottom surface and positioned between the bottom surface and the plurality of straps.
2. The package assembly of claim 1 , wherein the container comprises an electrostatic discharge (ESD) compliant material.
3. The package assembly of claim 1 , wherein the straps are hinged or flexible.
4. The package assembly of claim 3 , wherein each of the plurality of straps is spaced equidistance from one another about the bottom surface.
5. The package assembly of claim 1 , wherein the plurality of straps include tabbed portions.
6. The package assembly of claim 1 , wherein the plurality of straps include slits.
7. The package assembly of claim 1 , wherein the at least one force distribution plate is positioned within the container.
8. The package assembly of claim 7 , wherein the at least one force distribution plate is structured to:
distribute forces over the stack of wafers within the container; and
contain the stack of wafers as a unit allowing them to move as a unit.
9. A package assembly, comprising:
a wafer container comprising a bottom surface and a plurality of straps extending therefrom;
a stack of wafers positioned within the wafer container;
one or more foam cushions or sheets positioned about the stack of wafers;
a force distribution plate positioned beneath the stack of wafers and contacting the one or more foam cushions or sheets; and
a plurality of tabs extending from an outermost perimeter of the bottom surface and positioned between the plurality of straps and the bottom surface.
10. The package assembly of claim 9 , wherein:
the wafer container comprises electrostatic discharge (ESD) compliant material;
the straps are one of a hinged and flexible material; and
each of the plurality of straps is spaced equidistance from one another about the bottom surface.
11. The package assembly of claim 9 , wherein straps of the plurality of straps include at least one of tabbed portions and slits.
12. The package assembly of claim 9 , further comprising:
a shipping container which holds the wafer container; and
upper and lower foam cushions or sheets positioned above and below the wafer container, wherein the one or more foam cushions or sheets are positioned about a periphery of the stack of wafers.