Electronic component package, oscillator, electronic apparatus, and base station
A package includes a base member and a first projecting portion that projects from one surface of the base member. The first projecting portion contacts a first substrate on which an electronic component is mounted, and has an insulating property.
1. An electronic component package comprising:
a base member;
a first projecting portion projecting from one surface of the base member, being configured to contact a first substrate on which an electronic component is mounted, and having an insulating property; and
a second projecting portion projecting from another surface of the base member, being configured to contact a second substrate above which the base member is mounted, and having an insulating property,
wherein the first projecting portion and the second projecting portion are configured integrally with a member penetrating a through-hole provided in the base member.
2. The electronic component package according to claim 1 , wherein
the first projecting portion and the second projecting portion overlap each other in a plan view of the base member.
3. The electronic component package according to claim 1 , wherein
when the base member is viewed in a plan view, the area of the first projecting portion is smaller than the area of the second projecting portion.
4. The electronic component package according to claim 1 , wherein
a projecting height of the first projecting portion is lower than a projecting height of the second projecting portion.
5. The electronic component package according to claim 1 , wherein
the first substrate includes a recess or through-hole provided in a portion contacting the first projecting portion.
6. The electronic component package according to claim 1 , wherein
at least one of the first projecting portion and the second projecting portion includes a surface having a spherical shape.
7. The electronic component package according to claim 1 , further comprising:
a pin penetrating the first substrate, electrically connected with the first substrate, and having conductivity, wherein
the first projecting portion and the pin support the first substrate with respect to the base member.
8. The electronic component package according to claim 1 , wherein
the first projecting portion contains glass.
9. The electronic component package according to claim 1 , comprising at least three first projecting portions.
10. An oscillator comprising:
a base member;
a first substrate;
a resonator mounted on the first substrate and including a resonator element;
a first projecting portion projecting from one surface of the base member, contacting the first substrate, and having an insulating property;
an oscillation circuit electrically connected to the resonator; and
a second projecting portion projecting from another surface of the base member, being configured to contact a second substrate above which the base member is mounted, and having an insulating property,
wherein the first projecting portion and the second projecting portion are configured integrally with a member penetrating a through-hole provided in the base member.
11. The oscillator according to claim 10 , further comprising:
a temperature control element that controls the temperature of the resonator element.
12. An electronic apparatus comprising the electronic component package according to claim 1 .
13. A base station comprising the electronic component package according to claim 1 .