System for manipulation and sorting of particles
A sound manipulation system is provided. The sound manipulation system includes a flow chamber arranged and disposed to receive a fluid containing a particulate and provide in-line sound wave manipulation of at least a portion of the particulate from the fluid, and a transducer positioned to facilitate the in-line sound wave manipulation within the flow chamber. The flow chamber includes at least a first portion and a second portion, the first portion being self-aligned and secured to the second portion.
1. A manipulation system, comprising:
a flow chamber arranged and disposed to receive a fluid containing a particulate and provide sound wave manipulation of at least a portion of the particulate from the fluid; and
a transducer positioned externally of a portion of the flow chamber receiving fluid flow to facilitate the sound wave manipulation within the flow chamber;
an electrical matching circuit operably connected with the transducer for adjusting the sound wave manipulation in response to one or more sensors configured for measuring an impedance of the transducer,
wherein the adjusting the sound wave manipulation includes matching an impedance of an electrical signal provided to the transducer with the measured impedance of the transducer.
2. The manipulation system of claim 1 , further comprising electrical interface elements in thermal communication with the transducer for transferring heat from the transducer during the sound wave manipulation.
3. The manipulation system of claim 1 , wherein the transducer is detachable from the flow chamber.
4. The manipulation system of claim 3 , wherein the flow chamber is configured to be sterilized.
5. The manipulation system of claim 1 , wherein the flow chamber is manufactured with a process selected from the group consisting of injection molding, chemical etching, computer numerical control (CNC) machining, laser cutting, vacuum molding, and combinations thereof.
6. The manipulation system of claim 1 , further comprising an acoustic matching layer positioned between the flow chamber and the transducer, wherein a thickness of the acoustic matching layer is controlled by the formula N/2* L+L/4, where L is a wavelength and N is an integer corresponding to the number of half wavelengths fitting between the nodes.
7. The manipulation system of claim 1 , further comprising a fluid delivery system operably connected to the flow chamber, the fluid delivery system being arranged and disposed to automatically control a fluid delivery from the fluid delivery system to the flow chamber, a flow sequence, a flow rate, a flow time span, a fluid composition, or combinations thereof.
8. The manipulation system of claim 1 , wherein the transducer is cut into a matrix of individual transducer elements selected from the group consisting of rods, strips, and combinations thereof.
9. The manipulation system of claim 1 , wherein the electrical matching circuit is arranged and disposed to adjust an electrical driving power provided to the transducer, a driving frequency of the sound waves provided by the transducer, a phase of the sound waves provided by the transducer, a shape of the sound waves provided by the transducer, or combinations thereof.
10. The manipulation system of claim 1 , wherein the electrical matching circuit is further configured for modifying a frequency, a phase, a shape and an energy of the sound waves manipulated by the transducer.
11. The manipulation system of claim 1 , wherein the transducer is driven by at least one of a pulse-width-modulation and/or a square wave drive.
12. The manipulation system of claim 1 , further comprising:
a protection device operably connected to the transducer;
wherein the protection device being arranged and disposed to decrease at least one of electrical charge build-up within the transducer and electrical charge discharge to the transducer.
13. The manipulation system of claim 1 , wherein the transducer further comprises a composite piezoelectric positioned to provide sound waves for the sound wave manipulation.
14. The manipulation system of claim 1 , wherein the one or more sensors are further configured for measuring a resonant frequency of the transducer, a bandwidth of the transducer, an electrical impedance of the transducer, a capacitance of the transducer, a resonant frequency of the flow chamber, flow rates of the fluid within the flow chamber, a temperature of the transducer, a power of the transducer, an operational life information of the transducer, an operational life information of the flow chamber, or combinations thereof.
15. The manipulation system of claim 1 , further comprising a divider within the flow chamber.
16. The manipulation system of claim 1 , further comprising a hydrophilic coating on an interior of the flow chamber for removing bubbles.
17. The manipulation system of claim 1 , further comprising a plurality of grooves or bumps positioned on an interior of the flow chamber for removing bubbles.
18. The manipulation system of claim 1 , wherein the one or more sensors are arranged and disposed to further measure a property of the particulate, the transducer, or combinations thereof.
19. The manipulation system of claim 1 , wherein the flow chamber includes at least a first portion and a second portion, the first portion being secured to the second portion and aligned using alignment features for creating the portion of the flow chamber receiving fluid flow, wherein the alignment features are clamping features, corresponding projections and recesses, overlapping portions, posts and corresponding apertures, or a combination thereof.
20. The manipulation system of claim 1 , further comprising an electrical matching circuit operably connected with the transducer for adjusting the sound wave manipulation in response to one or more sensors configured for measuring an impedance of the transducer, wherein the adjusting the sound wave manipulation includes matching an impedance of an electrical signal provided to the transducer with the measured impedance of the transducer.
21. The manipulation system of claim 20 , wherein the electrical matching circuit is further configured for adjusting a power provided to the transducer, a frequency of the sound waves, a phase of the sound waves, a shape of the sound waves, or combinations thereof.
22. The manipulation system of claim 20 , wherein the one or more sensors are further configured for measuring a resonant frequency of the transducer, a bandwidth of the transducer, an electrical impedance of the transducer, a capacitance of the transducer, a temperature of the transducer, a power of the transducer, an operational life information of the transducer, or combinations thereof.
23. The manipulation system of claim 20 , wherein a property of the fluid within the flow chamber includes strain, resistance, pressure, temperature capacitance, flow rate, viscosity, sound wave profile, composition, presence of a bubble or combinations thereof.
24. A method of using a manipulation system, comprising: passing liquid containing a particulate through a flow chamber;
a transducer, positioned externally of a portion of the flow chamber receiving fluid flow, manipulating at least a portion of the particulate within the flow chamber by producing sound waves propagating through the flow chamber; one or more sensors measuring an impedance of the transducer: and an electrical driver operably coupled to the transducer adjusting an impedance of an electrical signal provided to the transducer to match the measured impedance of the transducer.
25. A manipulation system, comprising:
a flow chamber arranged and disposed to receive a fluid containing a particulate and provide sound wave manipulation of at least a portion of the particulate from the fluid; and
a transducer positioned externally of a portion of the flow chamber receiving fluid flow to facilitate the sound wave manipulation within the flow chamber;
an acoustic matching layer positioned between the flow chamber and the transducer, wherein a thickness of the acoustic matching layer is controlled by the formula N/2*L+L/4, where L is a wavelength and N is an integer corresponding to the number of half wavelengths fitting between the nodes.
26. The manipulation system of claim 25 , further comprising electrical interface elements in thermal communication with the transducer for transferring heat from the transducer during the sound wave manipulation.
27. The manipulation system of claim 25 , wherein the transducer is detachable from the flow chamber.
28. The manipulation system of claim 25 , wherein the flow chamber is configured to be sterilized.
29. The manipulation system of claim 25 , wherein the flow chamber is manufactured with a process selected from the group consisting of injection molding, chemical etching, computer numerical control (CNC) machining, laser cutting, vacuum molding, and combinations thereof.
30. The manipulation system of claim 25 , further comprising a fluid delivery system operably connected to the flow chamber, the fluid delivery system being arranged and disposed to automatically control a fluid delivery from the fluid delivery system to the flow chamber, a flow sequence, a flow rate, a flow time span, a fluid composition, or combinations thereof.
31. The manipulation system of claim 25 , wherein the transducer is cut into a matrix of individual transducer elements selected from the group consisting of rods, strips, and combinations thereof.
32. The manipulation system of claim 25 , wherein the transducer is driven by at least one of a pulse-width-modulation and/or a square wave drive.
33. The manipulation system of claim 25 , further comprising:
a protection device operably connected to the transducer;
wherein the protection device being arranged and disposed to decrease at least one of electrical charge build-up within the transducer and electrical charge discharge to the transducer.
34. The manipulation system of claim 25 , wherein the transducer further comprises a composite piezoelectric positioned to provide sound waves for the sound wave manipulation.
35. The manipulation system of claim 25 , wherein the flow chamber includes at least a first portion and a second portion, the first portion being secured to the second portion and aligned using alignment features for creating the portion of the flow chamber receiving fluid flow, wherein the alignment features are clamping features, corresponding projections and recesses, overlapping portions, posts and corresponding apertures, or a combination thereof.
36. The manipulation system of claim 25 , further comprising a divider within the flow chamber.
37. The manipulation system of claim 25 , further comprising a hydrophilic coating on an interior of the flow chamber for removing bubbles.
38. The manipulation system of claim 25 , further comprising a plurality of grooves or bumps positioned on an interior of the flow chamber for removing bubbles.