IP Library › Granted Patent US 10,471,469
Granted Patent B2
US 10,471,469 · App. 15/318,911 · Granted Nov 12, 2019

High aspect ratio nanostructures and methods of preparation

Inventors: Martin Thuo (Ames, IA); Ian Tevis (Brighton, MA)
Assignee: University of Massachusetts
B05D7/24B01J2/24B05D1/30B05D3/007C01G15/00
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Quick Facts
Patent No.
US 10,471,469
App. No.
15/318,911
Granted
Nov 12, 2019
Kind
B2
Abstract

Metal nanomaterials and nanostructures may be formed via shearing force in the presence of a reactant.

Claims (26)

1. A process for preparing a nanostructure comprising:

adding a metal to a liquid reaction solution;

forming a metal oxide on a surface of the metal;

shearing off metal oxide particles from the surface of the metal;

allowing the sheared metal oxide particles to self-assemble into nanomaterials; and

casting the self-assembled nanomaterials on a substrate to form the nanostructure.

2. The process of claim 1 , wherein adding the metal comprises adding gallium or alloys thereof.

3. The process of claim 1 , wherein adding the metal comprises adding the metal in a liquid state.

4. The process of claim 1 , wherein forming a metal oxide comprises forming a metal oxide having the following formula:

M n O X C Y H Z

wherein M is a metal and n, x, y, and z are integers.

5. The process of claim 4 , wherein M is gallium.

6. The process of claim 1 , wherein the reaction solution comprises acetic acid.

7. The process of claim 6 , wherein the sheared metal oxide particles comprise an adsorbed acetate layer.

8. The process of claim 1 , wherein the reaction solution comprises an acetic acid solution having a concentration of acetic acid in the range of 1 percent to 10 percent by volume.

9. The process of claim 8 , wherein the reaction solution comprises an acetic acid solution having a concentration of acetic acid in the range of 1 percent to 5 percent by volume.

10. The process of claim 1 , wherein forming the metal oxide on the surface comprises allowing the metal to react with the reaction solution for 2 to 24 hours prior to shearing.

11. The process of claim 1 , wherein forming the metal oxide on the metal surface takes place at a temperature of about 90° C. to about 150° C.

12. The process of claim 1 , wherein forming the metal oxide on the metal surface takes place at a temperature of about 20° C. to about 100° C.

13. The process of claim 12 , wherein forming the metal oxide on the metal surface takes place at a temperature of about 20° C. to about 30° C.

14. The process of claim 1 , wherein shearing off metal oxide particles comprises stirring the metal oxide in the reaction solution with an apparatus that creates centrifugal shear force.

15. The process of claim 1 , wherein the self-assembled nanomaterials have a thickness in the range of about 5 nanometers to about 5 microns.

16. The process of claim 1 , wherein the self-assembled nanomaterials have a thickness in the range of about 150 nanometers to about 400 nanometers.

17. The process of claim 1 , wherein the nanostructures have a high aspect ratio of length to thickness that is greater than about 1000 to 1.

18. The process of claim 1 , wherein the substrate comprises silicon.

19. The process of claim 1 , further comprising subjecting the nanostructure to post-assembly modification.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2017
From: THUO, MARTIN; TEVIS, IAN
To: MASSACHUSETTS, UNIVERSITY OF
Reel/Frame 042196/0026 →
Continuity (2)
Provisional Application 62014425 · Jun 19, 2014
Related Publication 20170120295A1 · May 4, 2017