Three dimensional semiconductor memory device having peripheral circuit under cell structure

1. A semiconductor memory device with a three-dimensional (3D) structure, comprising:

a cell region arranged over a substrate, including a cell structure wherein the cell structure includes a plurality of cell gate conductive films and a plurality of insulation films alternately stacked over the substrate;

a peripheral circuit region arranged between the substrate and the cell region, and comprising peripheral circuit elements, a lower wiring structure electrically coupled to the peripheral circuit elements, and interlayer insulation films covering the peripheral circuit elements and the lower wiring structure;

an upper wiring structure arranged over the cell region;

a semiconductor pattern disposed between the peripheral circuit region and the cell region, and having openings;

a insulating gap-fill layer filled in the opening;

main channel films formed in first through-holes passing through the cell structure and connected to the semiconductor pattern;

dummy channel films formed in second through-holes passing through the cell structure; and

vertical contacts coupling the dummy channel films to the lower wiring structure through the insulating gap-fill layer and an uppermost interlayer insulation film among the interlayer insulation films,

wherein the dummy channel films overlap with the openings of the semiconductor pattern, and

wherein the main channel films and the dummy channel films extend above an uppermost film of the plurality of cell gate conductive films and the plurality of insulation films of the cell structure relative to the substrate.

2. The semiconductor memory device of claim 1 , wherein the upper wiring structure is formed of a conductive material having lower resistance than the lower wiring structure.

3. The semiconductor memory device of claim 1 , wherein the semiconductor pattern comprises a common source region electrically coupled to the main channel films.

4. The semiconductor memory device of claim 1 , wherein the semiconductor pattern comprises a pipe gate electrode having a pipe line channel film formed therein, the pipe line channel film electrically coupling two or more of the main channel films.

5. The semiconductor memory device of claim 1 , wherein the peripheral circuit elements comprise a first peripheral circuit element and a second peripheral circuit element, and

wherein the dummy channel films comprise:

a first dummy channel film electrically coupling the first peripheral circuit element to the upper wiring structure through one of the vertical contacts; and

a second dummy channel film electrically coupling the second peripheral circuit element to the upper wiring structure through another one of the vertical contacts.

6. The semiconductor memory device of claim 5 , wherein the upper wiring structure comprises:

bit lines electrically coupled to the main channel films;

a dummy bit line electrically coupling between the first dummy channel film and second dummy channel film.

7. The semiconductor memory device of claim 6 , wherein the upper wiring structure comprises:

a first dummy bit line electrically coupled to the first dummy channel film through one of the vertical contacts;

a second dummy bit line electrically coupled to the second dummy channel film through another one of the vertical contacts; and

an upper wiring layer disposed over the first and second dummy bit lines, and electrically coupling between the first dummy bit line and second dummy bit line.

8. The semiconductor memory device of claim 7 , wherein the upper wiring layer is extended in a direction perpendicular to the bit lines and the first and second dummy bit lines.

9. The semiconductor memory device of claim 5 , wherein the upper wiring structure comprises a fuse having one end electrically coupled to the first dummy channel film and the other end electrically coupled to the second dummy channel film while facing the one end.

10. The semiconductor memory device of claim 5 , wherein the upper wiring structure comprises:

a first dummy bit line electrically coupled to the first dummy channel film;

a second dummy bit line electrically coupled to the second dummy channel film; and

a fuse disposed over the first and second dummy bit lines, wherein the fuse has one end electrically coupled to the first dummy channel film and the other end electrically coupled to the second dummy channel film while facing the one end.

11. The semiconductor memory device of claim 1 , wherein the upper wiring structure further comprises:

bit lines electrically coupled to the main channel films;

dummy hit lines electrically coupled to the dummy channel films;

an upper wiring layer disposed over the bit lines and the dummy bit lines, and electrically coupled to the dummy bit, lines; and

an external connection pad disposed over the upper wiring layer, and electrically coupled to the upper wiring layer.

12. The semiconductor memory device of claim 11 , wherein the upper wiring structure further comprises a common source line formed at the same layer as the bit lines and the dummy bit lines, and

the dummy bit lines are disposed between the bit lines and the common source line.

13. A semiconductor memory device with a three-dimensional (3D) structure, comprising:

a cell region arranged over a substrate, including a cell structure, wherein the cell structure includes a plurality of cell gate conductive films and a plurality of insulation films alternately stacked over the substrate;

a peripheral circuit region disposed between the substrate and the cell region, and comprising peripheral circuit elements, a lower wiring structure electrically coupled to the peripheral circuit elements, and interlayer insulation films covering the peripheral circuit elements and the lower wiring structure;

a semiconductor pattern disposed between the peripheral circuit region and the cell region, and having openings;

an insulating gap-fill layer filled in the opening;

main channel films formed in through-holes passing through the cell structure and connected to the semiconductor pattern;

first and second dummy channel films formed in through-holes passing through the cell structure; and

a fuse disposed over the cell region and having one end coupled to the first dummy channel film and the other end coupled to the second dummy channel film while facing the one end; and

vertical contacts coupling the first and second dummy channel films to the lower wiring structure through the insulating gap-fill layer and an uppermost interlayer insulation film among the interlayer insulation films,

wherein the first and second dummy channel films overlap with the openings of the semiconductor pattern and

wherein the main channel films and the dummy channel films extend above an uppermost film of the plurality of cell gate conductive films and the plurality of insulation films of the cell structure relative to the substrate.

14. The semiconductor memory device of claim 13 , further comprising a fuse control circuit formed in the peripheral circuit region which cuts the fuse and verifies the cut state of the fuse.

15. A semiconductor memory device with a three-dimensional (3D) structure, comprising:

a cell region arranged over a substrate, including a cell structure, wherein the cell structure includes a plurality of cell gate conductive films and a plurality of insulation films alternately stacked over the substrate;

a peripheral circuit region disposed between the substrate and the cell region, and comprising peripheral circuit elements, a lower wiring structure electrically coupled to the peripheral circuit elements, and interlayer insulation films covering the peripheral circuit elements and the lower wiring, structure;

a semiconductor pattern disposed between the peripheral circuit region and the cell region, and having openings;

an insulating gap-fill layer filled in the opening;

main channel films formed in through-holes passing through the cell structure and connected to the semiconductor pattern;

first and second dummy channel films formed in through-holes passing through the cell structure; and

a fuse disposed over the cell region and having one end coupled to the first dummy channel film and the other end coupled to the second dummy channel film while facing the one end;

vertical contacts coupling the first and second dummy channel films to the lower wiring structure through the insulating gap-fill layer and an uppermost interlayer insulation film among the interlayer insulation films; and

a fuse control circuit formed in the peripheral circuit region which cuts the fuse and verifies the cut state of the fuse,

wherein the first and second dummy channel films overlap with the openings of the semiconductor pattern.