Device and method for inspecting position of probe, and semiconductor evaluation apparatus
Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.
1. A probe position inspection device that inspects a position of a probe included in a semiconductor evaluation apparatus, said probe including an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus, said probe position inspection device comprising:
a base part having a front surface contactable by said probe, and including a plurality of magnetic field sensors placed in a plane parallel to said front surface, each of said magnetic field sensors sensing said magnetic field produced by said inspection magnetic field producing part; and
an output part electrically connected to said magnetic field sensors, said output part outputting, based on said magnetic field, a signal corresponding to each of said magnetic field sensors.
2. The probe position inspection device according to claim 1 ,
wherein said magnetic field sensors are static magnetic field sensors each of which senses a static magnetic field in which said magnetic field is static.
3. The probe position inspection device according to claim 2 ,
wherein said magnetic field sensors are linear output Hall ICs or binary output Hall ICs.
4. The probe position inspection device according to claim 1 ,
wherein said magnetic field sensors are magnetic field sensors each of which senses, as a sensing direction, a magnetic field component in a direction different from a direction parallel to said plane.
5. The probe position inspection device according to claim 1 ,
wherein said base part has a back surface opposite to said front surface, and
said magnetic field sensors are placed at the back surface.
6. The probe position inspection device according to claim 1 ,
wherein said base part includes counterbored parts, and
said magnetic field sensors are placed in said counterbored parts.
7. The probe position inspection device according to claim 1 ,
wherein said base part includes:
a main base;
a sensor substrate including said magnetic field sensors; and
a first detachable part that attaches and detaches said sensor substrate to and from said main base.
8. The probe position inspection device according to claim 1 ,
wherein said base part includes a non-magnetic material.
9. The probe position inspection device according to claim 8 ,
wherein said base part includes a stainless steel, a ceramic material, or an engineering plastic.
10. The probe position inspection device according to claim 1 ,
wherein said base part includes a protective part that protects said front surface.
11. The probe position inspection device according to claim 1 , further comprising
a magnetic shield placed at a back surface side or around a periphery of said base part.
12. The probe position inspection device according to claim 1 , further comprising
a temperature sensing part that measures an ambient temperature of said magnetic field sensors.
13. The probe position inspection device according to claim 1 ,
wherein said base part includes an external magnetic field applying part that applies an external magnetic field to said inspection magnetic field producing part, said external magnetic field applying part being placed at a position corresponding to each of said magnetic field sensors.
14. The probe position inspection device according to claim 13 ,
wherein said external magnetic field applying part is placed at a position identical to a position of each of said magnetic field sensors in a planar view from a front surface side of said base part.
15. The probe position inspection device according to claim 14 ,
wherein said external magnetic field applying parts are placed in contact with said magnetic field sensors.
16. The probe position inspection device according to claim 13 ,
wherein said external magnetic field applying parts are permanent magnets or electromagnets.
17. A semiconductor evaluation apparatus, comprising:
said probe position inspection device according to claim 13 ;
a stage that supports said subject semiconductor apparatus;
said probe; and
an evaluator that transmits and receives, through said probe, an electrical signal to and from said subject semiconductor apparatus placed on said stage, and evaluates electrical characteristics of said subject semiconductor apparatus,
wherein said inspection magnetic field producing part included in said probe is a ferromagnet or a paramagnet.
18. The semiconductor evaluation apparatus according to claim 17 , further comprising:
a holder that supports said base part with connection; and
a second detachable part that detachably connects said base part to said holder.
19. The semiconductor evaluation apparatus according to claim 17 ,
wherein said inspection magnetic field producing part has a structure detachable from said probe.
20. The semiconductor evaluation apparatus according to claim 17 , further comprising
a third detachable part that detachably connects said probe to said semiconductor evaluation apparatus, said third detachable part being said inspection magnetic field producing part.
21. A method for inspecting a position of a probe using said semiconductor evaluation apparatus according to claim 17 , said method comprising:
bringing said probe in contact with said front surface of said base part;
sensing said magnetic field produced by said inspection magnetic field producing part included in said probe, said sensing being performed by each of said magnetic field sensors included in said base part; and
outputting an output signal based on said magnetic field sensed in said sensing, said outputting being performed by said output part.
22. The method according to claim 21 , further comprising
analyzing said output signal obtained in said outputting, and calculating a contact point at which said probe is in contact with said front surface of said base part, said analyzing and said calculating being performed by said evaluator.
23. A semiconductor evaluation apparatus, comprising:
said probe position inspection device according to claim 1 ;
a stage that supports said subject semiconductor apparatus;
said probe; and
an evaluator that transmits and receives, through said probe, an electrical signal to and from said subject semiconductor apparatus placed on said stage, and evaluates electrical characteristics of said subject semiconductor apparatus.
24. The semiconductor evaluation apparatus according to claim 23 ,
wherein said inspection magnetic field producing part included in said probe is a ferromagnet.
25. The semiconductor evaluation apparatus according to claim 24 , further comprising
a magnetizer that magnetizes said ferromagnet with application of a ring current around said ferromagnet.
26. The semiconductor evaluation apparatus according to claim 23 , further comprising:
a holder that supports said base part with connection; and
a second detachable part that detachably connects said base part to said holder.
27. The semiconductor evaluation apparatus according to claim 23 ,
wherein said inspection magnetic field producing part has a structure detachable from said probe.
28. The semiconductor evaluation apparatus according to claim 23 , further comprising
a third detachable part that detachably connects said probe to said semiconductor evaluation apparatus, said third detachable part being the inspection magnetic field producing part.
29. A method for inspecting a position of a probe using said semiconductor evaluation apparatus according to claim 23 , said method comprising:
bringing said probe in contact with said front surface of said base part;
sensing said magnetic field produced by said inspection magnetic field producing part included in said probe, said sensing being performed by each of said magnetic field sensors included in said base part; and
outputting an output signal based on said magnetic field sensed in said sensing, said outputting being performed by said output part.
30. The method according to claim 29 , further comprising
analyzing said output signal obtained in said outputting, and calculating a contact point at which said probe is in contact with said front surface of said base part, said analyzing and said calculating being performed by said evaluator.