Method and system for ion beam delayering of a sample and control thereof
There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
1. A system for reverse engineering a sample, the system comprising:
an ion beam mill;
a control system in operative communication with the ion beam mill to operate the ion beam mill, for each exposed surface of the sample, in accordance with two or more predetermined operational characteristics that correspond with a substantially identical ion beam mill removal rate for each of a plurality of materials identified in the exposed surface;
wherein the control system is configured to, in accordance with said two or more predetermined operational characteristics simultaneously remove, using an ion beam from the ion beam mill, each of the plurality of materials at said substantially identical ion beam mill removal rate to remove a substantially planar layer of substantially constant thickness from the exposed surface of the sample to expose a newly exposed surface of the sample, whereby acquisition of surface data from each said newly exposed surface of the sample is used for reverse engineering at least a portion of the sample;
wherein the predetermined operational characteristics are any of the following: angle of sample-to-ion beam direction, ion beam size, ion type, sample stage temperature, chamber base pressure, chamber cross-over pressure, chamber process pressure, sample stage linear location, sample stage angle, sample stage rotation speed, ion source accelerator voltage, ion source accelerator current, ion source beam voltage, ion source beam current, ion source extractor grid configuration, ion source extractor grid material, ion source RF power, extraction voltage, plasma bridge neutralizer (PBN) cathode voltage, PBN emission current, PBN gas flow, ion source type, ion source gas flow rate, chamber background gas type, chamber background gas flow rate, and sidewall angle.
2. The system of claim 1 , wherein the ion beam operates in the presence of a reactive gas.
3. The system of claim 1 , wherein the ion beam operates in the presence of a non-reactive gas.
4. The system of claim 2 , wherein the predetermined operational characteristics further comprise any of: a type of reactive gas, and a flow rate of reactive gas.
5. The system of claim 2 , further comprising a sample representation acquisition system operable to acquire the surface data from each said newly exposed surface.
6. The system of claim 5 , wherein said sample representation acquisition system comprises an imaging system.
7. The system of claim 2 , wherein the sample is reverse engineered by producing hierarchical circuit schematics from said surface data.
8. The system of claim 2 , wherein said ion beam mill is one of a broad ion beam mill and a focused ion beam mill.
9. The system of claim 2 , wherein said exposed surface is in the range of 5 to 20 square centimeters.
10. The system of claim 2 , further comprising a data storage medium accessible by said control system to store said two or more predetermined operational characteristics therein to be accessed therefrom.
11. The system of claim 10 , wherein the storage medium is one of an electronic and an optical storage medium.
12. The system of claim 2 , wherein a thickness of said substantially planar layer is smaller than a length or width of said substantially planar layer.