Method and system for ion beam delayering of a sample and control thereof
There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
1. A method of reverse engineering a sample using an ion beam mill, the method comprising:
identifying a plurality of materials in an exposed surface of the sample;
defining a removal sequence defined by distinct sets of one or more predetermined operational characteristics, wherein each of said sets corresponds with respective ion beam removal rates for each of said materials, each of said removal rates being greater than zero;
operating the ion beam mill in accordance with the defined sequence to simultaneously remove, during each distinct set of one or more predetermined operational characteristics, using an ion beam from the ion beam mill, each of the plurality of materials at said respective ion beam removal rates such that upon completion of said defined sequence, a substantially planar layer of substantially constant thickness has been removed from the exposed surface of the sample;
acquiring surface data from a newly exposed surface of the sample; and
repeating the method for at least one more layer, the acquired surface data for reverse engineering at least a portion of the sample;
wherein said one or more predetermined operational characteristics comprise at least one of: angle of sample-to-ion beam direction, ion beam size, ion type, sample stage temperature, chamber base pressure, chamber cross-over pressure, chamber process pressure, sample stage linear location, sample stage angle, sample stage rotation speed, ion source accelerator voltage, ion source accelerator current, ion source beam voltage, ion source beam current, ion source extractor grid configuration, ion source extractor grid material, ion source RF power, extraction voltage, plasma bridge neutralizer (PBN) cathode voltage, PBN emission current, PBN gas flow, ion source type, ion source gas flow rate, chamber background gas type, chamber background gas flow rate, or sidewall angle.
2. The method of claim 1 , wherein said removal sequence comprises defining distinct removal times for at least two of said distinct sets.
3. The method of claim 1 , further comprising producing hierarchical circuit schematics using the acquired surface data.
4. The method of claim 1 , wherein the ion beam operates in the presence of a reactive gas.
5. The method of claim 1 , wherein the ion beam operates in the presence of a non-reactive gas.
6. The method of claim 1 , wherein said ion beam mill is one of a broad ion beam mill and a focused ion beam mill.
7. The method of claim 1 , wherein a thickness of said planar layer is smaller than a length or width of said planar layer.
8. The method of claim 1 , wherein a surface area of said planar layer is in the range of 5 to 20 square centimeters.
9. The method of claim 1 , wherein the ion beam operates in the presence of a reactive gas, and wherein the predetermined operational characteristics further comprise at least one of a type of reactive gas, and a flow rate of reactive gas.
10. The method of claim 1 , wherein the ion beam operates in the presence of a reactive gas, and wherein the predetermined operational characteristics comprise at least one of a type of reactive gas, and a flow rate of reactive gas.
11. The method of claim 1 , wherein said exposed surface is in the range of 5 to 20 square centimeters.