IP Library Granted Patent US 10,593,062
Granted Patent B2
US 10,593,062 · App. 15/386,262 · Granted Mar 17, 2020

Defect observation apparatus

Inventors: Yuko Otani (Tokyo, JP); Kazuo Aoki (Tokyo, JP); Yohei Minekawa (Tokyo, JP)
Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
G06T7/80G01N21/9501G01N21/956G01N23/2251G02B21/0016G02B21/06G02B21/125G02B21/365G03F7/7065G06K9/6202G06T7/001G06T7/74H04N5/2256H04N5/2354H04N5/23245H04N5/23296H04N7/181G01N2223/418G01N2223/6116G06T2207/10061G06T2207/30148H04N5/23238
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Quick Facts
Patent No.
US 10,593,062
App. No.
15/386,262
Granted
Mar 17, 2020
Kind
B2
Abstract

A defect observation apparatus includes a storage unit configured to store defect information about defects detected by an external inspection apparatus; a first imaging unit configured to capture an image of a defect using a first imaging condition and a second imaging condition; a control unit configured to correct positional information on the defect using the image captured with the first imaging unit; and a second imaging unit configured to capture an image of the defect based on the corrected positional information.

Claims (68)

1. A defect observation apparatus, comprising:

a storage device configured to store defect information about a plurality of defects detected by an external inspection apparatus;

a first imaging unit configured to capture an image of a defect among the plurality of defects using a first imaging condition and a second imaging condition, the first imaging condition being related to wide field-of-view imaging and the second imaging condition being related to narrow field-of-view imaging;

a control unit comprising a processor configured to correct positional information on the defect using the image captured with the first imaging unit; and

a second imaging unit configured to capture an image of the defect on the basis of the corrected positional information,

wherein:

the control unit processor is configured to

set one of the first imaging condition or the second imaging condition for each of the plurality of defects,

capture an image of a first-defect that is set to the first imaging condition, using the first imaging unit,

create a correction formula on the basis of a distance and a direction of the defect information on the first-defect and relative distance and direction positional information on the first-defect detected with the first imaging unit,

correct positional information on a second-defect that is set to the second imaging condition, using the correction formula,

capture an image of the second-defect using the first imaging unit on the basis of the corrected positional information on the second-defect, and

when the image captured with the first imaging unit contains a plurality of defects,

extract, from the defect information, a plurality of candidate defects that are possibly contained in the captured image,

capture a plurality of images, using said first imaging unit under said second imaging condition, each of said plurality of images being a different field of view and containing a different set of said candidate defects, and

positively identify a defect ID of each of said first-defect from among a plurality of candidate defects in the plurality of captured images on the basis of a relative relationship between each of one or more of said candidate defects and a relative coordinate relationship between corresponding ones of said plurality of defects contained in each captured image based on said positional information of said first-defect.

2. The defect observation apparatus according to claim 1 ,

wherein:

when the first-defect that is set to the first imaging condition includes a plurality of first-defects, the control unit processor is configured to continuously capture images of the plurality of first-defects using the first imaging unit, and capture an image of the second-defect using the first imaging unit after completion of imaging of the plurality of first-defects.

3. The defect observation apparatus according to claim 2 , wherein:

the control unit processor is configured to, using the correction formula created with regard to a firstly captured defect among the plurality of first-defects, correct positional information on second and following defects among the plurality of first-defects.

4. The defect observation apparatus according to claim 1 , wherein:

the control unit processor is configured to change the imaging condition for the first-defect to the second imaging condition when the image captured with the first imaging unit does not contain the first-defect.

5. The defect observation apparatus according to claim 1 , wherein

the control unit processor is configured to, when the defect ID is not identified in the captured image:

overlay a plurality of candidate imaged regions to obtain a region which is larger than and which surrounds each of the plurality of candidate imaged regions;

capture one of said plurality of candidate imaged regions having largest difference in distance and direction between each of a plurality of candidate defects in which said region which is larger than and which surrounds each of the plurality of candidate imaged regions captured with the first imaging unit; and

identify the defect ID of each defect in said captured candidate image region on the basis of the defect image of the captured candidate imaged region.

6. The defect observation apparatus according to claim 1 , wherein:

the control unit processor is configured to, when the defect ID is not identified in the captured image,

create a pseudo image of the candidate defects, and

identify the defect ID of each defect in the captured image through template matching between the pseudo image and the captured image.

7. The defect observation apparatus according to claim 1 , wherein:

the control unit processor is configured to, when the image captured with the first imaging unit contains a plurality of defects and a luminance difference between the plurality of defects is greater than a predetermined value,

set the first imaging condition on a defect with a higher luminance value of the plurality of defects, and

set the second imaging condition on a defect with a lower luminance value of the plurality of defects.

8. A defect observation apparatus, comprising:

a storage device configured to store defect information about a plurality of defects detected by an external inspection apparatus;

a first imaging unit configured to capture an image of a defect corresponding to a specified defect ID of said defect, said defect ID being associated with positional information of said defect;

a control unit comprising a processor configured to correct positional information on the defect using the image captured with the first imaging unit; and

a second imaging unit configured to capture an image of the defect on the basis of the corrected positional information,

wherein:

the control unit processor is configured to, when the image captured with the first imaging unit contains a plurality of defects,

extract, from the defect information, a plurality of candidate defects that are possibly contained in the captured image,

capture a plurality of images, using said first imaging unit, each a said plurality of images being a different field of view and containing a different set of said candidate defects,

identify, from said plurality of captured images, a defect corresponding to the defect ID from among a plurality of candidate defects in the plurality of captured images on the basis of a relative relationship between the candidate defects and a relative relationship between the plurality of defects contained in the plurality of captured images, and

correct positional information on the defect corresponding to the defect ID.

9. The defect observation apparatus according to claim 8 , wherein

the control unit processor is configured to, when the defect ID is not identified in the captured image:

overlay a plurality of candidate imaged regions to obtain a region which is larger than and which surrounds each of the plurality of candidate imaged regions;

capture one of said plurality of candidate imaged regions having largest difference in distance and direction between each of a plurality of candidate defects in which said region which is larger than and which surrounds each of the plurality of candidate imaged regions captured with the first imaging unit; and

identify the defect ID of each defect in said captured candidate image region on the basis of the defect image of the captured candidate imaged region.

10. The defect observation apparatus according to claim 8 , wherein:

the control unit processor is configured to, when the defect corresponding to the defect ID is not identified in the captured image,

create a pseudo image of the candidate defects, and

identify the defect corresponding to the defect ID through template matching between the pseudo image and the captured image.

11. The defect observation apparatus according to claim 8 , wherein:

the control unit processor is configured to, when the image captured with the first imaging unit contains a plurality of defects and a luminance difference between the plurality of defects is greater than a predetermined value,

set an imaging condition corresponding to a defect with the highest luminance value of the plurality of defects, and thereafter set an imaging condition corresponding to another defect of the plurality of defects.

12. The defect observation apparatus according to claim 8 ,

wherein:

the first imaging unit is configured to capture an image of a defect among the plurality of defects using a first imaging condition and a second imaging condition, the first imaging condition being related to wide field-of-view imaging and the second imaging condition being related to narrow field-of-view imaging, and

the control unit processor is further configured to

set one of the first imaging condition or the second imaging condition for each of the plurality of defects,

capture an image of a first-defect that is set to the first imaging condition using the first imaging unit,

create a correction formula on the basis of a distance and a direction of the defect information on the first-defect and relative distance and direction positional information on the first-defect detected with the first imaging unit,

correct positional information on a second-defect that is set to the second imaging condition using the correction formula, and

capture an image of the second-defect with the first imaging unit on the basis of the corrected positional information on the second-defect.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052225/0894 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2017
From: OTANI, YUKO; AOKI, KAZUO; MINEKAWA, YOHEI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 041065/0728 →
Priority Claims (1)
JP 2016-034706 · Feb 25, 2016 · national
Continuity (1)
Related Publication 20170249753A1 · Aug 31, 2017