Memory system topologies including a buffer device and an integrated circuit memory device
Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device. The buffer device segments and merges the data transferred between the memory controller that expects a particular memory organization and actual memory organization.
1. A memory controller, comprising:
an interface to provide a memory access command and one or more chip select signals to an external module, to select a memory die stack on the external module for access in connection with the memory access command; and
a circuit to select a particular die in the selected memory die stack, the memory controller to further transmit selection of the particular die to the external module;
such that one or more memory devices to be accessed by the memory access command are determined according to (i) the memory die stack as selected by the one or more chip select signals and (ii) information representing the selection of the particular die.
2. The memory controller of claim 1 , wherein the external module comprises multiple memory stacks, including the memory die stack, each of the memory stacks corresponding to a slice of data, and wherein the circuit is to select a memory die in each of the memory stacks in connection with each data exchange with the external module in connection with a memory transaction.
3. The memory controller of claim 1 , wherein the circuit is to select the particular die in dependence on an address conveyed by the memory access request.
4. The memory controller of claim 1 , wherein the external module comprises a serial presence detect (SPD) device, and wherein the memory controller further comprises a circuit to read information from the SPD device, the selection of the particular die by the circuit to select being dependent on the information read from the SPD device.
5. The memory controller of claim 1 , wherein the external module comprises a serial presence detect (SPD) device, wherein the particular die exchanges read and write data according to a first interface standard, wherein the memory controller comprises an interface to exchange data with the external module using a second interface standard, wherein the memory controller comprises a circuit to read information representing the first interface standard from the SPD device, and wherein the memory controller comprises a circuit to program translation information into the external module to cause the external module to convert the read and write data between the first interface standard and the second interface standard.
6. The memory controller of claim 1 , wherein the memory die stack comprises memory dies, and wherein the memory controller comprises a circuit to determine a timing difference between accesses to different ones of the memory dies, and a circuit to program information representing the timing difference into circuitry on the external module for use in exchanging data with the different ones.
7. The memory controller of claim 1 , wherein the memory controller further comprises a circuit to program information into a register on the external module, the access to the particular die being dependent on the information programmed into the register.
8. A memory controller, comprising:
an interface to receive configuration information from a serial presence detect (SPD) device disposed on an external module;
an interface to provide a memory access command and one or more chip select signals to the external module, to select a memory die stack on the external module for access in connection with the memory access command; and
a circuit to select a particular die in the selected memory die stack, the memory controller to further transmit selection of the particular die to the external module;
at least one of the one or more chip select signals and the selection of the particular die in the selected memory stack being dependent on the configuration information;
such that one or more memory devices to be accessed by the memory access command are determined according to (i) the memory die stack as selected by the one or more chip select signals and (ii) information representing the selection of the particular die.
9. The memory controller of claim 8 , wherein the external module comprises multiple memory stacks, including the memory die stack, each of the memory stacks corresponding to a slice of data, and wherein the circuit is to select a memory die in each of the memory stacks in connection with each data exchange with the external module in connection with a memory transaction.
10. The memory controller of claim 8 , wherein the circuit is to select the particular die in dependence on an address conveyed by the memory access request.
11. The memory controller of claim 8 , wherein the wherein the memory controller further comprises a circuit to read the configuration information from the SPD device pursuant to command from the memory controller.
12. The memory controller of claim 8 , wherein the particular die exchanges read and write data according to a first interface standard, wherein the memory controller comprises an interface to exchange data with the external module using a second interface standard, wherein the configuration information comprises information representing the first interface standard from the SPD device, and wherein the memory controller comprises a circuit to program translation information into the external module to cause the external module to convert the read and write data between the first interface standard and the second interface standard.
13. The memory controller of claim 8 , wherein the memory die stack comprises memory dies, and wherein the memory controller comprises a circuit to determine a timing difference between accesses to different ones of the memory dies, and a circuit to program information representing the timing difference into circuitry on the external module for use in exchanging data with the different ones.
14. The memory controller of claim 8 , wherein the memory controller further comprises a circuit to program information into a register on the external module, the access to the particular die being dependent on the information programmed into the register.
15. A memory controller, comprising:
an interface to provide a memory access command and one or more chip select signals to an external module; and
a circuit to select a particular die in the selected memory die stack, the memory controller to further transmit selection of the particular die to the external module;
wherein
the memory controller to operate in a selective one of a first mode and a second mode,
in the first mode, one or more memory devices selected for access by the memory access command are determined according to (i) selection of a memory die stack according to the one or more chip select signals and (ii) selection of a particular die in the selected die stack according to information representing the selection of the die in the die stack, and
in the second mode, the one or more memory devices selected for access by the memory access command are determined according to only the one or more chip select signals.
16. The memory controller of claim 15 , wherein the external module comprises multiple memory stacks, including the memory die stack, each of the memory stacks corresponding to a slice of data, and wherein the circuit is to select a memory die in each of the memory stacks in connection with each data exchange with the external module in connection with a memory transaction.
17. The memory controller of claim 15 , wherein the circuit is to select the particular die in dependence on an address conveyed by the memory access request.
18. The memory controller of claim 15 , wherein the external module comprises a serial presence detect (SPD) device, and wherein the memory controller further comprises a circuit to read information from the SPD device, the selection of the particular die by the circuit to select being dependent on the information read from the SPD device.
19. The memory controller of claim 15 , wherein the external module comprises a serial presence detect (SPD) device, wherein the particular die exchanges read and write data according to a first interface standard, wherein the memory controller comprises an interface to exchange data with the external module using a second interface standard, wherein the memory controller comprises a circuit to read information representing the first interface standard from the SPD device, and wherein the memory controller comprises a circuit to program translation information into the external module to cause the external module to convert the read and write data between the first interface standard and the second interface standard.
20. The memory controller of claim 15 , wherein the memory controller further comprises a circuit to program information into a register on the external module, the access to the particular die being dependent on the information programmed into the register.