MIM CAPACITOR WITH ENHANCED CAPACITANCE
A metal-insulator-metal (MIM) capacitor is disclosed. The MIM capacitor includes a substrate having a first dielectric layer thereon and a bottom electrode embedded in the first dielectric layer. The bottom electrode includes a metal plate and a three-dimensional (3D) metal structure protruding from a top surface of the metal plate. A second dielectric layer surrounds the 3D metal structure. A capacitor dielectric layer covers the 3D metal structure and the second dielectric layer. A top electrode is disposed on the capacitor dielectric layer. The top electrode has fins that interdigitate with the 3D metal structure.
1 . A metal-insulator-metal (MIM) capacitor, comprising:
a substrate having a first dielectric layer thereon;
a bottom electrode comprising a metal plate in the first dielectric layer and a three-dimensional
(3D) metal structure protruding from a top surface of the metal plate; a second dielectric layer surrounding the 3D metal structure;
a capacitor dielectric layer in direct contact with 3D metal structure and in direct contact with the second dielectric layer; and
a top electrode comprising fins on the capacitor dielectric layer, each fin interdigitating with the 3D metal structure and each fin in direct contact with the capacitor dielectric layer.
2 . The MIM capacitor according to claim 1 , wherein the metal plate is a damascened metal plate.
3 . The MIM capacitor according to claim 1 , wherein the second dielectric layer covers a peripheral region on the top surface of the metal plate.
4 . The MIM capacitor according to claim 1 , further comprising a third dielectric layer covering the top electrode and the capacitor dielectric layer.
5 . The MIM capacitor according to claim 4 , further comprising a damascened metal interconnect structure embedded in the third dielectric layer and electrically connected to the top electrode.
6 . The MIM capacitor according to claim 1 , wherein the 3D metal structure comprises a via-shaped structure, a line-shaped structure, a wave-shaped structure, a concentric structure, or an irregular-shaped structure.
7 . The MIM capacitor according to claim 1 , wherein the metal plate comprises copper.
8 . The MIM capacitor according to claim 1 , wherein the 3D metal structure comprises copper.
9 . The MIM capacitor according to claim 1 , wherein the top electrode comprises copper.
10 . The MIM capacitor according to claim 1 , further comprising a seed layer between the 3D metal structure and the metal plate.
11 . A metal-insulator-metal (MIM) capacitor, comprising:
a metal plate in a first dielectric material and a three-dimensional (3D) metal structure above the metal plate;
a second dielectric material laterally adjacent the 3D metal structure;
a capacitor dielectric material in direct contact with the 3D metal structure and with the second dielectric material; and
fins in direct contact with the capacitor dielectric material and each fin interdigitating with the 3D metal structure, an upper surface of the fins extending above an upper surface of the capacitor dielectric material.
12 . The MIM capacitor according to claim 11 , wherein the 3D metal structure comprises a crown-shaped sectional profile.
13 . The MIM capacitor according to claim 11 , further comprising a seed material between the metal plate and the 3D metal structure.
14 . The MIM capacitor according to claim 11 , wherein the metal plate and the 3D metal structure comprise a bottom electrode.
15 . The MIM capacitor according to claim 11 , wherein the fins comprise a top electrode.
16 . The MIM capacitor according to claim 11 , wherein the capacitor dielectric material comprises a high-k dielectric material.
17 . The MIM capacitor according to claim 11 , wherein the capacitor dielectric material is in direct contact with sidewalls of the 3D metal structure and with horizontal surfaces of the metal plate and the 3D metal structure.
18 . A metal-insulator-metal (MIM) capacitor, comprising:
a bottom electrode comprising a metal plate and a three-dimensional (3D) metal structure above the metal plate;
a dielectric material laterally adjacent the 3D metal structure and over the metal plate;
a capacitor dielectric material in direct contact with the 3D metal structure and in direct contact with an upper surface of the dielectric material laterally adjacent the 3D metal structure; and
fins of a top electrode in direct contact with the capacitor dielectric material and each fin interdigitating with the 3D metal structure.
19 . The MIM capacitor according to claim 18 , wherein the bottom electrode, the capacitor dielectric material, and the top electrode are in a capacitor forming region.
20 . The MIM capacitor according to claim 19 , further comprising a metal wire outside the capacitor forming region.