Printed circuit board and semiconductor package
A printed circuit board (PCB) includes an insulating layer with an upper surface and a lower surface opposite to the upper surface; a first conductive pattern on the upper surface of the insulating layer; a second conductive pattern on the lower surface of the insulating layer; an aluminum pattern that covers at least a portion of an upper surface of the first conductive pattern; and a first passivation layer that covers at least a portion of sides of the first conductive pattern and that prevents diffusion into the first conductive pattern.
1. A printed circuit board (PCB), comprising:
an insulating layer that includes an upper surface and a lower surface opposite to the upper surface;
a first conductive pattern on the upper surface of the insulating layer;
a second conductive pattern on the lower surface of the insulating layer;
a first solder resist layer with an opening on the insulating layer;
an aluminum pattern that covers an upper surface of the first conductive pattern;
a second passivation layer is disposed on and directly contacts a portion of a first surface of the second conductive pattern opposite at second surface of the second conductive pattern, wherein the second surface of the second conductive pattern directly contacts the lower surface of the insulating layer; and
first passivation layers that cover a side surface of part of the first conductive pattern exposed by the opening of the first solder resist layer,
wherein spaces are formed between each of the first passivation layers.
2. The PCB of claim 1 , wherein the upper surface of the first conductive pattern is higher than the upper surface of the insulating layer.
3. The PCB of claim 1 , wherein the first passivation layers comprises a material formed through an organic solderability preservative (OSP) surface treatment.
4. The PCB of claim 1 , further comprising a second solder resist layer on the lower surface of the insulating layer,
wherein the second solder resist layer covers sides of the second conductive pattern.
5. The PCB of claim 1 , further comprising:
a barrier pattern between the first conductive pattern and the aluminum pattern.