LED lighting assemblies with thermal overmolding
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
1. A method of manufacturing a lighting assembly, the method comprising:
attaching one or more light emitting diode diodes (LEDs) to a printed circuit board, the attached one or more LEDs being connectable with a power source via circuitry of the printed circuit board; and
reflowing a thermoplastic over at least portions of the printed circuit board proximate to the one or more LEDs, the thermoplastic having a melting temperature greater than about 100° C. and having a thermal conductivity greater than or about 1 W/m·K.
2. The method as set forth in claim 1 , wherein the reflowing comprises:
insert injection molding the thermoplastic over at least portions of the printed circuit board proximate to the one or more LEDs.
3. The method as set forth in claim 2 , wherein the insert injection molding comprises:
heating a thermoplastic material without a concomitant chemical reaction to generate melted thermoplastic material.
4. The method as set forth in claim 1 , wherein the thermoplastic has a thermal conductivity greater than or about 10 W/m·K.
5. The method as set forth in claim 1 , wherein the attaching and the reflowing produces the light assembly comprising the one or more LEDs attached to the printed circuit board with a free standing high thermal conductivity material overmolding comprising the thermoplastic reflowed over at least portions of the printed circuit board proximate to the one or more LEDs.