Self-aligned contact process enabled by low temperature
View Patent ↗Self-aligned contacts of a semiconductor device are fabricated by forming a metal gate structure on a portion of a semiconductor layer of a substrate. The metal gate structure contacts inner sidewalls of a gate spacer. A second sacrificial epitaxial layer is formed on a first sacrificial epitaxial layer. The first sacrificial epitaxial layer is adjacent to the gate spacer and is formed on source/drain regions of the semiconductor layer. The first and second sacrificial epitaxial layers are recessed. The recessing exposes at least a portion of the source/drain regions. A first dielectric layer is formed on the exposed portions of the source/drain regions, and over the gate spacer and metal gate structure. At least one cavity within the first dielectric layer is formed above at least one of the exposed portions of source/drain regions. At least one metal contact is formed within the at least one cavity.
1. An integrated circuit comprising:
at least one semiconductor device, the at least one semiconductor device comprising:
a substrate;
a semiconductor layer formed on the substrate;
a metal gate structure formed on a portion of the semiconductor layer, wherein a top surface of the semiconductor layer extends higher than a bottom surface of the metal gate structure;
a gate spacer formed on the metal gate structure;
a first epitaxial layer formed on and in contact with source/drain regions of the semiconductor layer and adjacent to the gate spacer, wherein a bottom surface of the first epitaxial layer is laterally above a bottom surface of the metal gate structure;
a second epitaxial layer formed on a top surface of the first epitaxial layer;
a dielectric layer formed between and in contact with a first inner sidewall of the second epitaxial layer and a second inner sidewall of the second epitaxial layer, wherein the dielectric layer is further formed above and in contact with the metal gate structure; and
at least one self-aligned metal contact formed on at least one of the source/drain regions.
2. The integrated circuit of claim 1 , wherein the at least one metal contact is in contact with at least a sidewall and a portion of a top surface of the dielectric layer.
3. The integrated circuit of claim 1 , wherein the at least one semiconductor further comprises:
an additional dielectric layer formed on a top surface of the second epitaxial layer.
4. The integrated circuit of claim 3 , wherein the at least one metal contact is in contact with at least a sidewall of the additional dielectric layer.
5. The integrated circuit of claim 1 , wherein the at least one semiconductor further comprises:
an additional dielectric layer formed between and in contact with an inner sidewall of the first epitaxial layer and an outer sidewall of the gate spacer.
6. The integrated circuit of claim 1 , wherein the at least one semiconductor further comprises:
a silicide area formed on and in contact with at least a portion of the at least one of the source/drain regions.
7. The integrated circuit of claim 6 , wherein the at least one self-aligned metal contact is formed on and in contact with the silicide area.
8. A semiconductor device comprising:
at least one semiconductor device, the at least one semiconductor device comprising:
a substrate;
a semiconductor layer formed on the substrate, the semiconductor layer comprising source/drain regions;
a metal gate structure formed on a portion of the semiconductor layer, wherein a top surface of the semiconductor layer extends higher than a bottom surface of the metal gate structure;
a gate spacer formed on the metal gate structure;
a first dielectric layer formed in contact with a top surface of the metal gate structure;
a second dielectric layer situated under and in contact with the first dielectric layer, wherein the second dielectric layer further contacts with an outer sidewall of the gate spacer; and
at least one self-aligned metal contact formed on at least one of the source/drain regions.
9. The semiconductor device of claim 8 , wherein the at least one metal contact is in contact with at least a sidewall and a portion of a top surface of the first dielectric layer.
10. The integrated circuit of claim 9 , wherein the at least one metal contact is further in contact with at least a sidewall of the second dielectric layer.
11. The integrated circuit of claim 9 , wherein the at least one metal contact is further in contact with at least a sidewall of the second dielectric layer.
12. The semiconductor device of claim 8 , wherein the at least one semiconductor further comprises:
a third dielectric layer formed on and in contact with at least a portion of the source/drain regions.
13. The semiconductor device of claim 12 , wherein at least a portion of the third dielectric layer contacts a sidewall of the at least one self-aligned metal contact.
14. The semiconductor device of claim 12 , wherein at least a portion of the third dielectric layer contacts at least a portion of a top surface of the first dielectric layer.
15. The semiconductor device of claim 14 , wherein at least a portion of the third dielectric layer contacts at least a sidewall of the second dielectric layer.
16. The semiconductor device of claim 8 , wherein the at least one semiconductor further comprises:
a silicide area formed on and in contact with at least a portion of the at least one of the source/drain regions.
17. The semiconductor device of claim 16 , wherein the at least one self-aligned metal contact is formed on and in contact with the silicide area.
18. An integrated circuit comprising:
at least one semiconductor device, the at least one semiconductor device comprising:
a substrate;
a semiconductor layer formed on the substrate, the semiconductor layer comprising source/drain regions;
a metal gate structure formed on a portion of the semiconductor layer, wherein a top surface of the semiconductor layer extends higher than a bottom surface of the metal gate structure;
a gate spacer formed on the metal gate structure;
a first dielectric layer formed in contact with a top surface of the metal gate structure;
a second dielectric layer situated under and in contact with the first dielectric layer, wherein the second dielectric layer further contacts with an outer sidewall of the gate spacer; and
at least one self-aligned metal contact formed on at least one of the source/drain regions.
19. The integrated circuit of claim 18 , wherein the at least one metal contact is in contact with at least a sidewall and a portion of a top surface of the first dielectric layer.
20. The integrated circuit of claim 18 , wherein the at least one semiconductor further comprises:
a third dielectric layer formed on and in contact with at least a portion of the source/drain regions.