Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
View Patent ↗A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second microelectronic die is attached to the first die on one side, and to a second substrate on the other side. Electrical connections are made between the first die and the first substrate, between the second die and the second substrate, and between the first and second substrates, e.g., via wire bonding. The electrical connecting elements are advantageously encased in a molding compound. Exposed contacts on the first and/or second substrates, not covered by the molding compound, provide for electrical connections between the package, and another package stacked onto the package. The package may avoid coplanarity factors, can be manufactured using existing equipment, allows for intermediate testing, and can also offer a thinner package height.
1. A stackable multi-electronic die package, comprising:
a first die on a first substrate;
a second substrate on a second die;
a spacer between the first and second dies;
a first adhesive attaching the first die to the spacer;
a second adhesive attaching the second die to the spacer;
a first set of wires connecting the first die to the first substrate; and
a second set of wires connecting the second substrate to the first substrate.
2. The stackable multi-electronic die package of claim 1 further comprising a third set of wires connecting the second die to the second substrate via an opening in the second substrate.
3. The stackable multi-electronic die package of claim 1 wherein the first die and first substrate comprise a chip-on-board package construction and the second die and the second substrate comprise a board-on-chip package construction.
4. The stackable multi-electronic die package of claim 1 with the first substrate larger than the second substrate.
5. The stackable multi-electronic die package of claim 1 , wherein the spacer comprises an epoxy pad.