Memory arrays, and methods of forming memory arrays

1. A memory array, comprising:

a vertical stack of alternating insulative levels and wordline levels, the wordline levels having terminal ends corresponding to control gate regions, the wordline levels having first regions and having second regions laterally adjacent the first regions, the second regions being more proximate the terminal ends than the first regions; the first regions being vertically thicker than the second regions; the second regions comprising the terminal ends;

charge-trapping material along the control gate regions of the wordline levels and not along the insulative levels; the charge-trapping material being spaced from the control gate regions by charge-blocking material; and

channel material extending vertically along the stack and being laterally spaced from the charge-trapping material by dielectric material.

2. The memory array of claim 1 wherein the charge-blocking material comprises high-k dielectric material; wherein said high-k dielectric material is along top and bottom surfaces of the second regions of the wordline levels, and along the terminal ends; wherein the high-k dielectric material is not along the first regions of the wordline levels; and wherein the first regions of the wordline levels are thicker than the second regions of the wordline levels by about double a thickness of the high-k dielectric material.

3. A memory array, comprising:

a vertical stack of alternating insulative levels and wordline levels, the wordline levels having terminal ends corresponding to control gate regions, the wordline levels having first regions, and having second regions laterally adjacent the first regions, the second regions being more proximate the terminal ends than the first regions; the first regions being vertically thicker than the second regions; the second regions comprising the terminal ends;

a linear arrangement of charge-trapping material extending vertically along the stack; the linear arrangement of the charge-trapping material comprising vertically alternating segments of the charge-trapping material and segments of spacing material; the segments of charge-trapping material being along the wordline levels; and

channel material extending vertically along the stack and being laterally spaced from the segments of the charge-trapping material by dielectric material.

4. The memory array of claim 3 wherein high-k dielectric material is along top and bottom surfaces of the second regions of the wordline levels, and along the terminal ends; wherein the high-k dielectric material is not along the first regions of the wordline levels; and wherein the first regions of the wordline levels are thicker than the second regions of the wordline levels by about double a thickness of the high-k dielectric material.

5. A NAND memory array, comprising:

a vertical stack of alternating insulative levels and wordline levels, the wordline levels having terminal ends corresponding to control gate regions;

charge-trapping material along the control gate regions of the wordline levels, and spaced from the control gate regions by charge-blocking material; the charge-trapping material being configured as segments, with each of the wordline levels being adjacent one of the segments of the charge-trapping material; the segments of the charge-trapping material being arranged one atop another and being vertically spaced from one another by intervening gaps;

the wordline levels having first regions and second regions laterally adjacent the first regions, the second regions being more proximate the terminal ends than the first regions; the first regions being vertically thicker than the second regions; the second regions comprising the terminal ends; and

channel material extending vertically along the stack and being laterally spaced from the charge-trapping material by charge-tunneling material.

6. The NAND memory array of claim 5 wherein regions of the charge-tunneling material extend into the gaps between the vertically-spaced segments of the charge-trapping material.

7. The NAND memory array of claim 6 wherein the charge-tunneling material comprises nitrogen-containing material laterally sandwiched between two oxides.

8. The NAND memory array of claim 6 wherein the charge-tunneling material comprises silicon dioxide.

9. The NAND memory array of claim 5 wherein the charge-trapping material comprises one or more of silicon nitride, silicon oxynitride and ruthenium oxide.

10. The NAND memory array of claim 5 wherein the charge-trapping material consists of silicon nitride.

11. The NAND memory array of claim 5 wherein the charge-blocking material includes high-k dielectric material; wherein the high-k dielectric material is along top and bottom surfaces of the second regions of the wordline levels, and along the terminal ends; wherein the high-k dielectric material is not along the first regions of the wordline levels; and wherein the first regions of the wordline levels are thicker than the second regions of the wordline levels by about double a thickness of the high-k dielectric material.

12. The NAND memory array of claim 11 wherein the high-k dielectric material comprises one or more of aluminum oxide, hafnium oxide, zirconium oxide and tantalum oxide.

13. A method of forming a NAND memory array, comprising:

forming a vertical stack of alternating first and second levels; the first levels comprising first material, and the second levels comprising second material; the first and second levels having exposed surfaces along an opening extending through the first and second levels;

selectively forming charge-trapping material along the exposed surfaces of the second levels relative to the exposed surfaces of the first levels;

forming charge-tunneling material extending vertically along the first and second levels, and spaced from the second levels by the charge-trapping material;

forming channel material extending vertically along the charge-tunneling material;

removing the second material to leave voids;

forming high-k dielectric material within the voids to line the voids;

recessing the high-k dielectric material within the voids so that first segments of the voids are not lined with the high-k dielectric material while second segments of the voids remain lined with the high-k dielectric material; and

forming conductive levels within the voids; the conductive levels being wordline levels of the NAND memory array and having terminal ends corresponding to control gate regions, the conductive levels formed within the voids having first regions within the first segments and second regions within the second segments, the first regions being vertically thicker than the second regions.

14. A method of forming a NAND memory array, comprising:

forming a vertical stack of alternating first and second levels; the first levels comprising silicon dioxide, and the second levels comprising silicon;

the first and second levels having exposed surfaces along an opening extending through the first and second levels;

treating the exposed surfaces of the second levels with one or more of hydrogen, ammonia and fluorine;

selectively forming charge-trapping material along the treated surfaces of the second levels relative to the exposed surfaces of the first levels;

forming charge-tunneling material extending vertically along the first and second levels, and spaced from the second levels by the charge-trapping material;

forming channel material extending vertically along the charge-tunneling material;

removing the silicon of the second levels to leave voids; and

forming metal-containing conductive levels within the voids; the metal-containing conductive levels being wordline levels of the NAND memory array and having terminal ends corresponding to control gate regions, the metal-containing conductive levels having first regions and second regions, the first regions being vertically thicker than the second regions.

15. The method of claim 14 wherein the charge-trapping material comprises one or more of silicon nitride, silicon oxynitride and ruthenium oxide.

16. The method of claim 14 comprising forming high-k dielectric material within the voids to line the voids prior to forming the metal-containing conductive levels within the voids.

17. The method of claim 16 comprising recessing the high-k dielectric material within the voids so that first segments of the voids are not lined with the high-k dielectric material while second segments of the voids remain lined with the high-k dielectric material; and wherein the first regions of metal-containing conductive levels are formed within the first segments and the second regions of metal-containing conductive levels are formed within the second segments.